Patents by Inventor Cheng Wei Wu

Cheng Wei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240258439
    Abstract: A method of forming a semiconductor device includes providing a first isolation feature in a substrate, where the first isolation feature defines and isolates a cathode region of a Schottky barrier diode (SBD) from an anode region of the SBD. In some embodiments, the method further includes forming a patterned resist protective oxide (RPO) layer over the first isolation feature. Thereafter, the method further includes forming a first metal contact that extends through the patterned RPO layer and extends into the first isolation feature.
    Type: Application
    Filed: January 30, 2023
    Publication date: August 1, 2024
    Inventors: Cheng-Wei WU, Yu-Chi LIAO
  • Patent number: 11800664
    Abstract: A wearable device, which is worn on a user's head, includes a front assembly, a rear assembly, and a connecting assembly. The connecting assembly connects the front assembly and the rear assembly, wherein the front assembly may be rotated by an angle relative to the rear assembly via the connecting assembly.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: October 24, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Shan-Peng Lai, Cheng-Wei Wu, Chun-Lung Chen, Heng-Min Hu
  • Publication number: 20230085518
    Abstract: A video processing method for detecting location(s), pixels, and skeleton(s) of one or more objects and an associated video processing circuit are provided. The video processing method may include: utilizing a backbone network in a predetermined model of a single deep learning network to receive and convert input image data having the object(s) into at least one feature map; and utilizing at least one instance head and a pixel head in the predetermined model of the single deep learning network to receive and convert the aforementioned at least one feature map into one or more object detection results, one or more instance segmentation results and one or more pose estimation results of the object(s).
    Type: Application
    Filed: August 1, 2022
    Publication date: March 16, 2023
    Applicant: MEDIATEK INC.
    Inventors: Hsing-Yu Chen, Cheng-Wei Wu, Shu-Ping Chen
  • Publication number: 20100020382
    Abstract: An improved spacer in an apparatus comprising a MEMS device that is packaged between a substrate and cover plate, where the improved spacer protects traces running on the substrate and under the spacer. The improved spacer reduces the amount of force or pressure on the traces or wires, which reduces line out damage when an array of packaged MEMS devices are separated by pressure or force into one packaged MEMS device. In one embodiment, the improved spacer comprises a softer, deformable, elastic, or malleable material that does not crush the traces. This softer material can be an elastic polymeric spacer. In another embodiment, the improved spacer can protect these traces by having a shape with a smaller contact surface which minimizes the amount of traces being affected. This surface can be a sphere or a ball.
    Type: Application
    Filed: July 22, 2008
    Publication date: January 28, 2010
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Yi Fan Su, Yen Hua Lin, Feng Ming Pao, Cheng Wei Wu