Abstract: A document providing system includes a server and an electronic device. The server provides a first document that the electronic device requests. The electronic device includes a communication unit, a display panel and a processing unit. The processing unit is electrically coupled to the communication unit and the display panel. The communication unit communicates with the server. The display panel includes a memory which stores a unique identification code, and the unique identification code records a first panel information related the display panel. The processing unit transmits the unique identification code to the server when the electronic device requests the first document from the server. The server then converts the first document into a second document suitable to be displayed by the display panel according to the first panel information, and transmits the second document to the electronic device.

Abstract: The invention discloses an image processing apparatus and an image processing method. A server can transmit a first image and a second image. In an embodiment, the apparatus includes a receiving/transmitting unit, a processing unit and a display unit. The receiving/transmitting unit can communicate with the server to receive the first image and the second image. The processing unit is coupled to the receiving/transmitting unit and the display unit. The processing unit is for selectively recompressing the first image at a first compression ratio and then controlling the display unit to display the first image. In addition, the processing unit transmits the selected first compression ratio to the server such that the server compresses the second image at the first compression ratio and transmits it to the receiving/transmitting unit.

Abstract: The optical image stabilizer includes a substrate, a carrier movably disposed above the substrate for carrying an image sensor, an anchor fixed above the substrate, a conducting pad fixed above the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed above the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro-actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.

Abstract: An image capturing device includes a base formed with a first receiving space defined by a bottom wall and a first surrounding wall, and a second receiving space defined by a top side of the first surrounding wall and a second surrounding wall. A lens module is mounted on the base for generating an optical image of an object. An auto-focusing module is disposed in the second receiving space for auto-focusing the optical image based on an external voltage. A sensing module is mounted in the first receiving space and on the bottom wall of the base, is disposed under the auto-focusing module, and is spaced apart from the lens module at a predetermined distance for sensing the optical image focused by the auto-focusing module so as to generate an electrical output corresponding to the optical image.

Abstract: A micro-optical image stabilizer is disclosed. The optical image stabilizer includes a substrate, a carrier movably disposed on the substrate for carrying an image sensor, an anchor fixed on the substrate, a conducting pad fixed on the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed on the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.

Abstract: The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250?; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.

Abstract: A control system for controlling actions performed by a machine includes a sensor module for sensing environmental condition around the machine, an estimation unit for estimating the environmental condition detected by the sensor, a motor for controlling movement of the machine, a control unit for calculating a magnitude of motion according to the estimated environmental condition, the magnitude of motion used for controlling the movement of the machine, and a motor drive circuit for driving the motor to move the machine using the calculated magnitude of motion.

Abstract: A method for making camera modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming a substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A camera module made by the method is also disclosed.

Abstract: The package structure of the PCB comprises a substrate and a frame. The frame is located at the top of the substrate, and the substrate and the frame define a receiving space. The electronic components are mounted on the substrate and distributed in the receiving space. Because of the protection of the frame, the electronic components are effectively protected from the collision of installation in the process or use in the process. The substrate can be a flexible circuit board or a rigid-flex PCB and the electronic components are directly embedded in the substrate. Therefore the thickness of the package structure is reduced.

Abstract: A control system for controlling actions performed by a machine includes a sensor module for sensing environmental condition around the machine, an estimation unit for estimating the environmental condition detected by the sensor, a motor for controlling movement of the machine, a control unit for calculating a magnitude of motion according to the estimated environmental condition, the magnitude of motion used for controlling the movement of the machine, and a motor drive circuit for driving the motor to move the machine using the calculated magnitude of motion.

Abstract: A method for making lens modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A lens module made by the method is also disclosed.

Abstract: A camera module includes a lens barrel, a lens, a sensing element, and an electromagnetic shield. The lens barrel defines a receiving space. The lens is mounted in the receiving space. The sensing element is covered by the lens barrel, is disposed below the lens, and is spaced apart from the lens. The sensing element includes a top face, a bottom face, a side face extending between the top and bottom faces, a plurality of first conductors mounted on the bottom face, at least one second conductor mounted on one of the top, bottom, and side faces, and a grounding element having one end connected to one of the first conductors and the other end connected to the second conductor. The electromagnetic shield is coupled to the lens barrel and includes a grounding portion electrically connected to the second conductor.

Abstract: A control system for controlling actions performed by a machine includes a sensor module for sensing environmental condition around the machine, an estimation unit for estimating the environmental condition detected by the sensor, a motor for controlling movement of the machine, a control unit for calculating a magnitude of motion according to the estimated environmental condition, the magnitude of motion used for controlling the movement of the machine, and a motor drive circuit for driving the motor to move the machine using the calculated magnitude of motion.

Abstract: A method for making a camera module includes the steps of: (a) providing a mold with a mold cavity; (b) mounting at least a sensing element and a lens within the mold cavity in such a manner that the sensing element and the lens are spaced apart from each other; and (c) forming a camera barrel by injecting a molding material into the mold cavity and by molding the molding material over the sensing element and the lens.

Abstract: An image capturing device includes a base formed with a first receiving space defined by a bottom wall and a first surrounding wall, and a second receiving space defined by a top side of the first surrounding wall and a second surrounding wall. A lens module is mounted on the base for generating an optical image of an object. An auto-focusing module is disposed in the second receiving space for auto-focusing the optical image based on an external voltage. A sensing module is mounted in the first receiving space and on the bottom wall of the base, is disposed under the auto-focusing module, and is spaced apart from the lens module at a predetermined distance for sensing the optical image focused by the auto-focusing module so as to generate an electrical output corresponding to the optical image.

Abstract: The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250° C.; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.

Abstract: The invention discloses an image processing apparatus and an image processing method. A server can transmit a first image and a second image. In an embodiment, the apparatus includes a receiving/transmitting unit, a processing unit and a display unit. The receiving/transmitting unit can communicate with the server to receive the first image and the second image. The processing unit is coupled to the receiving/transmitting unit and the display unit. The processing unit is for selectively recompressing the first image at a first compression ratio and then controlling the display unit to display the first image. In addition, the processing unit transmits the selected first compression ratio to the server such that the server compresses the second image at the first compression ratio and transmits it to the receiving/transmitting unit.

Abstract: A method for making lens modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A lens module made by the method is also disclosed.

Abstract: A touch panel with touch pads includes a transparent substrate, a transparent electrode and a plurality of conductive lines. The transparent substrate has a display region. The transparent electrode is disposed on the transparent substrate and has a plurality of first touch blocks and a second touch block. The first touch blocks are disposed along the edges of the display region. The second touch block is disposed within the region surrounded by the first touch blocks and has an extending block passing through a gap between the first touch blocks and extending to the edge of the display region. The conductive lines are disposed outside the display region and electrically connected to the first touch blocks and the extending block adjoining the edges of the display region.

Abstract: The optical image stabilizer includes a substrate, a carrier movably disposed on the substrate for carrying an image sensor, an anchor fixed on the substrate, a conducting pad fixed on the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed on the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.