Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.

Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.

Abstract: A wearable device, which is worn on a user's head, includes a front assembly, a rear assembly, and a connecting assembly. The connecting assembly connects the front assembly and the rear assembly, wherein the front assembly may be rotated by an angle relative to the rear assembly via the connecting assembly.

Abstract: A video processing method for detecting location(s), pixels, and skeleton(s) of one or more objects and an associated video processing circuit are provided. The video processing method may include: utilizing a backbone network in a predetermined model of a single deep learning network to receive and convert input image data having the object(s) into at least one feature map; and utilizing at least one instance head and a pixel head in the predetermined model of the single deep learning network to receive and convert the aforementioned at least one feature map into one or more object detection results, one or more instance segmentation results and one or more pose estimation results of the object(s).

Abstract: An improved spacer in an apparatus comprising a MEMS device that is packaged between a substrate and cover plate, where the improved spacer protects traces running on the substrate and under the spacer. The improved spacer reduces the amount of force or pressure on the traces or wires, which reduces line out damage when an array of packaged MEMS devices are separated by pressure or force into one packaged MEMS device. In one embodiment, the improved spacer comprises a softer, deformable, elastic, or malleable material that does not crush the traces. This softer material can be an elastic polymeric spacer. In another embodiment, the improved spacer can protect these traces by having a shape with a smaller contact surface which minimizes the amount of traces being affected. This surface can be a sphere or a ball.