Abstract: An electronic device includes a flexible substrate and a conductive wire. The conductive wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings disposed in the metal portion. The metal portion includes a plurality of extending portions and a plurality of joint portions, and each of the openings is surrounded by two of the plurality of extending portions and two of the plurality of joint portions. A ratio of a sum of widths of the plurality of extending portions to a sum of widths of the plurality of joint portions is in a range from 0.8 to 1.2.

Abstract: A method of forming a semiconductor device includes: forming a fin protruding above a substrate, where a top portion of the fin comprises a layer stack that includes alternating layers of a first semiconductor material and a second semiconductor material; forming a dummy gate structure over the fin; forming openings in the fin on opposing sides of the dummy gate structure; forming source/drain regions in the openings; removing the dummy gate structure to expose the first semiconductor material and the second semiconductor material under the dummy gate structure; performing a first etching process to selectively remove the exposed first semiconductor material, where after the first etching process, the exposed second semiconductor material form nanostructures, where each of the nanostructures has a first shape; and after the first etching process, performing a second etching process to reshape each of the nanostructures into a second shape different from the first shape.

Abstract: Methods of treating a disease caused by a positive strand RNA virus. The methods include administering to a subject in need thereof an effective amount of a compound of Formula I or Formula II.

Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.

Abstract: A cutting fluid digital monitoring and management system and method are provided, applicable to a computer numerical control (CNC) machining device. The CNC machining device has a cutting fluid tank configured to accommodate a cutting fluid. The cutting fluid digital monitoring and management system includes: a detection tank, configured to extract a cutting fluid from the cutting fluid tank through a motor and an electrically controlled water valve; a concentration sensing module, a pH sensing module, a water hardness sensing module, and a temperature sensing module, respectively configured to obtain a concentration, a pH value, a hardness, and a temperature of the cutting fluid; a processing module, configured to generate a monitoring integration value, compare the monitoring integration value with a standard model, and generate an adjustment signal; and an adjustment module, configured to actively adjust a variable parameter of the cutting fluid according to the adjustment signal.

Abstract: A power supply is provided. The power supply includes a power supply circuit and a control circuit. The power supply circuit includes a voltage converter and multiple point-of-load circuits. The voltage converter generates a third voltage according to a first voltage. The load point-of-load circuits generate at least one second voltage and at least one state signal according to the third voltage. The at least one second voltage is suitable for supplying power to a load. The control circuit is coupled to the power supply circuit. The control circuit determines whether a single event latch-up occurs in the power supply circuit according to the at least one state signal. When the single event latch-up occurs in the power supply circuit, the control circuit switches off the power supply circuit to stop generating the at least one second voltage and the at least one state signal.

Abstract: A method includes forming a fin structure over a substrate, wherein the fin structure comprises first semiconductor layers and second semiconductor layers alternately stacked over a substrate; forming a dummy gate structure over the fin structure; removing a portion of the fin structure uncovered by the dummy gate structure; performing a selective etching process to laterally recess the first semiconductor layers, including injecting a hydrogen-containing gas from a first gas source of a processing tool to the first semiconductor layers and the second semiconductor layers; and injecting an F2 gas from a second gas source of the processing tool to the first semiconductor layers and the second semiconductor layers; forming inner spacers on opposite end surfaces of the laterally recessed first semiconductor layers of the fin structure; and replacing the dummy gate structure and the first semiconductor layers with a metal gate structure.

Abstract: A universal wiper base assembly structure includes a fastening base, a rear base, a combination base, and an outer cover. The fastening base includes a main body and a decorative cover. The main body has a coupling hole, an insertion slot, a protruding platform, a positioning protrusion, a first shaft hole, two limiting arc surfaces, and multiple engagement grooves. The decorative cover has a fastening slot. The rear base includes two contact blocks, a top abutting block, and two hooks. The combination base includes two side plates, a connection plate, an open groove and a second shaft hole. The outer cover includes a fastening block, an opening, and a third shaft hole. Accordingly, a variety of wiper driving arms may be positioned to the universal wiper base assembly structure, so as to improve the convenience in assembling and reduce an overall cost.

Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.

Abstract: Methods of treating a disease caused by a positive strand RNA virus. The methods include administering to a subject in need thereof an effective amount of a compound of Formula I.

Abstract: A power supply is provided. The power supply includes a power supply circuit and a control circuit. The power supply circuit includes a voltage converter and multiple point-of-load circuits. The voltage converter generates a third voltage according to a first voltage. The load point-of-load circuits generate at least one second voltage and at least one state signal according to the third voltage. The at least one second voltage is suitable for supplying power to a load. The control circuit is coupled to the power supply circuit. The control circuit determines whether a single event latch-up occurs in the power supply circuit according to the at least one state signal. When the single event latch-up occurs in the power supply circuit, the control circuit switches off the power supply circuit to stop generating the at least one second voltage and the at least one state signal.

Abstract: Methods of treating a disease caused by a positive strand RNA virus. The methods include administering to a subject in need thereof an effective amount of a compound of Formula I or Formula II.

Abstract: An infrared thermal emitter includes a substrate, a light-emitting unit and an infrared-emitting unit. The light-emitting unit is disposed on the substrate in a laminating direction and has a light-exiting surface away from the substrate. The infrared-emitting unit is disposed on the substrate in the laminating direction to cover the light-emitting unit and includes a layered structure having a light-absorbing layer that is aligned with the light-emitting unit in the laminating direction. The light-absorbing layer absorbs light emitted from the light-emitting unit so as to be heated up and to generate infrared radiation.

Abstract: A physiological information collecting system and a transceiver device thereof are configured to collect physiological information from animal bodies. The transceiver device includes a front-end circuit, a follower circuit, a quadrature delay line and an output circuit. The front-end circuit separates a discontinuous signal into an in-phase signal and a quadrature signal. The follower circuit outputs a control voltage and rotates the in-phase signal by a predetermined phase angle to output a follower signal. The quadrature delay line rotates the quadrature signal by a corresponding phase angle according to the control voltage. The output circuit synthesizes the follower signal and the quadrature signal and outputs a data signal by demodulating the discontinuous signal.

Abstract: A sample processing kit including a centrifugal microfluidic component and a collection component detachably fitted into the microfluidic component is provided. Upon the application of the sample processing kit, target molecules or cells may be separated and collected by the collection component for further experimentation.

Abstract: An infrared thermal emitter includes a substrate, a light-emitting unit and an infrared-emitting unit. The light-emitting unit is disposed on the substrate in a laminating direction and has a light-exiting surface away from the substrate. The infrared-emitting unit is disposed on the substrate in the laminating direction to cover the light-emitting unit and includes a layered structure having a light-absorbing layer that is aligned with the light-emitting unit in the laminating direction. The light-absorbing layer absorbs light emitted from the light-emitting unit so as to be heated up and to generate infrared radiation.

Abstract: A multi-protocol determining method based on a CAN bus is provided, which includes a mode setting step and two or more modes are set in a controller of the CAN bus. The multi-protocol determining method based on the CAN bus includes a listening step, and the modes are taken turns to read a packet from the communicated node. The multi-protocol determining method based on the CAN bus further includes a confirming step. In the confirming step, if the packet is received successfully by one of the modes, the CAN bus is set to work in the corresponding mode. The controller sends one or more requesting packets, each having a communicating request based on a predetermined protocol, to the communicated node, and if the controller receives a feedback packet from the communicated node successfully, the protocol of the communicated node is identified to be the predetermined protocol.

Abstract: A smart diaper sensor, which may be disposed inside a diaper, and may include a sensing element and a wireless RF circuit. The wireless RF circuit may include a transmitter and a wake-up receiver. The wake-up receiver may receive a wake-up signal transmitted from a backend platform to wake up the transmitter. The sensing element may sense the environmental status inside the diaper to generate a sensing signal. The transmitter may receive the sensing signal, and then transmit the sensing signal to the backend platform.