Abstract: An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.

Abstract: A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end.

Abstract: An LED lamp includes a heat sink, a plurality of fin arrays mounted on the heat sink, and a plurality of LED modules mounted on the fin arrays. The heat sink includes a base and a plurality of heat dissipating fins extending from the base. The fin arrays are mounted on a top surface of the base of the heat sink. Each fin array consists of a plurality of fins interlocked together. Each fin array has a bottom mounting surface in contact with the top surface of the base and a top engaging surface defined at an acute angle with respect to the top surface of the base. The LED modules are mounted on the engaging surfaces of the fin arrays, respectively, via heat absorbing plates.

Abstract: An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.

Abstract: An LED light source includes an LED module and a light-guiding module fixed on the LED module. The LED module includes a printed circuit board and a plurality of LEDs. The light-guiding module includes a frame placed on the LED module and a plurality of light guiding units engaging with the frame. The frame defines an opening in a lower portion thereof to receive the LEDs of the LED module therein and a recess in an upper portion thereof and in communication with the opening. Each of the light guiding units has a base with two flanges respectively fittingly received in two cutouts of the recess of the frame so that the light guiding unit is movable along the recess until it faces a corresponding LED.

Abstract: A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips.

Abstract: An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces.

Abstract: A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the lower plate and the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomboid apertures communicating with each other for containing the working liquid therein.

Abstract: An LED lamp includes a heat sink having a base and a plurality of LED module assemblies mounted on a top surface of the base of the heat sink. Each of the LED module assemblies includes a fixing bracket secured to the top surface of the base, an LED module mounted on a top surface of the fixing bracket and two heat pipes engaging with the fixing bracket and the heat sink. The fixing bracket includes a bottom plate attached on the top surface of the base, a top plate on which the LED module is attached and a connecting plate interconnecting the bottom plate with the top plate. The heat pipes thermally connect the bottom plate and the heat sink with the top plate.

Abstract: A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards.

Abstract: An LED lamp includes a support, an envelope, a heat sink assembly and a plurality of LED modules. The envelope is coupled to the support. The heat sink assembly includes a first heat sink mounted on the envelope, a cylindrical second heat sink attached to a bottom surface of the first heat sink and positioned in the envelope, and a plurality of heat pipes. The LED modules are mounted on an outside wall of the second heat sink. The heat pipes have condensing portions embedded in the bottom surface of the first heat sink and evaporating portions sandwiched between the outside wall of the second heat sink and the LED modules.

Abstract: A protective packaging for protecting an LED module from being damaged during transportation, includes a housing containing the LED module therein and a cover slidably fixed in the housing to cover a top opening of the housing. The housing defines a room to receive the LED module therein. A bottom portion of the housing is concaved to form a space, in which a thermal interface material bonded on the LED module is accommodated. An end of the housing is closed to abut against an end of the cover, and an opposite end of the housing is partially opened to receive an opposite end of the cover. The protective packaging is made from an antistatic plastic and has a wall thickness larger than 0.5 mm.

Abstract: An LED lamp includes a heat sink, a triangular-shaped ridge positioned on the heat sink and an LED module mounted on the ridge. The heat sink includes a base and a plurality of first and second fins respectively extending from a first and a second surface of the base, with a plurality of channels defined between the first and second fins. The ridge is positioned on the second surface of the base. The ridge has a lateral surface which has a height decreasing from a middle to a lateral side of the ridge and decreasing from a rear end to a front end of the ridge. The LED module is mounted on the lateral surface of the ridge.

Abstract: A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink.

Abstract: An LED lamp includes a heat dissipation apparatus with a base, an LED module mounted on the base, and an AC-DC converter electrically connected to the LED module. The AC-DC converter is mounted on the base near the LED module. Heat generated by the LED module and heat-generating components of the AC-DC converter is transferred to the base from which the heat is dissipated by the heat dissipation apparatus. Heat pipes are embedded in the base of the heat dissipation apparatus.

Abstract: An LED lamp includes a heat absorbing member having a hollow, cylindrical configuration, a lamp base, a plurality of LED modules and a heat sink. The heat absorbing member defines a through hole therein. The heat sink is secured to a top portion of the heat absorbing member. The lamp base is secured to a bottom portion of the heat absorbing member. The LED modules are mounted on an outer sidewall of the heat absorbing member, and each of the LED modules includes a printed circuit board and a plurality of LEDs mounted on the printed circuit board. Each of the heat pipes has an evaporating portion received in an inner sidewall of the heat absorbing member and a condensing portion connecting with the heat sink. The condensing portions of the heat pipes are radially arranged on the heat sink, radiating outwardly from a central point of the heat sink.

Abstract: A miniature liquid cooling device includes a casing (10) defining a first chamber (102), a second chamber (104) and a third chamber (106) communicating with the first chamber. The first and the third chambers cooperatively form a work channel for liquid. An impeller (21) is rotatably mounted in the first chamber to circulate the liquid. A filter (17) is mounted in the second chamber and defines a plurality of orifices (1704). When the impeller rotates, first the liquid firstly enters the second chamber via an inlet. (122), and then the liquid flows through the filter within the second chamber, whereby air bubbles in the liquid leave the liquid and escape from the filter via the orifices. The escaped air bubbles enter the second chamber. The deaerated liquid flows into the work channel and finally is driven to low out of the liquid cooling device via an outlet (124).

Abstract: A cooling plate of a liquid cooling includes a chamber hermetically defined therein, an outlet, and an inlet. The outlet and the inlet communicate with the chamber for circulating liquid through the chamber. One of the outlet and the inlet is located in the other one of the outlet and the inlet.

Abstract: An LED lamp includes a hollow first heat sink (10), a plurality of LED modules (40) respectively mounted on outer sidewalls (120) of the first heat sink, a second heat sink (20) being enclosed by the first heat sink, and a plurality of heat pipes (30) connecting the second heat sink to the first heat sink. The second heat sink includes an annular base (22) and a plurality of fins (24, 240) extending outwardly and radially from an outer sidewall of the base. The heat pipes couple the base of the second heat sink with the first heat sink, so that heat generated by the LED modules can be transferred from the first heat sink to the second heat sink via the heat pipes, thereby enhancing a heat dissipating efficiency of the LED lamp.

Abstract: An LED lamp includes a heat sink having a base and a plurality of fins extending from the base. A plurality of LED modules is thermally attached to the base of the heat sink. A lamp frame surrounds the LED modules on the heat sink and is hermetically mounted to the heat sink. A lens is hermetically attached to the lamp frame and covers the LED modules. The fins includes a plurality of first fins extending from a first face of the base of the heat sink, and second fins extending from a second face of the base. The LED modules are located between the second fins. A pole has a top end engages with the lamp frame. The pole is used for mounting the LED lamp at a desired position, for example, a sidewalk of a street.