Abstract: Methods of treating a disease caused by a positive strand RNA virus. The methods include administering to a subject in need thereof an effective amount of a compound of Formula I or Formula II.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: A styrene-modified polyethylene-based expandable resin particle is provided, which comprise a polyethylene resin and a polystyrene resin, wherein a content of the polyethylene resin ranges from 5 wt % to 30 wt % and a content of the polystyrene resin ranges from 70 wt % to 95 wt % based on 100 wt % of the polyethylene resin and the polystyrene resin, wherein the expandable resin particle comprises a xylene insoluble matter and an acetone insoluble matter, and a ratio of a content of the xylene insoluble matter to a content of the acetone insoluble matter ranges from 0.01 to 5. In addition, an expanded resin particle and a foamed resin molded article prepared by the aforesaid expandable resin particle are also provided. Furthermore, a method for manufacturing the aforesaid expandable resin particle is also provided.

Abstract: Disclosed are calibration techniques that can be implemented by a device that conducts biological tests. In certain embodiments, the device for testing a biological specimen includes a receiving mechanism to receive a carrier, a camera module arranged to capture imagery of the carrier, and a processor. Some examples of the processor can detect a calibration mode trigger. In calibration mode, the processor can divide the captured imagery into segments and selectively perform one or more calibration procedures for each segment. Then, the processor records a calibration result for each segment.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: A method includes depositing a high-k gate dielectric layer over and along sidewalls of a semiconductor fin. The method further includes depositing an n-type work function metal layer over the high-k gate dielectric layer and performing a passivation treatment on the high-k gate dielectric layer through the n-type work function metal layer. The passivation treatment comprises a remote plasma process. The method further includes depositing a fill metal over the n-type work function metal layer to form a metal gate stack over the high-k gate dielectric layer. The metal gate stack comprising the n-type work function metal layer and the fill metal.

Abstract: A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.

Abstract: A memory comprises a substrate and memory ball pads. The memory ball pads are disposed around the substrate so as to form a ring pattern which show a bilateral symmetry by reflection, wherein the memory ball pads of left-half part of the ring pattern are divided into a first main area, a second main area, a third main area and a fourth main area. The memory ball pads in the first main area are divided into a first sub-region, a second sub-region and a third sub-region, and a plurality of input/output data pins and electricity power pins are disposed in the first sub-region and the third sub-region, wherein the input/output data pins are not adjacent to each other and at least one power voltage pin and at least one ground voltage pin are disposed next to each of the input/output data pins.

Abstract: A memory chip is disclosed. The memory comprises a substrate and a plurality of memory pads. The plurality of memory pads are disposed around the substrate so as to form a pattern, and the plurality of memory pads are configured in a mirror horizontal manner and with layout line connectivity, so as to simplify complexity of layout line. Mirror solder ball map of the instant disclosure increases design flexibility and convenience of integrating line characteristics of the end product's application, and is easy to achieve the design of doubling the memory capacity.

Abstract: A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.

Abstract: A heat dissipating module comprises at least one substrate and a heat dissipating layer. The substrate has a first surface and a second surface. The heat dissipating layer is disposed on the second surface. At least one heat generating device is electrically connected to the first surface, and the heat dissipating module is disposed on a main board uprightly. The heat dissipating module is advantageous for shortening the manufacturing time, raising the efficiency of automated production, decreasing the assembling cost and further achieving high heat dissipating efficiency.

Abstract: A circuit for driving a vehicle lamp includes a current path coupled between a power line and ground, and a monitoring unit coupled to the power line. The current path includes a dummy load. The monitoring unit can monitor a testing signal applied to the power line. The testing signal can test whether the vehicle lamp operates properly. The monitoring unit can conduct the current path to enable a current to flow through the dummy load to ground to decrease a total resistance of the circuit if the testing signal is detected.

Abstract: A circuit for driving a vehicle lamp includes a current path coupled between a power line and ground, and a monitoring unit coupled to the power line. The current path includes a dummy load. The monitoring unit can monitor a testing signal applied to the power line. The testing signal can test whether the vehicle lamp operates properly. The monitoring unit can conduct the current path to enable a current to flow through the dummy load to ground to decrease a total resistance of the circuit if the testing signal is detected.

Abstract: An ink jet-printing apparatus includes an ink reservoir, a print head, a flexible pocket, and a resilient element. The print head is used for ejecting ink from the reservoir. The reservoir is substantially sealed so that ejection of ink from the reservoir decreases a pressure in the reservoir volume. The flexible pocket is disposed in the ink reservoir and is capable of slowing a decrease of the pressure in the reservoir volume by changing a reservoir volume of a reservoir cavity defined between the flexible pocket and the reservoir. The resilient element is disposed within the ink reservoir and the flexible pocket for maintaining the pressure in the reservoir volume below the ambient pressure. The flexible pocket and the resilient element regulate changes in the negative pressure of the ink-jet printing apparatus.

Abstract: An ink cartridge is provided. The ink cartridge includes a housing, an ink storage unit and an ink pipe. The ink storage unit is disposed inside a substantially sealed space of the housing and substantially airtightly contacts with the inner wall of the bottom of the housing to reduce the possibility of bubbles in the ink pipe or on the filter of the ink pipe. The ink storage unit is above the ink pipe and form a gap between the ink storage unit and the top of the ink pipe. A portion of the ink storage unit adjacent to the ink pipe may have a capillarity larger than the other portion of the ink storage unit so as to effectively introduce the ink toward the ink pipe and thereby the rate of ink usability can be enhanced and the ink residual in the ink storage unit can be reduced.

Abstract: An ink storage unit comprises an ink tank that defines an inner confinement space in which is placed an ink storage body to store and retain ink. The ink tank includes an air inlet through which air passage in the ink tank is enabled, and an ink outlet through which ink output is achieved. An outer surface of the ink storage body includes a plurality of notches distributed along an interface between the ink storage body and the ink tank, thereby forming a plurality of gaps that locally separate the outer surface of the ink storage body from the sidewall of the ink tank. Alternatively, the ink storage body is comprised of a first ink storage portion that is separated from a second ink storage portion via a spacing member. Ink flowing and leakage through the air inlet is thereby prevented.

Abstract: An ink storage unit comprises an ink tank that defines an inner confinement space in which is placed an ink storage body to store and retain ink. The ink tank includes an air inlet through which air passage in the ink tank is enabled, and an ink outlet through which ink output is achieved. An outer surface of the ink storage body includes a plurality of notches distributed along an interface between the ink storage body and the ink tank, thereby forming a plurality of gaps that locally separate the outer surface of the ink storage body from the sidewall of the ink tank. Alternatively, the ink storage body is comprised of a first ink storage portion that is separated from a second ink storage portion via a spacing member. Ink flowing and leakage through the air inlet is thereby prevented.

Abstract: An air bag placed in a print cartridge and a method for manufacturing the same are provided, wherein a layered material with two faces of different ingredients are utilized. After cutting and opening of connection holes and air vent holes, flexible stacking according to the capacity requirement of the air bag and thermal pressuring are performed. Through the characteristic that two low-melting-point ingredients can be affixed together but two high-melting-point ingredients or a low-melting-point ingredient and a high-melting-point ingredient cannot be affixed together, the whole air bag can be integrally formed. The air bag forms a plurality of receiving rooms having connected air vent holes. The air bag can be folded up to make inflation and deflation, hence filling up the ink-storage capacity of the print cartridge. Moreover, the back pressure can be adjusted.

Abstract: An ink container includes a housing, a print head, and a fluid chamber. The housing has two inclined walls formed to divide the fluid chamber into a center ink well and two side ink wells. The housing also has two side walls, each having an inclined inner surface. The center ink well is formed between the two inclined walls. Each side ink well is formed between an inclined wall and a side wall. The inner surface of each side wall has a greater inclination than those of the inclined walls, so that each side ink well has a width decreasing from top to bottom.

Abstract: An ink storage unit comprises an ink tank that defines an inner confinement space in which is placed an ink storage body to store and retain ink. The ink tank includes an air inlet through which air passage in the ink tank is enabled, and an ink outlet through which ink output is achieved. An outer surface of the ink storage body includes a plurality of notches distributed along an interface between the ink storage body and the ink tank, thereby forming a plurality of gaps that locally separate the outer surface of the ink storage body from the sidewall of the ink tank. Alternatively, the ink storage body is comprised of a first ink storage portion that is separated from a second ink storage portion via a spacing member. Ink flowing and leakage through the air inlet is thereby prevented.