Abstract: In an embodiment, a semiconductor package is disclosed that includes a conductive material disposed in electrical contact with a semiconductor die, a protective mold structure disposed on the semiconductor die and a dielectric layer disposed on the semiconductor die and between the protective mold structure and the conductive material.

Abstract: A method includes molding a device die in a molding material, wherein a metal pillar of the device die is exposed through a surface of the molding material. A substrate is adhered to the molding material. The substrate includes a redistribution layer that further includes redistribution lines. A plating is performed to fill a through-opening in the substrate to form a through-via. The through-via is plated on the metal pillar of the device die. An electrical connector is formed to electrically couple to the through-via.

Abstract: A method of forming a wafer level chip scale package interconnect may include: forming a post-passivation interconnect (PPI) layer over a substrate; forming an interconnect over the PPI layer; and releasing a molding compound material over the substrate, the molding compound material flowing to laterally encapsulate a portion of the interconnect.

Abstract: A method includes molding a device die in a molding material, wherein a metal pillar of the device die is exposed through a surface of the molding material. A substrate is adhered to the molding material. The substrate includes a redistribution layer that further includes redistribution lines. A plating is performed to fill a through-opening in the substrate to form a through-via. The through-via is plated on the metal pillar of the device die. An electrical connector is formed to electrically couple to the through-via.

Abstract: A method of forming a wafer level chip scale package interconnect may include: forming a post-passivation interconnect (PPI) layer over a substrate; forming an interconnect over the PPI layer; and releasing a molding compound material over the substrate, the molding compound material flowing to laterally encapsulate a portion of the interconnect.

Abstract: A method includes molding a device die in a molding material, wherein a metal pillar of the device die is exposed through a surface of the molding material. A substrate is adhered to the molding material. The substrate includes a redistribution layer that further includes redistribution lines. A plating is performed to fill a through-opening in the substrate to form a through-via. The through-via is plated on the metal pillar of the device die. An electrical connector is formed to electrically couple to the through-via.

Abstract: A method includes molding a device die in a molding material, wherein a metal pillar of the device die is exposed through a surface of the molding material. A substrate is adhered to the molding material. The substrate includes a redistribution layer that further includes redistribution lines. A plating is performed to fill a through-opening in the substrate to form a through-via. The through-via is plated on the metal pillar of the device die. An electrical connector is formed to electrically couple to the through-via.

Abstract: A biocidal polymer including at least one repeating unit of formula (A): wherein: R1 in each occurrence independently represents a divalent aromatic group containing 6 to 30 carbon atoms, a C2-C16 alkylene group or an alkylene biscyclohexyl; Y in each occurrence independently represents an oxygen atom or a sulfur atom; and Z1, Z2, Z3 and Z4 in each occurrence independently represent a hydrogen atom or a halogen atom; wherein at least one of Z1, Z2, Z3 and Z4 in the at least one repeating unit of formula (A) is a halogen atom.

Abstract: A platelet adhesion-resistant material is provided, which includes polytriuret-urethane consisting essentially of repeating structural units of formulae (I) to (III) in a random order, in which when the total number of the three repeating structural units in the polytriuret-urethane is 100, the number of the repeating structural units (I) is about 5 to about 50: in which each R independently represents a C2-C16 alkylene group, a C6-C30 aromatic group, a C6-C30 alicyclic group; n is an integer of 2 to 16; and R1 represents —(OCmH2m)p, in which m is an integer of 2 to 5, and p is an integer of 3 to 150.

Abstract: Disclosed herein is a biocidal polymer including at least one repeating unit of formula (A): wherein: R1 in each occurrence independently represents a divalent aromatic group containing 6 to 30 carbon atoms, a C2-C16 alkylene group or an alkylene biscyclohexyl; Y in each occurrence independently represents an oxygen atom or a sulfur atom; and Z1, Z2, Z3 and Z4 in each occurrence independently represent a hydrogen atom or a halogen atom; wherein at least one of Z1, Z2, Z3 and Z4 in the at least one repeating unit of formula (A) is a halogen atom. The preparation process and applications of the biocidal polymer are also disclosed.