Patents by Inventor Cheng-Tsung Chen

Cheng-Tsung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119613
    Abstract: A structured-light three-dimensional (3D) scanning system includes a projector that emits a projected light with a predetermined pattern onto an object; an image capture device that generates a captured image according to a reflected light reflected from the object, the predetermined pattern of the projected light being distorted due to 3D shape of the object, thereby resulting in a distorted pattern; a depth decoder that converts the distorted pattern into a depth map representing the 3D shape of the object; and a depth fusion device that generates a fused depth map according to at least two different depth maps associated with the object.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Inventors: Hsueh-Tsung Lu, Ching-Wen Wang, Cheng-Che Tsai, Wu-Feng Chen
  • Publication number: 20240085172
    Abstract: The device includes a projecting device, an image sensor and a computing circuit. The projecting device provides a light beam having a predetermined pattern that is projected onto an object. The image sensor receives the light beam reflected from the object to generate an image. The computing circuit compares the image with a first ground-truth image and a ground-truth image to generate a first depth value and a second depth value respectively. The first and second depth values are combined to generate a depth result.
    Type: Application
    Filed: September 11, 2022
    Publication date: March 14, 2024
    Inventors: Wu-Feng CHEN, Ching-Wen WANG, Cheng Che TSAI, Hsueh-Tsung LU
  • Patent number: 10526159
    Abstract: A dispenser for a construction string, cord, or wire contains: an end member, a handle member, and a fixer. The end member includes a first stem formed on a first end thereof, a second stem arranged on a second end thereof and separated from the first stem by a shoulder, a disposable spool fitted on the second stem on which two opposite first ribs extend away from the shoulder, a fitting part defined between the two opposite first ribs, a notch defined on a top of the fitting part, and inner threads formed on an inner wall of the notch. The handle member is rotatably connected with the first stem. The fixer includes a body and a threaded post extending outward from the body, wherein the threaded post has outer threads arranged on an outer wall thereof so as to screw with the inner threads of the notch.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: January 7, 2020
    Inventors: Cheng-Tsung Chen, Chao-Hui Lin
  • Publication number: 20190233246
    Abstract: A dispenser for a construction string, cord, or wire contains: an end member, a handle member, and a fixer. The end member includes a first stein formed on a first end thereof, a second stein arranged on a second end thereof and separated from the first stein by a shoulder, a disposable spool fitted on the second stein on which two opposite first ribs extend away from the shoulder, a fitting part defined between the two opposite first ribs, a notch defined on a top of the fitting part, and inner threads formed on an inner wall of the notch. The handle member is rotatably connected with the first stein. The fixer includes a body and a threaded post extending outward from the body, wherein the threaded post has outer threads arranged on an outer wall thereof so as to screw with the inner threads of the notch.
    Type: Application
    Filed: January 26, 2018
    Publication date: August 1, 2019
    Inventors: Cheng-Tsung CHEN, Chao-Hui LIN
  • Patent number: 9762236
    Abstract: An embedded button without having gap is disclosed according to the present invention. The button area just bends to operate instead of moving back and forth to operate within a through hole so that no water, vapor, or dust shall enter into the device. One of the embodiment comprises an inner bump configured on an inner side of an outer frame; a pressure switch is configured under the inner bump and touches the bottom surface of the bump; and an activating electrical signal is triggered when the button area is pressed by user with a force exceeding a threshold force level from outside surface of the outer frame of the electronic device.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: September 12, 2017
    Assignee: UNEO INC.
    Inventors: Cheng-Tsung Chen, Hsin-Lin Yu, Chih-Sheng Hou, Chia-Hung Chou
  • Patent number: 9686602
    Abstract: A green headphone is disclosed. A force sensor is configured between a speaker cover and a cushion of the headphone. The headphone switches on automatically to play audio when a user puts the headphone on his head. The headphone switches off automatically to stop playing audio when a user puts the headphone off his head, the power consumption is saved.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: June 20, 2017
    Assignee: Uneo Inc.
    Inventors: Chih-Sheng Hou, Cheng-Tsung Chen, Chia-Hung Chou
  • Publication number: 20160366507
    Abstract: A green headphone is disclosed. A force sensor is configured between a speaker cover and a cushion of the headphone. The headphone switches on automatically to play audio when a user puts the headphone on his head. The headphone switches off automatically to stop playing audio when a user puts the headphone off his head, the power consumption is saved.
    Type: Application
    Filed: June 15, 2015
    Publication date: December 15, 2016
    Inventors: Chih-Sheng HOU, Cheng-Tsung CHEN, Chia-Hung CHOU
  • Publication number: 20160225568
    Abstract: An embedded button without having gap is disclosed according to the present invention. The button area just bends to operate instead of moving back and forth to operate within a through hole so that no water, vapor, or dust shall enter into the device. One of the embodiment comprises an inner bump configured on an inner side of an outer frame; a pressure switch is configured under the inner bump and touches the bottom surface of the bump; and an activating electrical signal is triggered when the button area is pressed by user with a force exceeding a threshold force level from outside surface of the outer frame of the electronic device.
    Type: Application
    Filed: February 2, 2015
    Publication date: August 4, 2016
    Inventors: Cheng-Tsung CHEN, Hsin-Lin YU, Chih-Sheng HOU, Chia-Hung CHOU
  • Patent number: 8748952
    Abstract: A system and method for image sensing is disclosed. An embodiment comprises a substrate with a pixel region, the substrate having a front side and a backside. A co-implant process is performed along the backside of the substrate opposing a photosensitive element positioned along the front side of the substrate. The co-implant process utilizes a first pre-amorphization implant process that creates a pre-amorphization region. A dopant is then implanted wherein the pre-amorphization region retards or reduces the diffusion or tailing of the dopants into the photosensitive region. An anti-reflective layer, a color filter, and a microlens may also be formed over the co-implant region.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: June 10, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Tsung Chen, Hsun-Ying Huang, Yung-Cheng Chang, Yung-Fu Yeh, Yu-Ping Chen, Chi-Yuan Liang, Shou Shu Lu, Juan-Lin Chen, Jia-Ren Chen, Horng-Daw Shen, Chi-Hsun Hsieh
  • Publication number: 20130249037
    Abstract: A system and method for image sensing is disclosed. An embodiment comprises a substrate with a pixel region, the substrate having a front side and a backside. A co-implant process is performed along the backside of the substrate opposing a photosensitive element positioned along the front side of the substrate. The co-implant process utilizes a first pre-amorphization implant process that creates a pre-amorphization region. A dopant is then implanted wherein the pre-amorphization region retards or reduces the diffusion or tailing of the dopants into the photosensitive region. An anti-reflective layer, a color filter, and a microlens may also be formed over the co-implant region.
    Type: Application
    Filed: May 10, 2013
    Publication date: September 26, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Tsung Chen, Hsun-Ying Huang, Yung-Cheng Chang, Yung-Fu Yeh, Yu-Ping Chen, Chi-Yuan Liang, Shou Shu Lu, Juan-Lin Chen, Jia-Ren Chen, Horng-Daw Shen, Chi-Hsun Hsieh
  • Patent number: 8466530
    Abstract: A system and method for image sensing is disclosed. An embodiment comprises a substrate with a pixel region, the substrate having a front side and a backside. A co-implant process is performed along the backside of the substrate opposing a photosensitive element positioned along the front side of the substrate. The co-implant process utilizes a first pre-amorphization implant process that creates a pre-amorphization region. A dopant is then implanted wherein the pre-amorphization region retards or reduces the diffusion or tailing of the dopants into the photosensitive region. An anti-reflective layer, a color filter, and a microlens may also be formed over the co-implant region.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: June 18, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Tsung Chen, Hsun-Ying Huang, Yung-Cheng Chang, Yung-Fu Yeh, Yu-Ping Chen, Chi-Yuan Liang, Shou Shu Lu, Juan-Lin Chen, Jia-Ren Chen, Horng-Daw Shen, Chi-Hsun Hsieh
  • Publication number: 20130001722
    Abstract: A system and method for image sensing is disclosed. An embodiment comprises a substrate with a pixel region, the substrate having a front side and a backside. A co-implant process is performed along the backside of the substrate opposing a photosensitive element positioned along the front side of the substrate. The co-implant process utilizes a first pre-amorphization implant process that creates a pre-amorphization region. A dopant is then implanted wherein the pre-amorphization region retards or reduces the diffusion or tailing of the dopants into the photosensitive region. An anti-reflective layer, a color filter, and a microlens may also be formed over the co-implant region.
    Type: Application
    Filed: June 30, 2011
    Publication date: January 3, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Tsung Chen, Hsun-Ying Huang, Yung-Cheng Chang, Yung-Fu Yeh, Yu-Ping Chen, Chi-Yuan Liang, Shou Shu Lu, Juan-Lin Chen, Jia-Ren Chen, Horng-Daw Shen, Chi-Hsun Hsieh
  • Publication number: 20030158689
    Abstract: The purpose of the present invention is to provide a method to extract the extrinsic capacitances of FETs by a physically-meaningful capacitive transmission line model and a linear regression technique. The method of the present invention includes method includes steps of (a) applying a gate-to-source voltage to pinch-off said FETs and setting a drain-to-source voltage to be zero for forming pinched-off cold FETs, (b) measuring S-parameters of said pinched-off cold FETs, (c) representing an intrinsic depletion region of said pinched-off cold FETs by a distributed capacitive transmission line model having a distributed series capacitance Cs and a distributed parallel capacitance Cp; and (d) executing an analytical procedure according to said measured S-parameters for obtaining Y-parameters.
    Type: Application
    Filed: November 20, 2002
    Publication date: August 21, 2003
    Inventors: Yeong-Lin Lai, Cheng-Tsung Chen