Abstract: A semiconductor structure includes an interconnect structure, a passivation structure, a first capacitor, and a contact feature. The interconnect structure is disposed over a semiconductor substrate. The passivation structure is disposed over the interconnect structure. The first capacitor is disposed within the passivation structure. The contact feature is disposed over the passivation structure, wherein the first capacitor is proximal to a corner of the contact feature. A method of manufacturing the semiconductor structure is also provided.

Abstract: An assembling heat dissipating lighting device comprises a lamp socket means and a heat dissipating lighting means. The lamp socket means includes an installing space and an installing hole communicated with the installing space. A periphery of the installing hole is formed with an inserting portion and an engaging portion. The heat dissipating lighting means includes a LED lighting member and a heat dissipating member thermally connected with the LED lighting member, and an outer ring surface of the LED lighting member has an engaging element and a fastening portion. The heat dissipating lighting means is fixed to the lamp socket means by way of engaging the engaging element into the installing space and correspondingly engaging the fastening portion with the engaging portion by way of rotating the heat dissipating lighting means. Thus, the convenience of disassembly and fixation of the assembling heat dissipating lighting device is increased.

Abstract: An assembling heat dissipating lighting device comprises a lamp socket means and a heat dissipating lighting means. The lamp socket means includes an installing space and an installing hole communicated with the installing space. A periphery of the installing hole is formed with an inserting portion and an engaging portion. The heat dissipating lighting means includes a LED lighting member and a heat dissipating member thermally connected with the LED lighting member, and an outer ring surface of the LED lighting member has an engaging element and a fastening portion. The heat dissipating lighting means is fixed to the lamp socket means by way of engaging the engaging element into the installing space and correspondingly engaging the fastening portion with the engaging portion by way of rotating the heat dissipating lighting means. Thus, the convenience of disassembly and fixation of the assembling heat dissipating lighting device is increased.

Abstract: A planar light source device includes: a substrate having a thickness larger than 0.9 mm and including a metal layer; and a plurality of light-emitting diode chips disposed on the substrate in a matrix array. Each light-emitting diode chip has a chip size ranging from 0.0784 mm2 to 0.25 mm2. Two adjacent ones of the light-emitting diode chips are spaced apart from each other by a distance of at least two times a length of the light-emitting diode chips.

Abstract: The invention provides a method for fabricating wick microstructures in heat pipes, comprising the following steps: providing a flat plate and a mold with several molding holes; filling a dry powder material in the several molding holes and putting the mold to cover the flat plate so as to form an object to be sintered; sintering the object; and removing the mold to form a flat plate with wick microstructures. The wick microstructures are arranged on the flat plate in a form of microgrooves, microcylinders or any combination of them. The flat plate with wick microstructures is further processed to form a heat pipe with a characteristic shape and having two kinds of wick microstructures such that the heat transferred by the heat pipe is increased and the occurrence of dry out of the heat pipe is delayed.

Abstract: A planar light source device includes: a substrate having a thickness larger than 0.9 mm and including a metal layer; and a plurality of light-emitting diode chips disposed on the substrate in a matrix array. Each light-emitting diode chip has a chip size ranging from 0.0784 mm2 to 0.25 mm2. Two adjacent ones of the light-emitting diode chips are spaced apart from each other by a distance of at least two times a length of the light-emitting diode chips.

Abstract: The invention provides a method for fabricating wick microstructures in heat pipes, comprising the following steps: providing a flat plate and a mold with several molding holes; filling a powder material in the several molding holes and putting the mold to cover the flat plate so as to form an object to be sintered; sintering the object; and removing the mold to form a flat plate with wick microstructures. The wick microstructures are arranged on the flat plate in a form of microgrooves, microcylinders or any combination of them. The flat plate with wick microstructures is further processed to form a heat pipe with a characteristic shape and having two kinds of wick microstructures such that the heat transferred by the heat pipe is increased and the occurrence of dry out of the heat pipe is delayed.