Patents by Inventor Cheng-Ta Tseng

Cheng-Ta Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11991824
    Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.
    Type: Grant
    Filed: September 26, 2021
    Date of Patent: May 21, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Tzyy-Jang Tseng, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Shao-Chien Lee, Ming-Ru Chen, Cheng-Chung Lo
  • Patent number: 11943877
    Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: March 26, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Wen-Yu Lin, Kai-Ming Yang, Chen-Hao Lin, Pu-Ju Lin, Cheng-Ta Ko, Chin-Sheng Wang, Guang-Hwa Ma, Tzyy-Jang Tseng
  • Patent number: 9926966
    Abstract: A reusable hanging device includes: an adhesion layer, a plate layer, and a hook body. Wherein, the adhesion layer is a low stickiness soft plastic made of a thermoplastic elastomer composite material, and it is vacuum-absorbed onto a smooth surface of a wall or a smooth surface of a wall having tiny bumps, by means of the super strong friction force produced on the smooth surface of a wall by the atmospheric pressure. The plate layer is made of hard material, formed integrally on a surface of the adhesion layer. And the hook body is also made of hard material, formed integrally on a surface of the plated layer. In application, the adhesion layer is absorbed onto a smooth surface of a wall by vacuum, the super strong friction force thus produced enables the hook body to hang object of 0˜112.6 kgf.
    Type: Grant
    Filed: November 26, 2015
    Date of Patent: March 27, 2018
    Inventors: Cheng-Ta Tseng, Tso-Hua Yeh
  • Publication number: 20170152988
    Abstract: A reusable hanging device includes: an adhesion layer, a plate layer, and a hook body. Wherein, the adhesion layer is a low stickiness soft plastic made of a thermoplastic elastomer composite material, and it is vacuum-absorbed onto a smooth surface of a wall or a smooth surface of a wall having tiny bumps, by means of the super strong friction force produced on the smooth surface of a wall by the atmospheric pressure. The plate layer is made of hard material, formed integrally on a surface of the adhesion layer. And the hook body is also made of hard material, formed integrally on a surface of the plated layer. In application, the adhesion layer is absorbed onto a smooth surface of a wall by vacuum, the super strong friction force thus produced enables the hook body to hang object of 0˜112.6 kgf.
    Type: Application
    Filed: November 26, 2015
    Publication date: June 1, 2017
    Inventors: Cheng-Ta Tseng, Tso-Hua Yeh