Patents by Inventor Cheng-Wei Ho

Cheng-Wei Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162833
    Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 16, 2024
    Inventors: Yi-Sheng CHANG, Cheng-Chan HSU, Chia-Wei CHU, Chun-Yu YANG, Deng-Cyun HUANG, Yi-Hsun CHIU, Chien-An LAI, Yu-Tai WANG, Chi-Shou HO, Zhi-Yuan WU, Ko-Wen LU
  • Publication number: 20240148129
    Abstract: A mobile device attachment adapted for a mobile device and a container for food or liquid is provided. The mobile device attachment includes a magnetic connecting member and a connecting member. The magnetic connecting member is selectively magnetically connected to the mobile device and adapted to extend in an escaping direction. The connecting member is disposed between the container and the magnetic connecting member. The mobile device has an image capturing range. When the magnetic connecting member extends in the escaping direction, the container, the magnetic connecting member and the connecting member are located outside the image capturing range. Besides, a container including the mobile device attachment is also provided.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 9, 2024
    Inventors: CHING-FU WANG, CHING-YU WANG, CHE-WEI HSU, JUI-CHEN LU, CHENG-CHE HO
  • Patent number: 11969447
    Abstract: A composition for promoting defecation includes a cell culture of at least one lactic acid bacterial strain which is substantially free of cells. The least one lactic acid bacterial strain is selected from the group consisting of Lactobacillus salivarius subsp. salicinius AP-32, Bifidobacterium animalis subsp. lactis CP-9, and Lactobacillus acidophilus TYCA06, which are respectively deposited at the Bioresource Collection and Research Center (BCRC) under accession numbers BCRC 910437, BCRC 910645 and BCRC 910813. Also disclosed is a method for promoting defecation, including administering to a subject in need thereof an effective amount of the composition.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: April 30, 2024
    Assignee: GLAC BIOTECH CO., LTD.
    Inventors: Hsieh-Hsun Ho, Ching-Wei Chen, Yi-Wei Kuo, Yu-Fen Huang, Cheng-Chi Lin
  • Publication number: 20240072413
    Abstract: An electronic device is provided. The electronic device includes an antenna array including a plurality of antenna patterns collectively configured to provide a scan-angle coverage. Each of the antenna patterns includes a curved surface.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yu HO, Meng-Wei HSIEH, Chih-Pin HUNG
  • Publication number: 20230275047
    Abstract: A method includes forming a first polymer layer over a plurality of metal pads, and patterning the first polymer layer to forming a plurality of openings in the first polymer layer. The plurality of metal pads are exposed through the plurality of openings. A plurality of conductive vias are formed in the plurality of openings. A plurality of conductive pads are formed over and contacting the plurality of conductive vias. A conductive pad in the plurality of conductive pads is laterally shifted from a conductive via directly underlying, and in physical contact with, the conductive pad. A second polymer layer is formed to cover and in physical contact with the plurality of conductive pads.
    Type: Application
    Filed: April 28, 2022
    Publication date: August 31, 2023
    Inventors: Chun-Jen Chen, Wei-Chun Pai, Cheng Wei Ho, Sheng-Huan Chiu
  • Publication number: 20230245991
    Abstract: In an embodiment, a device includes: an integrated circuit die including a die connector; a dielectric layer on the integrated circuit die; an under-bump metallurgy layer having a line portion on the dielectric layer and having a via portion extending through the dielectric layer to contact the die connector; a through via on the line portion of the under-bump metallurgy layer, the through via having a first curved sidewall proximate the die connector, the through via having a second curved sidewall distal the die connector, the first curved sidewall having a longer arc length than the second curved sidewall; and an encapsulant around the through via and the under-bump metallurgy layer.
    Type: Application
    Filed: May 12, 2022
    Publication date: August 3, 2023
    Inventors: Chun-Jen Chen, Wei-Chun Pai, Cheng Wei Ho, Sheng-Huan Chiu
  • Publication number: 20180058745
    Abstract: An air conditioning apparatus includes a housing, a cooling module, a cover, and a joint unit. The housing has a first side wall, a second side wall and a base, wherein one side of the first side wall and one side of the second side wall are respectively connected to opposite sides of the base; the first side wall, the second side wall and the base join together to define an accommodating space, a first gate, a second gate and a third gate thereamong; the cooling module is disposed in the accommodating space; the cover is disposed on the first gate; and the joint unit is disposed on the surface of the first side wall, the second side wall, the base or the cover.
    Type: Application
    Filed: March 20, 2017
    Publication date: March 1, 2018
    Inventors: Ching-Chung Hsiao, Yi-Yang Lin, Yu-Te Chou, Chien-Lung Huang, Hsin-Jen Lu, Chih-Hao Sun, Cheng-Wei Ho, Ming-Shun Hung
  • Publication number: 20170363304
    Abstract: An air-conditioning device includes a plurality of duct modules and a power module. The duct modules each have a temperature-adjusting unit, an air flow-guiding unit and an energy transmission module. The temperature-adjusting unit is disposed at the second end of the duct module, and has opposing first and second side surfaces. The air flow-guiding unit is disposed at the duct module. The energy transmission module is disposed between the temperature-adjusting unit and the air flow-guiding unit. The power module provides operational power for the duct modules. The air flow-guiding unit guides air flow to enter from the first end of the duct modules. The energy transmission strength of the air flow is enhanced from the energy transmission module. The air flow passes through the first or second side surface of the temperature-adjusting unit, and exists from the second end of the duct modules.
    Type: Application
    Filed: November 4, 2016
    Publication date: December 21, 2017
    Inventors: Ching-Chung HSIAO, Yi-Yang LIN, Yu-Te CHOU, Cheng-Wei HO, Ming-Shun HUNG, Yu-Jen HUANG, Min-Yu LIN
  • Publication number: 20170350609
    Abstract: An air conditioning device includes a duct module and a heat exchange module. The duct module includes a temperature control unit disposed at a second region of the duct module, a first air flow guide unit disposed between a first region and the second region of the duct module, and a first liquid energy conducting element disposed at the first region of the duct module. The heat exchange module has a delivery duct, an accommodating case, a driver unit, a second air flow guide unit, a heat exchanger and a second liquid energy conducting element. The driver unit drives condensed water to pass through the delivery duct. The second air flow guide unit provides an air flow to the heat exchanger for exhausting waste heat. The second liquid energy conducting element performs heat exchange to cool down.
    Type: Application
    Filed: August 12, 2016
    Publication date: December 7, 2017
    Inventors: Ching-Chung HSIAO, Yi-Yang LIN, Yu-Te CHOU, Cheng-Wei HO, Ming-Shun HUNG, Yu-Jen HUANG, Min-Yu LIN
  • Publication number: 20170343226
    Abstract: An air-conditioning device is provided, having a plurality of duct modules and a power module. Each of duct modules has a first end, a second end opposite to the first end, a temperature adjusting unit, and a first airflow guiding unit. The temperature adjusting unit has a first side configured for generating a first temperature range and a second side opposite to the first side configured for generating a second temperature range. The first airflow guiding unit is disposed at the first end or the second end of the duct module configured for guiding an airflow to enter through the first end, pass through the first side or the second side, and exit from the second end. The power module provides power required for operations of the temperature adjusting unit and the first airflow guiding unit.
    Type: Application
    Filed: August 12, 2016
    Publication date: November 30, 2017
    Inventors: Ching-Chung HSIAO, Yi-Yang LIN, Yu-Te CHOU, Cheng-Wei HO, Ming-Shun HUNG, Yu-Jen HUANG, Min-Yu LIN
  • Publication number: 20170343225
    Abstract: An air conditioning device is provided, including an air duct module having a temperature adjusting unit, an energy conduction component, an airflow guiding unit and a control module. The temperature adjusting unit is disposed in the air duct module and has a first side configured for generating a first temperature range and a second side configured for generating a second temperature range. The airflow guiding unit is disposed in the air duct module. The energy conduction component is disposed in the air duct module configured for conducting the energy generated by the first side or the second side of the temperature adjusting unit. The control module is configured for controlling on-off operations or configurations of the temperature adjusting unit and the airflow guiding unit.
    Type: Application
    Filed: August 12, 2016
    Publication date: November 30, 2017
    Inventors: Ching-Chung HSIAO, Yi-Yang LIN, Yu-Te CHOU, Cheng-Wei HO, Ming-Shun HUNG, Yu-Jen HUANG, Min-Yu LIN
  • Patent number: D780899
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: March 7, 2017
    Assignee: MOAI ELECTRONICS CORPORATION
    Inventors: Ching-Chung Hsiao, Yi-Yang Lin, Yu-Te Chou, Yen-Tao Liu, Cheng-Wei Ho, Zheng-Yu Liao