Patents by Inventor Cheng-Wei Liu

Cheng-Wei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240314976
    Abstract: A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.
    Type: Application
    Filed: May 22, 2024
    Publication date: September 19, 2024
    Inventors: Yueh Ming LIU, Yu Hsiang HUANG, Yu Chuan CHANG, Tan Hsin CHANG, Hsiao Chung CHEN, Chia-Wei CHEN, Chih-Ta CHEN, Cheng-Hung LIN, Ming-Te HSU
  • Publication number: 20240312901
    Abstract: An interconnect structure including a contact via in an interlayer dielectric, a first conductive feature in a first dielectric layer, the first dielectric layer over the interlayer dielectric, a first liner in the first dielectric layer, the first liner comprising a first part in contact with a sidewall surface of the first conductive feature, and a second part in contact with a bottom surface of the first conductive feature. The interconnect structure includes a first cap layer in contact with a top surface of the first conductive feature, a second conductive feature in a second dielectric layer, the second dielectric layer over the first dielectric layer, a second liner in the second dielectric layer, wherein the first and second conductive features comprise a first conductive material, and the contact via, first liner, first cap layer, and second liner comprise a second conductive material chemically different than the first conductive material.
    Type: Application
    Filed: July 12, 2023
    Publication date: September 19, 2024
    Inventors: Chien CHANG, Yen-Chun LIN, Jen-Wei LIU, Chih-Han TSENG, Harry CHIEN, Cheng-Hui WENG, Chun-Chieh LIN, Hung-Wen SU, Ming-Hsing TSAI, Chih-Wei CHANG
  • Patent number: 12096657
    Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated semiconducting oxide transistors. The semiconducting oxide transistors may exhibit different device characteristics. Some of the semiconducting oxide transistors may be formed using a first oxide layer formed from a first semiconducting oxide material using first processing steps, whereas other semiconducting oxide transistors are formed using a second oxide layer formed from a second semiconducting oxide material using second processing steps different than the first processing steps. The display may include three or more different semiconducting oxide layers formed during different processing steps.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: September 17, 2024
    Assignee: Apple Inc.
    Inventors: Jung Yen Huang, Shinya Ono, Chin-Wei Lin, Akira Matsudaira, Cheng Min Hu, Chih Pang Chang, Ching-Sang Chuang, Gihoon Choo, Jiun-Jye Chang, Po-Chun Yeh, Shih Chang Chang, Yu-Wen Liu, Zino Lee
  • Publication number: 20240305180
    Abstract: A synchronous reluctance motor includes a rotor having a rotor iron core and a stator having pole teeth. The rotor iron core defines multiple magnetic poles. A magnetic barrier area is defined between adjacent magnetic poles in a circumferential direction, and a conductor area is located at a radially outer side of the magnetic barrier area. The magnetic barrier area is provided with a hole arranged in multiple layers in a radial direction and defining a magnetic barrier. The conductor area is provided with multiple conductors arranged at substantially equal intervals in the circumferential direction and having substantially identical cross-sectional shapes as each other. The following relationship is satisfied: Nc={2×[Nt/(2×Np)?1]?1}×Np where Nt is a number of the pole teeth, Np is a number of the magnetic poles, and Nc is a number of the conductors.
    Type: Application
    Filed: March 6, 2024
    Publication date: September 12, 2024
    Applicant: NIDEC CORPORATION
    Inventors: Yu-Wei HSU, Sheng-Chan YEN, Guo-Jhih YAN, Cheng-Tsung LIU
  • Publication number: 20240300211
    Abstract: A laminated composite component is provided in this disclosure. The laminated composite component comprises a foam material layer, a first laminated sheet group and a second laminated sheet group. The foam material layer has a first surface and a second surface opposite to each other. The first laminated sheet group is disposed on the first surface. The second laminated sheet group is disposed on the second surface. The first laminated sheet group includes a plurality of first sheets. The second laminated sheet group includes a plurality of second sheets. The foam material layer, the first sheets of the first laminated sheet group, and the second sheets of the second laminated sheet group are laminated and pressed to form in one piece.
    Type: Application
    Filed: February 20, 2024
    Publication date: September 12, 2024
    Applicant: Acer Incorporated
    Inventors: Dong-Sheng WU, Tzu-Wei LIN, Chih-Chun LIU, Cheng-Nan LING, Wen-Chieh TAI
  • Patent number: 12080594
    Abstract: An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: September 3, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu, Cheng-Hui Weng, Chun-Chieh Lin, Hung-Wen Su
  • Publication number: 20240291412
    Abstract: A variable frequency drive motor system and method with a single variable frequency drive controller controlling multiple synchronous reluctance motors in an open-loop mode using volts-per-Hertz control. Each motor includes a rotor including three or more curved, spaced-apart barrier slots extending longitudinally through each quadrant of the rotor. The rotor also includes a conductive cage including a plurality of conductive rotor bars contained within the barrier slots and also extending longitudinally through each quadrant, and conductive end rings located at opposite ends of the rotor and electrically connected to the respective ends of the rotor bars. The controller controls speed and torque by varying input frequency and voltage in an open-loop mode by adjusting the voltage magnitude of an inverter's output to each motor to match a required load torque in a volts-per-Hertz relationship. An operator interface allows for starting, stopping, adjusting, and otherwise controlling the operation of each motor.
    Type: Application
    Filed: June 22, 2022
    Publication date: August 29, 2024
    Applicant: Nidec Motor Corporation
    Inventors: Timothy R. Albers, Eric Coupart, Michael L. McClelland, Sheng-Chan Yen, Guo-Jhih Yan, Ta-Yin Luo, Yu-Wei Hsu, Pei-Chun Shih, Cheng-Tsung Liu
  • Publication number: 20240282698
    Abstract: In some embodiments, the present disclosure relates to an integrated circuit device. A transistor structure includes a gate electrode separated from a substrate by a gate dielectric and a pair of source/drain regions disposed within the substrate on opposite sides of the gate electrode. A lower conductive plug is disposed through a lower inter-layer dielectric (ILD) layer and contacting a first source/drain region. A capping layer is disposed directly on the lower conductive plug. An upper inter-layer dielectric (ILD) layer is disposed over the capping layer and the lower ILD layer. An upper conductive plug is disposed through the upper ILD layer and directly on the capping layer.
    Type: Application
    Filed: April 30, 2024
    Publication date: August 22, 2024
    Inventors: Cheng-Wei Chang, Sung-Li Wang, Yi-Ying Liu, Chia-Hung Chu, Fang-Wei Lee
  • Patent number: 12068252
    Abstract: The present disclosure describes a method for the fabrication of ruthenium conductive structures over cobalt conductive structures. In some embodiments, the method includes forming a first opening in a dielectric layer to expose a first cobalt contact and filling the first opening with ruthenium metal to form a ruthenium contact on the first cobalt contact. The method also includes forming a second opening in the dielectric layer to expose a second cobalt contact and a gate structure and filling the second opening with tungsten to form a tungsten contact on the second cobalt contact and the gate structure. Further, the method includes forming a copper conductive structure on the ruthenium contact and the tungsten contact, where the copper from the copper conductive structure is in contact with the ruthenium metal from the ruthenium contact.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: August 20, 2024
    Inventors: Cheng-Wei Chang, Chien-Shun Liao, Sung-Li Wang, Shuen-Shin Liang, Shu-Lan Chang, Yi-Ying Liu, Chia-Hung Chu, Hsu-Kai Chang
  • Publication number: 20240263298
    Abstract: A deposition apparatus is provided, including a deposition chamber, at least one target, at least one substrate holder, and at least one adjustment plate. The at least one target, the at least one substrate holder, and the at least one adjustment plate are disposed in the deposition chamber, and the at least one adjustment plate is disposed between the at least one target and the at least one substrate holder. The at least one substrate holder includes a base portion, a first supporting portion, and a second supporting portion. The base portion has a flat surface. The first supporting portion is disposed on the flat surface and includes a curved surface. The second supporting portion is disposed on the flat surface and protrudes from it.
    Type: Application
    Filed: January 4, 2024
    Publication date: August 8, 2024
    Inventors: Cheng-Wei LIU, Liang-Cheng MA
  • Patent number: 12051944
    Abstract: A rotor includes a stack of electromagnetic steel plates each including through-hole groups with through-holes extending through the respective electromagnetic steel plates. In each of the through-hole groups, at least one of the through-holes accommodates a magnet and at least a portion of the through-holes that does not accommodate any magnet is filled with an electrically conductive material. When the rotor is seen axially, at two circumferential sides of a magnetic flux passage that is adjacent to the magnet, a width of the magnetic flux passage adjacent a first side of the magnet is larger than a width of the magnetic flux passage near a second side of the magnet.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: July 30, 2024
    Assignee: NIDEC CORPORATION
    Inventors: Yu-Wei Hsu, Ta-Yin Luo, Hsin-Nan Lin, Sheng-Chan Yen, Guo-Jhih Yan, Cheng-Tsung Liu
  • Publication number: 20240249494
    Abstract: An environment managing and monitoring system and a method using same are provided. The environment managing and monitoring system is configured to assist monitors to obtain real-time information of the monitoring field and control device in the monitoring field. The environmental managing and monitoring system includes at least one sub-system and a host system. The host system is configured to output a region of interest condition and a monitoring condition to the sub-system, wherein the sub-system is configured to generate monitoring results according to the monitoring conditions, and selects an image range from the captured wide-angle dynamic real-time images according to the region of interest condition.
    Type: Application
    Filed: September 4, 2023
    Publication date: July 25, 2024
    Inventors: Yung-tai SU, Hsin-lung HSIEH, Yu-hsuan LIAO, Yu-min CHUANG, Pang-tzu LIU, Chun-yueh CHEN, Jia-hao LU, Cheng-ju HSUIEH, Ching-wei LEE, Tsung-hsun TSAI, Po-yuan KUO, Po-yi WU, Chen-wei CHOU
  • Patent number: 12043011
    Abstract: An manufacturing method of an electronic device includes: providing a first substrate and a second substrate; attaching an adhesive member onto the first substrate; and performing a curve attaching step, so that the first substrate and the second substrate are attached to each other through the adhesive member to form a curved composite component, wherein the curve attaching step is performed at a temperature of 20 degrees Celsius to 160 degrees Celsius.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: July 23, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Cheng-Wei Liu, Fang-Cheng Jhou, Cheng-Chun Zhou
  • Patent number: 12046634
    Abstract: A semiconductor device with dual side source/drain (S/D) contact structures and methods of fabricating the same are disclosed. The semiconductor device includes first and second S/D regions, a nanostructured channel region disposed between the first and second S/D regions, a gate structure surrounding the nanostructured channel region, first and second contact structures disposed on first surfaces of the first and second S/D regions, a third contact structure disposed on a second surface of the first S/D region, and an etch stop layer disposed on a second surface of the second S/D region. The third contact structure includes a metal silicide layer, a silicide nitride layer disposed on the metal silicide layer, and a conductive layer disposed on the silicide nitride layer.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: July 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Wei Chang, Shuen-Shin Liang, Sung-Li Wang, Hsu-Kai Chang, Chia-Hung Chu, Chien-Shun Liao, Yi-Ying Liu
  • Publication number: 20220097346
    Abstract: An manufacturing method of an electronic device includes: providing a first substrate and a second substrate; attaching an adhesive member onto the first substrate; and performing a curve attaching step, so that the first substrate and the second substrate are attached to each other through the adhesive member to form a curved composite component, wherein the curve attaching step is performed at a temperature of 20 degrees Celsius to 160 degrees Celsius.
    Type: Application
    Filed: September 1, 2021
    Publication date: March 31, 2022
    Inventors: Cheng-Wei LIU, Fang-Cheng JHOU, Cheng-Chun ZHOU
  • Publication number: 20190072514
    Abstract: A detection system for determining lysyl oxidase-like 2 protein (LOXL2) levels in a bodily sample, includes at least one reaction solution for generating H2O2 upon combination with LOXL2 in the bodily sample, the reaction solution including lysine that can be oxidatively deaminated by LOXL2 to generate ?-aminoadipic-?-semialdehyde (allysine) and hydrogen peroxide (H2O2).
    Type: Application
    Filed: October 23, 2018
    Publication date: March 7, 2019
    Inventors: Chung-Chiun Liu, Yuan Zhang, Metini Janyasupab, Cheng-Wei Liu, Laurie Dudik
  • Patent number: 10135587
    Abstract: A mobile communication device having a reception circuit, a transmission circuit, and a processing unit is provided. The reception circuit and the transmission circuit are configured to receive and transmit wireless signals, respectively. The processing unit activates the reception circuit for a portion of a downlink time interval for receiving Control Channel (CCH) data and one or more Reference Signal (RS) symbols or traffic data symbols beyond the CCH data, and deactivates the reception circuit for the remaining portion of the downlink time interval. Also, the processing unit activates the transmission circuit for a portion of an uplink time interval for transmitting traffic data, determines a radio signal quality with regard to the transmission of the traffic data, and deactivates the transmission circuit for the remaining portion of the uplink time interval when the radio signal quality exceeds a predetermined threshold.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: November 20, 2018
    Assignee: MEDIATEK INC.
    Inventors: Chih-Yuan Wang, Cheng-Wei Liu, Wei-Shou Yang, Wei-Hsiang Cheng, Ya-Ting Cho
  • Patent number: 10107778
    Abstract: A detection system for determining lysyl oxidase-like 2 protein (LOXL2) levels in a bodily sample, includes at least one reaction solution for generating H2O2 upon combination with LOXL2 in the bodily sample, the reaction solution including lysine that can be oxidatively deaminated by LOXL2 to generate ?-aminoadipic-?-semialdehyde (allysine) and hydrogen peroxide (H2O2).
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: October 23, 2018
    Assignee: CASE WESTERN RESERVE UNIVERSITY
    Inventors: Chung-Chiun Liu, Yuan Zhang, Metini Janyasupab, Cheng-Wei Liu, Laurie Dudik
  • Publication number: 20160233995
    Abstract: A mobile communication device having a reception circuit, a transmission circuit, and a processing unit is provided. The reception circuit and the transmission circuit are configured to receive and transmit wireless signals, respectively. The processing unit activates the reception circuit for a portion of a downlink time interval for receiving Control Channel (CCH) data and one or more Reference Signal (RS) symbols or traffic data symbols beyond the CCH data, and deactivates the reception circuit for the remaining portion of the downlink time interval. Also, the processing unit activates the transmission circuit for a portion of an uplink time interval for transmitting traffic data, determines a radio signal quality with regard to the transmission of the traffic data, and deactivates the transmission circuit for the remaining portion of the uplink time interval when the radio signal quality exceeds a predetermined threshold.
    Type: Application
    Filed: February 10, 2015
    Publication date: August 11, 2016
    Inventors: Chih-Yuan WANG, Cheng-Wei LIU, Wei-Shou YANG, Wei-Hsiang CHENG, Ya-Ting CHO
  • Patent number: 9299017
    Abstract: A consumable management method includes the following steps. A general consumable and an enabling key storage device are provided to a dealer. The general consumable includes an enabling chip. The enabling key storage device stores an exclusive enabling key. The dealer is instructed to use a burning tool to burn the exclusive enabling key into the enabling chip of the general consumable, so as to make the general consumable become an exclusive consumable, which is exclusively available to at least one first printing device that is only authenticated by the exclusive enabling key.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: March 29, 2016
    Assignee: Hiti Digital, Inc.
    Inventor: Cheng-Wei Liu