Patents by Inventor Cheng-Wei Lu
Cheng-Wei Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11942445Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having a surface. The semiconductor device includes a conductive pad over a portion of the surface. The conductive pad has a curved top surface, and a width of the conductive pad increases toward the substrate. The semiconductor device includes a device over the conductive pad. The semiconductor device includes a solder layer between the device and the conductive pad. The solder layer covers the curved top surface of the conductive pad, and the conductive pad extends into the solder layer.Type: GrantFiled: August 23, 2021Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-En Yen, Chin-Wei Kang, Kai-Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng, Mirng-Ji Lii
-
Publication number: 20230363080Abstract: A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.Type: ApplicationFiled: July 14, 2023Publication date: November 9, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jian-Ting Chen, Cheng-Wei Lu, Kuang-Hua Wang
-
Patent number: 11778727Abstract: A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.Type: GrantFiled: August 30, 2021Date of Patent: October 3, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jian-Ting Chen, Cheng-Wei Lu, Kuang-Hua Wang
-
Patent number: 11665238Abstract: A method for data transmission between a sensor device and an electronic device includes: broadcasting, by the sensor device, a beacon dataset and a sensor dataset associated with the beacon dataset; in receipt of the beacon dataset, determining, by the electronic device, whether to receive the sensor dataset associated with the beacon dataset; and when it is determined to receive the sensor dataset associated with the beacon dataset, operating, by the electronic device, in a scan mode so as to receive the sensor dataset associated with the beacon dataset.Type: GrantFiled: January 17, 2020Date of Patent: May 30, 2023Assignee: BIONIME CORPORATIONInventors: Chih-Lung Yeh, Cheng-Wei Lu, Yung-Feng Lai, Guan-Yu Lu, Yuan-Chieh Lin
-
Patent number: 11652303Abstract: A terminal assembly is disclosed. The terminal assembly comprises a main body having a welding platform and a first electrical conductive member having a connection terminal. According to the present invention, a welded structure is formed between the main body and the first electrical conductive member by making the connection terminal be welded on the welding platform. Briefly speaking, when utilizing this terminal assembly to make two electrical nodes be electrically connected to each other, one electrical conductive end of the main body and the first electrical conductive member are firstly connected to the two electrical nodes, respectively. Next, a welding process is applied to the welding platform and the connection terminal, such that an electrical connection is therefore established between the two electrical nodes.Type: GrantFiled: June 16, 2021Date of Patent: May 16, 2023Assignees: SOLTEAM ELECTRONICS (DONG GUAN) CO., LTD., SOLTEAM ELECTRONICS (SU ZHOU) CO., LTD., SOLTEAM INCORPORATIONInventors: Chun-Yun Chang, Ying-Sung Ho, Ta-Feng Yeh, Cheng-Wei Lu, Chia-Yu Chiu
-
Publication number: 20230066017Abstract: A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.Type: ApplicationFiled: August 30, 2021Publication date: March 2, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jian-Ting Chen, Cheng-Wei Lu, Kuang-Hua Wang
-
Publication number: 20220085522Abstract: A terminal assembly is disclosed. The terminal assembly comprises a main body having a welding platform and a first electrical conductive member having a connection terminal. According to the present invention, a welded structure is formed between the main body and the first electrical conductive member by making the connection terminal be welded on the welding platform. Briefly speaking, when utilizing this terminal assembly to make two electrical nodes be electrically connected to each other, one electrical conductive end of the main body and the first electrical conductive member are firstly connected to the two electrical nodes, respectively. Next, a welding process is applied to the welding platform and the connection terminal, such that an electrical connection is therefore established between the two electrical nodes.Type: ApplicationFiled: June 16, 2021Publication date: March 17, 2022Inventors: Chun-Yun Chang, Ying-Sung Ho, Ta-Feng Yeh, Cheng-Wei Lu, Chia-Yu Chiu
-
Patent number: 11258215Abstract: A high voltage connector is disclosed. The high voltage connector principally consists of a housing body, a shielding case, a plurality of L-shaped conductive terminals, two L-shaped signal terminals, and a seal ring. The housing body is provided with a terminal accommodating body therein, and the shielding case is embedded in the housing body for covering the terminal accommodating body. Particularly, four guide slots are formed on a lateral side of the terminal accommodating body, four prop blocks are respectively formed in the four guide slots, and the shielding case is designed to have four prop members. In case of the shielding case being disposed to cover the terminal accommodating body, the four prop members slide in the four guide slots, and then are consequently stopped by the four prop blocks, thereby being fixed in the housing body.Type: GrantFiled: August 2, 2020Date of Patent: February 22, 2022Inventors: Chun-Yun Chang, Ying-Sung Ho, Ta-Feng Yeh, Cheng-Wei Lu, Chi-Yu Chu
-
Publication number: 20210281027Abstract: A high voltage connector is disclosed. The high voltage connector principally consists of a housing body, a shielding case, a plurality of L-shaped conductive terminals, two L-shaped signal terminals, and a seal ring. The housing body is provided with a terminal accommodating body therein, and the shielding case is embedded in the housing body for covering the terminal accommodating body. Particularly, four guide slots are formed on a lateral side of the terminal accommodating body, four prop blocks are respectively formed in the four guide slots, and the shielding case is designed to have four prop members. In case of the shielding case being disposed to cover the terminal accommodating body, the four prop members slide in the four guide slots, and then are consequently stopped by the four prop blocks, thereby being fixed in the housing body.Type: ApplicationFiled: August 2, 2020Publication date: September 9, 2021Inventors: CHUN-YUN CHANG, YING-SUNG HO, TA-FENG YEH, CHENG-WEI LU, CHI-YU CHU
-
Patent number: 10925547Abstract: A system for monitoring a physiological condition of a user includes a first measuring apparatus for personal use, a second measuring apparatus for use by medical professionals, and a server. The first measuring apparatus measures a first physiological parameter of the user. The second measuring apparatus measures a second physiological parameter of the user. The server receives the first and second physiological parameters measured by the first and second measuring apparatuses. The measured values of the first and second physiological parameters are associated with a disease condition, a health condition, a nutrient intake condition, a fitness condition or an exercise condition of the user.Type: GrantFiled: January 10, 2018Date of Patent: February 23, 2021Assignee: Bionime CorporationInventors: Ming-Luen Chang, Cheng-Wei Lu, Kuo-Chih Ho, Kai-Fa Chang, Yung-Feng Lai, Jui-Chi Weng
-
Patent number: 10925522Abstract: A method for dynamic analysis of a physiological parameter of a user includes: generating a first event label corresponding to a first measurement value of the physiological parameter measured at a first time point; generating a second event label corresponding to a second measurement value of the physiological parameter measured at a second time point; calculating a time difference between the first and second time points; calculating a measurement value difference between the first and second measurement values when a time difference between the first and second time points is smaller than a time length threshold; and providing an analysis outcome based on the first and second event labels and the measurement value difference.Type: GrantFiled: January 10, 2018Date of Patent: February 23, 2021Assignee: Bionime CorporationInventors: Ming-Luen Chang, Cheng-Wei Lu
-
Publication number: 20200314182Abstract: A method for data transmission between a sensor device and an electronic device includes: broadcasting, by the sensor device, a beacon dataset and a sensor dataset associated with the beacon dataset; in receipt of the beacon dataset, determining, by the electronic device, whether to receive the sensor dataset associated with the beacon dataset; and when it is determined to receive the sensor dataset associated with the beacon dataset, operating, by the electronic device, in a scan mode so as to receive the sensor dataset associated with the beacon dataset.Type: ApplicationFiled: January 17, 2020Publication date: October 1, 2020Applicant: BIONIME CORPORATIONInventors: Chih-Lung YEH, Cheng-Wei LU, Yung-Feng LAI, Guan-Yu LU, Yuan-Chieh LIN
-
Patent number: 10592113Abstract: A method for transferring a command from a host to a device controller and a system using the method are disclosed. The method includes the steps of: A. determining a segment size; B. dividing a command into a number of sections each having a size the same as the segment size; C. sequentially distributing the sections to n groups; D. changing distributing order to a reverse order or keeping the same distributing order in step C if a cycle of distribution is finished while there are sections left for distributing; E. restructuring the section(s) in each group as a sub-command after all sections are distributed; and F. providing the sub-commands to a device controller synchronously.Type: GrantFiled: July 18, 2016Date of Patent: March 17, 2020Assignee: Storart Technology (Shenzhen) Co., Ltd.Inventor: Cheng Wei Lu
-
Patent number: 10446961Abstract: Disclosures of the present invention mainly describe an electrical connector set mainly consisting of a space-end electrical connector disposed in a battery accommodating space and a battery-end electrical connector connected to a replaceable battery. The space-end electrical connector is integrated with a first outer circular cylinder member and a first inner circular cylinder member therein. In contrast to the space-end electrical connector, the battery-end electrical connector is also provided with a second outer circular cylinder member and a second inner circular cylinder member therein. By such arrangement, after connecting the battery-end electrical connector with the space-end electrical connector, the outer wall of the first outer circular cylinder member contacts with a circular negative electrode of the second outer circular cylinder member and the outer wall of the first inner circular cylinder member contacts with the circular positive electrode of the second inner circular cylinder member.Type: GrantFiled: December 31, 2018Date of Patent: October 15, 2019Assignees: SOLTEAM ELECTRONICS CO., LTD., KWANG YANG MOTOR CO., LTD.Inventors: Chun-Yun Chang, Ying-Sung Ho, Ta-Feng Yeh, Cheng-Wei Lu, Wei-Chen Wang, Jen-Chieh Cheng
-
Patent number: 10266059Abstract: Disclosures of the present invention describe an industrial socket, comprising: an insulation body, a plurality of electrical connectors, a plurality of actuating units, and a plurality of elastic elements, wherein each of the actuating units comprises a slant surface portion and a cover portion. It is worth explaining that, when an electrical plug is inserted into a receiving opening of the insulation body, the slant surface portion enters a notch by a pushing force applied by the electrical plug, such that the cover portion correspondingly moves with the motion of the slant surface portion, so as to stop the shielding to an electrical end of the electrical connector. Therefore, this novel industrial socket has many outstanding functions of fool-proof, dustproof and contact protection.Type: GrantFiled: August 3, 2018Date of Patent: April 23, 2019Assignees: SOLTEAM ELECTRONICS (DONG GUAN) CO., LTD., SOLTEAM ELECTRONICS (SU ZHOU) CO., LTD., SOLTEAM ELECTRONICS CO., LTD.Inventors: Chun-Yun Chang, Cheng-Wei Lu, Chi-Han Huang, Ta-Feng Yeh, Ying-Sung Ho
-
Publication number: 20180199891Abstract: A system for monitoring a physiological condition of a user includes a first measuring apparatus for personal use, a second measuring apparatus for use by medical professionals, and a server. The first measuring apparatus measures a first physiological parameter of the user. The second measuring apparatus measures a second physiological parameter of the user. The server receives the first and second physiological parameters measured by the first and second measuring apparatuses. The measured values of the first and second physiological parameters are associated with a disease condition, a health condition, a nutrient intake condition, a fitness condition or an exercise condition of the user.Type: ApplicationFiled: January 10, 2018Publication date: July 19, 2018Inventors: MING-LUEN CHANG, CHENG-WEI LU, KUO-CHIH HO, KAI-FA CHANG, YUNG-FENG LAI, JUI-CHI WENG
-
Publication number: 20180199867Abstract: A method for dynamic analysis of a physiological parameter of a user includes: generating a first event label corresponding to a first measurement value of the physiological parameter measured at a first time point; generating a second event label corresponding to a second measurement value of the physiological parameter measured at a second time point; calculating a time difference between the first and second time points; calculating a measurement value difference between the first and second measurement values when a time difference between the first and second time points is smaller than a time length threshold; and providing an analysis outcome based on the first and second event labels and the measurement value difference.Type: ApplicationFiled: January 10, 2018Publication date: July 19, 2018Inventors: MING-LUEN CHANG, CHENG-WEI LU
-
Publication number: 20180018090Abstract: A method for transferring a command from a host to a device controller and a system using the method are disclosed. The method includes the steps of: A. determining a segment size; B. dividing a command into a number of sections each having a size the same as the segment size; C. sequentially distributing the sections to n groups; D. changing distributing order to a reverse order or keeping the same distributing order in step C if a cycle of distribution is finished while there are sections left for distributing; E. restructuring the section(s) in each group as a sub-command after all sections are distributed; and F. providing the sub-commands to a device controller synchronously.Type: ApplicationFiled: July 18, 2016Publication date: January 18, 2018Applicant: Storart Technology Co.,Ltd.Inventor: Cheng Wei LU
-
Patent number: D951191Type: GrantFiled: September 26, 2020Date of Patent: May 10, 2022Assignees: SOLTEAM ELECTRONICS (DONG GUAN) CO., LTD., SOLTEAM ELECTRONICS (SU ZHOU) CO., LTD., SOLTEAM INCORPORATIONInventors: Chun-Yun Chang, Ying-Sung Ho, Ta-Feng Yeh, Cheng-Wei Lu, Chih-Hao Liu
-
Patent number: D983750Type: GrantFiled: August 26, 2020Date of Patent: April 18, 2023Assignees: SOLTEAM ELECTRONICS (DONG GUAN) CO., LTD., SOLTEAM ELECTRONICS (SU ZHOU) CO., LTD., SOLTEAM INCORPORATIONInventors: Chun-Yun Chang, Ying-Sung Ho, Ta-Feng Yeh, Cheng-Wei Lu, Chi-Yu Chu