Patents by Inventor Cheng-Wei Lu

Cheng-Wei Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942445
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having a surface. The semiconductor device includes a conductive pad over a portion of the surface. The conductive pad has a curved top surface, and a width of the conductive pad increases toward the substrate. The semiconductor device includes a device over the conductive pad. The semiconductor device includes a solder layer between the device and the conductive pad. The solder layer covers the curved top surface of the conductive pad, and the conductive pad extends into the solder layer.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-En Yen, Chin-Wei Kang, Kai-Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng, Mirng-Ji Lii
  • Publication number: 20230363080
    Abstract: A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.
    Type: Application
    Filed: July 14, 2023
    Publication date: November 9, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jian-Ting Chen, Cheng-Wei Lu, Kuang-Hua Wang
  • Patent number: 11778727
    Abstract: A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: October 3, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jian-Ting Chen, Cheng-Wei Lu, Kuang-Hua Wang
  • Patent number: 11665238
    Abstract: A method for data transmission between a sensor device and an electronic device includes: broadcasting, by the sensor device, a beacon dataset and a sensor dataset associated with the beacon dataset; in receipt of the beacon dataset, determining, by the electronic device, whether to receive the sensor dataset associated with the beacon dataset; and when it is determined to receive the sensor dataset associated with the beacon dataset, operating, by the electronic device, in a scan mode so as to receive the sensor dataset associated with the beacon dataset.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: May 30, 2023
    Assignee: BIONIME CORPORATION
    Inventors: Chih-Lung Yeh, Cheng-Wei Lu, Yung-Feng Lai, Guan-Yu Lu, Yuan-Chieh Lin
  • Patent number: 11652303
    Abstract: A terminal assembly is disclosed. The terminal assembly comprises a main body having a welding platform and a first electrical conductive member having a connection terminal. According to the present invention, a welded structure is formed between the main body and the first electrical conductive member by making the connection terminal be welded on the welding platform. Briefly speaking, when utilizing this terminal assembly to make two electrical nodes be electrically connected to each other, one electrical conductive end of the main body and the first electrical conductive member are firstly connected to the two electrical nodes, respectively. Next, a welding process is applied to the welding platform and the connection terminal, such that an electrical connection is therefore established between the two electrical nodes.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: May 16, 2023
    Assignees: SOLTEAM ELECTRONICS (DONG GUAN) CO., LTD., SOLTEAM ELECTRONICS (SU ZHOU) CO., LTD., SOLTEAM INCORPORATION
    Inventors: Chun-Yun Chang, Ying-Sung Ho, Ta-Feng Yeh, Cheng-Wei Lu, Chia-Yu Chiu
  • Publication number: 20230066017
    Abstract: A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jian-Ting Chen, Cheng-Wei Lu, Kuang-Hua Wang
  • Publication number: 20220085522
    Abstract: A terminal assembly is disclosed. The terminal assembly comprises a main body having a welding platform and a first electrical conductive member having a connection terminal. According to the present invention, a welded structure is formed between the main body and the first electrical conductive member by making the connection terminal be welded on the welding platform. Briefly speaking, when utilizing this terminal assembly to make two electrical nodes be electrically connected to each other, one electrical conductive end of the main body and the first electrical conductive member are firstly connected to the two electrical nodes, respectively. Next, a welding process is applied to the welding platform and the connection terminal, such that an electrical connection is therefore established between the two electrical nodes.
    Type: Application
    Filed: June 16, 2021
    Publication date: March 17, 2022
    Inventors: Chun-Yun Chang, Ying-Sung Ho, Ta-Feng Yeh, Cheng-Wei Lu, Chia-Yu Chiu
  • Patent number: 11258215
    Abstract: A high voltage connector is disclosed. The high voltage connector principally consists of a housing body, a shielding case, a plurality of L-shaped conductive terminals, two L-shaped signal terminals, and a seal ring. The housing body is provided with a terminal accommodating body therein, and the shielding case is embedded in the housing body for covering the terminal accommodating body. Particularly, four guide slots are formed on a lateral side of the terminal accommodating body, four prop blocks are respectively formed in the four guide slots, and the shielding case is designed to have four prop members. In case of the shielding case being disposed to cover the terminal accommodating body, the four prop members slide in the four guide slots, and then are consequently stopped by the four prop blocks, thereby being fixed in the housing body.
    Type: Grant
    Filed: August 2, 2020
    Date of Patent: February 22, 2022
    Inventors: Chun-Yun Chang, Ying-Sung Ho, Ta-Feng Yeh, Cheng-Wei Lu, Chi-Yu Chu
  • Publication number: 20210281027
    Abstract: A high voltage connector is disclosed. The high voltage connector principally consists of a housing body, a shielding case, a plurality of L-shaped conductive terminals, two L-shaped signal terminals, and a seal ring. The housing body is provided with a terminal accommodating body therein, and the shielding case is embedded in the housing body for covering the terminal accommodating body. Particularly, four guide slots are formed on a lateral side of the terminal accommodating body, four prop blocks are respectively formed in the four guide slots, and the shielding case is designed to have four prop members. In case of the shielding case being disposed to cover the terminal accommodating body, the four prop members slide in the four guide slots, and then are consequently stopped by the four prop blocks, thereby being fixed in the housing body.
    Type: Application
    Filed: August 2, 2020
    Publication date: September 9, 2021
    Inventors: CHUN-YUN CHANG, YING-SUNG HO, TA-FENG YEH, CHENG-WEI LU, CHI-YU CHU
  • Patent number: 10925547
    Abstract: A system for monitoring a physiological condition of a user includes a first measuring apparatus for personal use, a second measuring apparatus for use by medical professionals, and a server. The first measuring apparatus measures a first physiological parameter of the user. The second measuring apparatus measures a second physiological parameter of the user. The server receives the first and second physiological parameters measured by the first and second measuring apparatuses. The measured values of the first and second physiological parameters are associated with a disease condition, a health condition, a nutrient intake condition, a fitness condition or an exercise condition of the user.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: February 23, 2021
    Assignee: Bionime Corporation
    Inventors: Ming-Luen Chang, Cheng-Wei Lu, Kuo-Chih Ho, Kai-Fa Chang, Yung-Feng Lai, Jui-Chi Weng
  • Patent number: 10925522
    Abstract: A method for dynamic analysis of a physiological parameter of a user includes: generating a first event label corresponding to a first measurement value of the physiological parameter measured at a first time point; generating a second event label corresponding to a second measurement value of the physiological parameter measured at a second time point; calculating a time difference between the first and second time points; calculating a measurement value difference between the first and second measurement values when a time difference between the first and second time points is smaller than a time length threshold; and providing an analysis outcome based on the first and second event labels and the measurement value difference.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: February 23, 2021
    Assignee: Bionime Corporation
    Inventors: Ming-Luen Chang, Cheng-Wei Lu
  • Publication number: 20200314182
    Abstract: A method for data transmission between a sensor device and an electronic device includes: broadcasting, by the sensor device, a beacon dataset and a sensor dataset associated with the beacon dataset; in receipt of the beacon dataset, determining, by the electronic device, whether to receive the sensor dataset associated with the beacon dataset; and when it is determined to receive the sensor dataset associated with the beacon dataset, operating, by the electronic device, in a scan mode so as to receive the sensor dataset associated with the beacon dataset.
    Type: Application
    Filed: January 17, 2020
    Publication date: October 1, 2020
    Applicant: BIONIME CORPORATION
    Inventors: Chih-Lung YEH, Cheng-Wei LU, Yung-Feng LAI, Guan-Yu LU, Yuan-Chieh LIN
  • Patent number: 10592113
    Abstract: A method for transferring a command from a host to a device controller and a system using the method are disclosed. The method includes the steps of: A. determining a segment size; B. dividing a command into a number of sections each having a size the same as the segment size; C. sequentially distributing the sections to n groups; D. changing distributing order to a reverse order or keeping the same distributing order in step C if a cycle of distribution is finished while there are sections left for distributing; E. restructuring the section(s) in each group as a sub-command after all sections are distributed; and F. providing the sub-commands to a device controller synchronously.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: March 17, 2020
    Assignee: Storart Technology (Shenzhen) Co., Ltd.
    Inventor: Cheng Wei Lu
  • Patent number: 10446961
    Abstract: Disclosures of the present invention mainly describe an electrical connector set mainly consisting of a space-end electrical connector disposed in a battery accommodating space and a battery-end electrical connector connected to a replaceable battery. The space-end electrical connector is integrated with a first outer circular cylinder member and a first inner circular cylinder member therein. In contrast to the space-end electrical connector, the battery-end electrical connector is also provided with a second outer circular cylinder member and a second inner circular cylinder member therein. By such arrangement, after connecting the battery-end electrical connector with the space-end electrical connector, the outer wall of the first outer circular cylinder member contacts with a circular negative electrode of the second outer circular cylinder member and the outer wall of the first inner circular cylinder member contacts with the circular positive electrode of the second inner circular cylinder member.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: October 15, 2019
    Assignees: SOLTEAM ELECTRONICS CO., LTD., KWANG YANG MOTOR CO., LTD.
    Inventors: Chun-Yun Chang, Ying-Sung Ho, Ta-Feng Yeh, Cheng-Wei Lu, Wei-Chen Wang, Jen-Chieh Cheng
  • Patent number: 10266059
    Abstract: Disclosures of the present invention describe an industrial socket, comprising: an insulation body, a plurality of electrical connectors, a plurality of actuating units, and a plurality of elastic elements, wherein each of the actuating units comprises a slant surface portion and a cover portion. It is worth explaining that, when an electrical plug is inserted into a receiving opening of the insulation body, the slant surface portion enters a notch by a pushing force applied by the electrical plug, such that the cover portion correspondingly moves with the motion of the slant surface portion, so as to stop the shielding to an electrical end of the electrical connector. Therefore, this novel industrial socket has many outstanding functions of fool-proof, dustproof and contact protection.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: April 23, 2019
    Assignees: SOLTEAM ELECTRONICS (DONG GUAN) CO., LTD., SOLTEAM ELECTRONICS (SU ZHOU) CO., LTD., SOLTEAM ELECTRONICS CO., LTD.
    Inventors: Chun-Yun Chang, Cheng-Wei Lu, Chi-Han Huang, Ta-Feng Yeh, Ying-Sung Ho
  • Publication number: 20180199891
    Abstract: A system for monitoring a physiological condition of a user includes a first measuring apparatus for personal use, a second measuring apparatus for use by medical professionals, and a server. The first measuring apparatus measures a first physiological parameter of the user. The second measuring apparatus measures a second physiological parameter of the user. The server receives the first and second physiological parameters measured by the first and second measuring apparatuses. The measured values of the first and second physiological parameters are associated with a disease condition, a health condition, a nutrient intake condition, a fitness condition or an exercise condition of the user.
    Type: Application
    Filed: January 10, 2018
    Publication date: July 19, 2018
    Inventors: MING-LUEN CHANG, CHENG-WEI LU, KUO-CHIH HO, KAI-FA CHANG, YUNG-FENG LAI, JUI-CHI WENG
  • Publication number: 20180199867
    Abstract: A method for dynamic analysis of a physiological parameter of a user includes: generating a first event label corresponding to a first measurement value of the physiological parameter measured at a first time point; generating a second event label corresponding to a second measurement value of the physiological parameter measured at a second time point; calculating a time difference between the first and second time points; calculating a measurement value difference between the first and second measurement values when a time difference between the first and second time points is smaller than a time length threshold; and providing an analysis outcome based on the first and second event labels and the measurement value difference.
    Type: Application
    Filed: January 10, 2018
    Publication date: July 19, 2018
    Inventors: MING-LUEN CHANG, CHENG-WEI LU
  • Publication number: 20180018090
    Abstract: A method for transferring a command from a host to a device controller and a system using the method are disclosed. The method includes the steps of: A. determining a segment size; B. dividing a command into a number of sections each having a size the same as the segment size; C. sequentially distributing the sections to n groups; D. changing distributing order to a reverse order or keeping the same distributing order in step C if a cycle of distribution is finished while there are sections left for distributing; E. restructuring the section(s) in each group as a sub-command after all sections are distributed; and F. providing the sub-commands to a device controller synchronously.
    Type: Application
    Filed: July 18, 2016
    Publication date: January 18, 2018
    Applicant: Storart Technology Co.,Ltd.
    Inventor: Cheng Wei LU
  • Patent number: D951191
    Type: Grant
    Filed: September 26, 2020
    Date of Patent: May 10, 2022
    Assignees: SOLTEAM ELECTRONICS (DONG GUAN) CO., LTD., SOLTEAM ELECTRONICS (SU ZHOU) CO., LTD., SOLTEAM INCORPORATION
    Inventors: Chun-Yun Chang, Ying-Sung Ho, Ta-Feng Yeh, Cheng-Wei Lu, Chih-Hao Liu
  • Patent number: D983750
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: April 18, 2023
    Assignees: SOLTEAM ELECTRONICS (DONG GUAN) CO., LTD., SOLTEAM ELECTRONICS (SU ZHOU) CO., LTD., SOLTEAM INCORPORATION
    Inventors: Chun-Yun Chang, Ying-Sung Ho, Ta-Feng Yeh, Cheng-Wei Lu, Chi-Yu Chu