Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer and a second fluoropolymer. The first fluoropolymer has a first volume and a first melt flow index, and the second fluoropolymer has a second volume and a second melt flow index. The second melt flow index ranges from 0.4 g/10 min to 0.7 g/10 min and is lower than the first melt flow index, and a volume ratio by dividing the second volume by the first volume ranges from 0.4 to 0.6.

Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer and a second fluoropolymer. The weight average molecular weight of the second fluoropolymer ranges from 630000 g/mol to 1100000 g/mol. The conductive filler is dispersed in the polymer matrix, thereby forming an electrically conductive path in the heat-sensitive layer.

Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer and a second fluoropolymer. The first fluoropolymer includes a first melting point, and the second fluoropolymer has a second melting point lower than the first melting point. The difference between the first melting point and the second melting point is smaller than 14° C. The second fluoropolymer has a second melt flow index ranging from 0.4 g/10 min to 0.7 g/10 min.

Abstract: An integrated circuit (IC) including a plurality of finfet cells designed with digital circuit design rules to provide smaller finfet cells with decreased cell heights, and analog circuit cell structures including first finfet cells of the plurality of finfet cells and including at least one cut metal layer. The smaller finfet cells with decreased cell heights provide a first shorter metal track in one direction and the at least one cut metal layer provides a second shorter metal track in another direction to increase maximum electromigration currents in the integrated circuit.

Abstract: This disclosure provides systems, methods, and devices for wireless communication that support transmission of power limit indications for a UE associated with different frequency bands. In a first aspect, a method of wireless communication includes detecting a first trigger condition for transmission of at least a first indication of a first transmission power limit of the UE and a second indication of a second transmission power limit of the UE, wherein the first transmission power limit is associated with a first frequency band supported by the UE and the second transmission power limit is associated with a second frequency band supported by the UE and transmitting, to a first network node associated with the first frequency band, the first indication and the second indication in accordance with detection of the first trigger condition. Other aspects and features are also claimed and described.

Abstract: A frame structure includes a back frame and a fixing frame combined on the back frame. The fixing frame includes multiple buffering zones, and each of the buffering zones has an upper extension and a lower extension. The upper extension and the lower extension are spaced apart from each other along a first axis without contacting each other and extending toward each other along a second axis. The first axis is not parallel to the second axis. The deformation of the fixing frame can be absorbed when it expands by utilizing the design that the upper extension and lower extension of each buffering zone without contacting with each other. It can avoid the possibility of the fixing frame warping or falling off from the back frame due to thermal expansion, thereby prolonging the service life of the frame structure. The present invention also provides a backlight module and a display device including the frame structure.

Abstract: A frame assembly has a front side, a back side, at least one first assembly and a second assembly. The first assembly has multiple assembling portions disposed at spaced intervals. The second assembly has multiple engaging portions disposed at spaced intervals, and each one of the multiple engaging portions has two engaging surfaces disposed at a spaced interval, a bottom surface connected with the two engaging surfaces, and an opening opposed to the bottom surface and located on an outer edge of the second assembly. A width between the two engaging surfaces near the opening is smaller than a width near the bottom surface. Locations of the multiple engaging portions correspond to locations of the assembling portions, and multiple assembling portions and the multiple engaging portions are capable of being engaged together. A backlight module and a display device are also provided.

Abstract: A backlight module comprises an outer frame unit, a light guide plate arranged in the outer frame unit, a light-emitting unit, a plurality of adhesives for fixing the light-emitting unit on the light guide plate, and a plurality of abutting structures. The light-emitting unit includes a flexible circuit board and a plurality of light-emitting elements arranged on the flexible circuit board at intervals. Part of the flexible circuit board is deformed at a specific position by the abutting structures, and the position of the light-emitting elements relative to the light guide plate can be adjusted. Thereby, the light-emitting elements can be aligned with the light incident surface of the light guide plate, prevent light from leaking from the light emitting surface of the light guide plate close to the light-emitting elements, and reduce the generation of bright lines and improving the overall uniformity. The present invention also provides a display device including the backlight module.

Abstract: The frame assembly has a first direction and comprises a first frame, which has at least one exhausting passage, an adhesive layer, which has at least one through hole, and a second frame, which is connected to the first frame via the adhesive layer. A containing space is defined by the first frame and the second frame together and extends along the first direction. The exhausting passage fluidly communicates with the containing space and the external environment. The adhesive layer is disposed inside the containing space to divide the containing space into two venting passages that fluidly communicate with each other through the through hole. Residue air in the containing space is evacuated through the exhausting passage, increasing an adhered area and adhesion completeness of the adhesive layer, thereby increasing an adhesion-bonding strength of the two frames and structural stability of the frame assembly.

Abstract: The frame assembly has a first direction and comprises a first frame, which has at least one exhausting passage, an adhesive layer, which has at least one through hole, and a second frame, which is connected to the first frame via the adhesive layer. A containing space is defined by the first frame and the second frame together and extends along the first direction. The exhausting passage fluidly communicates with the containing space and the external environment. The adhesive layer is disposed inside the containing space to divide the containing space into two venting passages that fluidly communicate with each other through the through hole. Residue air in the containing space is evacuated through the exhausting passage, increasing an adhered area and adhesion completeness of the adhesive layer, thereby increasing an adhesion-bonding strength of the two frames and structural stability of the frame assembly.

Abstract: The frame assembly has a first direction and comprises a first frame, which has at least one exhausting passage, an adhesive layer, which has at least one through hole, and a second frame, which is connected to the first frame via the adhesive layer. A containing space is defined by the first frame and the second frame together and extends along the first direction. The exhausting passage fluidly communicates with the containing space and the external environment. The adhesive layer is disposed inside the containing space to divide the containing space into two venting passages that fluidly communicate with each other through the through hole. Residue air in the containing space is evacuated through the exhausting passage, increasing an adhered area and adhesion completeness of the adhesive layer, thereby increasing an adhesion-bonding strength of the two frames and structural stability of the frame assembly.

Abstract: A backlight module comprises an outer frame unit, a light guide plate arranged in the outer frame unit, a light-emitting unit, a plurality of adhesives for fixing the light-emitting unit on the light guide plate, and a plurality of abutting structures. The light-emitting unit includes a flexible circuit board and a plurality of light-emitting elements arranged on the flexible circuit board at intervals. Part of the flexible circuit board is deformed at a specific position by the abutting structures, and the position of the light-emitting elements relative to the light guide plate can be adjusted. Thereby, the light-emitting elements can be aligned with the light incident surface of the light guide plate, prevent light from leaking from the light emitting surface of the light guide plate close to the light-emitting elements, and reduce the generation of bright lines and improving the overall uniformity. The present invention also provides a display device including the backlight module.

Abstract: A backlight module comprises a back plate, a reflective sheet arranged on the back plate and forming a plurality of openings, a plurality of light-emitting elements located in the plurality of openings, at least one optical element arranged on the reflective sheet, and at least a supporting element configured between the back plate and the reflective sheet. The supporting element can move along with the reflective sheet. The supporting element has a base portion and a supporting portion extending from the base portion towards the optical element. The base portion of the supporting element is located between the back plate and the reflective sheet. The supporting portion of the supporting element passes through the reflective sheet to support the optical element. The supporting element is not a fixed design and can move along with the reflective sheet.

Abstract: A backlight module comprises a back plate, a reflective sheet arranged on the back plate and forming a plurality of openings, a plurality of light-emitting elements located in the plurality of openings, at least one optical element arranged on the reflective sheet, and at least a supporting element configured between the back plate and the reflective sheet. The supporting element can move along with the reflective sheet. The supporting element has a base portion and a supporting portion extending from the base portion towards the optical element. The base portion of the supporting element is located between the back plate and the reflective sheet. The supporting portion of the supporting element passes through the reflective sheet to support the optical element. The supporting element is not a fixed design and can move along with the reflective sheet.

Abstract: A frame assembly has a front side, a back side, at least one first assembly and a second assembly. The first assembly has multiple assembling portions disposed at spaced intervals. The second assembly has multiple engaging portions disposed at spaced intervals, and each one of the multiple engaging portions has two engaging surfaces disposed at a spaced interval, a bottom surface connected with the two engaging surfaces, and an opening opposed to the bottom surface and located on an outer edge of the second assembly. A width between the two engaging surfaces near the opening is smaller than a width near the bottom surface. Locations of the multiple engaging portions correspond to locations of the assembling portions, and multiple assembling portions and the multiple engaging portions are capable of being engaged together. A backlight module and a display device are also provided.

Abstract: A method comprises identifying a semiconductor device layout region comprising a first n-type metal oxide semiconductor (MOS) device having a first pair of face-to-face diodes adjacent to a second n-type MOS device having a second pair of face-to-face diodes and adding a dummy device between a first body contact of the first n-type MOS device and a second body contact of the second MOS device.

Abstract: A frame device includes a first frame, a plurality of fasteners and an second frame. The first frame includes a base wall and a side wall extending transversely from one end of the base wall. The fasteners are disposed on the side wall opposite to the base wall. The second frame is assembled to and covers an upper end of the first frame and has a plurality of spaced-apart positioning holes. A portion of each fastener passes out of a respective positioning hole and presses against the second frame when the second frame is assembled to the first frame.

Abstract: A method comprises identifying a semiconductor device layout region comprising a first n-type metal oxide semiconductor (MOS) device having a first pair of face-to-face diodes adjacent to a second n-type MOS device having a second pair of face-to-face diodes and adding a dummy device between a first body contact of the first n-type MOS device and a second body contact of the second MOS device.

Abstract: A frame device includes a first frame, a plurality of fasteners and an second frame. The first frame includes a base wall and a side wall extending transversely from one end of the base wall. The fasteners are disposed on the side wall opposite to the base wall. The second frame is assembled to and covers an upper end of the first frame and has a plurality of spaced-apart positioning holes. A portion of each fastener passes out of a respective positioning hole and presses against the second frame when the second frame is assembled to the first frame.

Abstract: A method comprises identifying a semiconductor device layout region comprising a first n-type metal oxide semiconductor (MOS) device having a first pair of face-to-face diodes adjacent to a second n-type MOS device having a second pair of face-to-face diodes and adding a dummy device between a first body contact of the first n-type MOS device and a second body contact of the second MOS device.