Patents by Inventor Cheng Wen Chen

Cheng Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968869
    Abstract: An electronic device includes a flexible substrate and a conductive wire. The conductive wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings disposed in the metal portion. The metal portion includes a plurality of extending portions and a plurality of joint portions, and each of the openings is surrounded by two of the plurality of extending portions and two of the plurality of joint portions. A ratio of a sum of widths of the plurality of extending portions to a sum of widths of the plurality of joint portions is in a range from 0.8 to 1.2.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: April 23, 2024
    Assignee: InnoLux Corporation
    Inventors: Ya-Wen Lin, Chien-Chih Chen, Yen-Hsi Tu, Cheng-Wei Chang, Shu-Hui Yang
  • Publication number: 20240115227
    Abstract: A phantom-free calibration method for a computerized tomography scan has the steps of: scanning a plurality of homogeneous human tissues with a computerized tomography scanner and obtaining homogeneous human tissue scan information; scanning a tissue to be tested with the computerized tomography scanner and obtaining tissue to be tested scan information; calculating a spectral characteristic parameter of the computerized tomography scanner with a computing device using a model, wherein a standard tissue parameter of the homogeneous human tissues and the human tissue scan information are used in the model; and calculating a tissue parameter of the tissue to be tested with the computing device using the model, wherein the spectral characteristic parameter and the tissue to be tested scan information are inputted in the model. The phantom-free calibration method makes the tissue parameters of the tissue to be tested more accurate and the calibration process easier and more convenient.
    Type: Application
    Filed: July 17, 2023
    Publication date: April 11, 2024
    Inventors: Yi-Wen Chen, Cheng-Ting Shih, Yu-Fen Chen
  • Publication number: 20240120317
    Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.
    Type: Application
    Filed: July 13, 2023
    Publication date: April 11, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Cheng-Hsiung Yang, Chien Te Chen, Cong Zhang, Ching-Chuan Hsieh, Yu-Ying Tan, Juan Zhou, Ai-wen Wang, Yih-Fran Lee, Yu-Wen Huang
  • Publication number: 20240119613
    Abstract: A structured-light three-dimensional (3D) scanning system includes a projector that emits a projected light with a predetermined pattern onto an object; an image capture device that generates a captured image according to a reflected light reflected from the object, the predetermined pattern of the projected light being distorted due to 3D shape of the object, thereby resulting in a distorted pattern; a depth decoder that converts the distorted pattern into a depth map representing the 3D shape of the object; and a depth fusion device that generates a fused depth map according to at least two different depth maps associated with the object.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Inventors: Hsueh-Tsung Lu, Ching-Wen Wang, Cheng-Che Tsai, Wu-Feng Chen
  • Fan
    Patent number: 11946483
    Abstract: A fan is provided herein, including a housing, a hub, and a plurality of blades. The housing includes a top case and a bottom case. The hub is rotatably disposed between the top case and the bottom case in an axial direction. The blades extend from the hub in a radial direction, located between the top case and the bottom case. Each of the blades has a proximal end and a distal end. The proximal end is connected to the hub. The distal end is opposite from the proximal end, located at the other side of the blade, having at least one recessed portion. Each of the recessed portions form a passage for air.
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: April 2, 2024
    Assignee: ACER INCORPORATED
    Inventors: Jau-Han Ke, Tsung-Ting Chen, Chun-Chieh Wang, Yu-Ming Lin, Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 11942420
    Abstract: A semiconductor device includes a first gate structure extending along a first lateral direction. The semiconductor device includes a first interconnect structure, disposed above the first gate structure, that extends along a second lateral direction perpendicular to the first lateral direction. The first interconnect structure includes a first portion and a second portion electrically isolated from each other by a first dielectric structure. The semiconductor device includes a second interconnect structure, disposed between the first gate structure and the first interconnect structure, that electrically couples the first gate structure to the first portion of the first interconnect structure. The second interconnect structure includes a recessed portion that is substantially aligned with the first gate structure and the dielectric structure along a vertical direction.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Guo-Huei Wu, Hui-Zhong Zhuang, Chih-Liang Chen, Cheng-Chi Chuang, Shang-Wen Chang, Yi-Hsun Chiu
  • Publication number: 20240085172
    Abstract: The device includes a projecting device, an image sensor and a computing circuit. The projecting device provides a light beam having a predetermined pattern that is projected onto an object. The image sensor receives the light beam reflected from the object to generate an image. The computing circuit compares the image with a first ground-truth image and a ground-truth image to generate a first depth value and a second depth value respectively. The first and second depth values are combined to generate a depth result.
    Type: Application
    Filed: September 11, 2022
    Publication date: March 14, 2024
    Inventors: Wu-Feng CHEN, Ching-Wen WANG, Cheng Che TSAI, Hsueh-Tsung LU
  • Patent number: 11929019
    Abstract: A method for processing a static pattern in an image and a circuit system are provided. In the method, each of frames of a video is divided into multiple areas. Several algorithms are used to calculate a static pattern index of every area. The static pattern index is used as a reference for determining if the area covers part or entire of a static pattern. An index threshold can be used to check the areas that are determined as the static pattern initially. A time threshold is then used to confirm the areas with the static pattern in every frame. Image data of the areas which are determined as the static patterns can then be adjusted, such as having brightness of the area that is determined as part or entire of the static patterns decreased, for preventing the display panel from negative effects of the static pattern.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: March 12, 2024
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Cheng-Yueh Chen, Ju-Wen Tseng
  • Publication number: 20240079270
    Abstract: A method of forming a semiconductor device includes forming an opening in a dielectric layer, and forming a barrier layer in the opening. A combined liner layer is formed over the barrier layer by first forming a first liner layer over the barrier layer, and forming a second liner layer over the first liner layer, such that the first liner layer and the second liner layer intermix. A conductive material layer is formed over the combined liner layer, and a thermal process is performed to reflow the conductive material layer.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Inventors: Huei-Wen Hsieh, Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen
  • Publication number: 20240071281
    Abstract: A display device includes a display panel and a circuit. For a first sub-pixel, the circuit obtains a corresponding second sub-pixel. The circuit calculates a first compensation value according to the grays levels of the first sub-pixel and the second sub-pixel, and calculates a second compensation value according to the polarity states of the first sub-pixel and the second sub-pixel and the difference between the gray levels of the two sub-pixels. The circuit also calculates a gain according to the position of the first sub-pixel, compensates the gray level to the first sub-pixel according to the first compensation value, the second compensation value and the gain to obtain an output gray level, and drives the first sub-pixel according to the output gray level.
    Type: Application
    Filed: June 16, 2023
    Publication date: February 29, 2024
    Inventors: Cheng-Hsun LEE, Tsai Hsing CHEN, Cheng Che TSAI, Ching-Wen WANG
  • Patent number: 11914941
    Abstract: Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Rachid Salik, Chin-Chang Hsu, Cheng-Chi Wu, Chien-Wen Chen, Wen-Ju Yang
  • Patent number: 10368433
    Abstract: A multi-layer circuit member includes: a first layer formed of a conductive material, the first layer including plural signal pads and a first reference plane spaced apart from the signal pads, the first reference plane including an outer region surrounding the signal pads and an inner region separating the plurality of signal pads; a second layer formed of a conductive material, the second layer including plural signal conductors and a second reference plane spaced apart from the signal conductors, the second reference plane including an outer region surrounding the signal conductors and an inner region separating the signal conductors; a ground layer disposed at a side of the second layer opposite from the first layer; plural dielectric layers separating the first layer, the second layer, and the ground layer.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: July 30, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Chin-Yu Chen, Cheng-Wen Chen, Shun-Jung Chuang, Ke-Hao Chen
  • Publication number: 20180263109
    Abstract: A multi-layer circuit member includes: a first layer formed of a conductive material, the first layer including plural signal pads and a first reference plane spaced apart from the signal pads, the first reference plane including an outer region surrounding the signal pads and an inner region separating the plurality of signal pads; a second layer formed of a conductive material, the second layer including plural signal conductors and a second reference plane spaced apart from the signal conductors, the second reference plane including an outer region surrounding the signal conductors and an inner region separating the signal conductors; a ground layer disposed at a side of the second layer opposite from the first layer; plural dielectric layers separating the first layer, the second layer, and the ground layer.
    Type: Application
    Filed: March 13, 2018
    Publication date: September 13, 2018
    Inventors: CHIN-YU CHEN, CHENG-WEN CHEN, SHUN-JUNG CHUANG, KE-HAO CHEN
  • Patent number: 10027049
    Abstract: An electrical connector includes an insulative housing and a number of contacts received in the insulative housing. The contact includes a first body and a second body extending from the first body. A first protrusion portion is formed by drawing the first body and a second protrusion portion is formed by stamping the second body. The first projecting portion and the second projecting are insert molded in the contact, therefore the contact has a larger intensity.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: July 17, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Shun-Jung Chuang, Chiang-Nan Hung, Cheng-Wen Chen
  • Publication number: 20180034182
    Abstract: An electrical connector includes an insulative housing and a number of contacts received in the insulative housing. The contact includes a first body and a second body extending from the first body. A first protrusion portion is formed by drawing the first body and a second protrusion portion is formed by stamping the second body. The first projecting portion and the second projecting are insert molded in the contact, therefore the contact has a larger intensity.
    Type: Application
    Filed: July 31, 2017
    Publication date: February 1, 2018
    Inventors: SHUN-JUNG CHUANG, CHIANG-NAN HUNG, CHENG-WEN CHEN
  • Publication number: 20100317229
    Abstract: A socket connector having a plurality of connectors, and at least one corresponding plug connector inserts into the socket connector. The socket connector includes a shielding housing having a plurality of sidewalls that define at least one receiving slot, and a body provided with the plurality of connectors and a plurality of conductive contacts assembled to each of the plurality of connectors. The plurality of connectors are different types of I/O connectors arranged in a side-by-side manner. The shielding housing encloses a plurality of walls of the body so that the plurality of connectors are located within the at least one receiving slot. The plug connector includes a plurality of contact receptacles, which correspond to the plurality of different types of connectors, which are arranged in a side-by-side manner.
    Type: Application
    Filed: June 15, 2010
    Publication date: December 16, 2010
    Inventors: Cheng Wen Chen, Yi Wei Chang, Sheng Wen Peng
  • Publication number: 20090120750
    Abstract: A hydraulic brake lever generally includes a brake lever base, a handle hinged to the brake lever base, an oil reservoir and a half cover. The brake lever base may include a connecting portion and a main portion. A top of the connecting portion may be cooperable with the half cover to mount the hydraulic brake lever to a handlebar. The main portion may include a brake lever cylinder. The brake lever cylinder may include a return spring biasing a piston in the brake lever cylinder. The piston may have an outer end hinged with a push rod and another end hinged with the handle. The oil reservoir may be disposed in one side of the connecting portion adjacent the handle, and fluidly coupled to the brake lever cylinder. The position of the oil reservoir may be higher than the position of the brake lever cylinder.
    Type: Application
    Filed: November 9, 2007
    Publication date: May 14, 2009
    Applicant: HSIN-TECH (SHEN ZHEN) CO., LTD
    Inventor: Cheng Wen CHEN
  • Patent number: 7011189
    Abstract: A fine adjusting structure for bicycle disc-brake system is disclosed. The disc-brake system comprises a securing seat mounted on to the fork of the bicycle frame and the securing seat being locked with a braking main body having a driving arm, the wheel of the bicycle being mounted with brake disc for the gripping of the braking main body, characterized in that the top and bottom end of the securing seat are respectively protruded out a locking section toward the braking main body and the securing seat is substantially a ā€œCā€ shaped structure, the top and bottom of the locking section are formed into elongated hole which passes through from top to bottom, the long axis of the elongated hole is extended in the same direction of the wheel axle; and the top and bottom edge of the braking main body are respectively formed into screw holes corresponding to the elongated hole of the locking section of the securing seat.
    Type: Grant
    Filed: February 25, 2004
    Date of Patent: March 14, 2006
    Inventor: Cheng Wen Chen
  • Publication number: 20040188186
    Abstract: A fine adjusting structure for bicycle disc-brake system is disclosed. The disc-brake system comprises a securing seat mounted on to the fork of the bicycle frame and the securing seat being locked with a braking main body having a driving arm, the wheel of the bicycle being mounted with brake disc for the gripping of the braking main body, characterized in that the top and bottom end of the securing seat are respectively protruded out a locking section toward the braking main body and the securing seat is substantially a “C” shaped structure, the top and bottom of the locking section are formed into elongated hole which passes through from top to bottom, the long axis of the elongated hole is extended in the same direction of the wheel axle; and the top and bottom edge of the braking main body are respectively formed into screw holes corresponding to the elongated hole of the locking section of the securing seat.
    Type: Application
    Filed: February 25, 2004
    Publication date: September 30, 2004
    Inventor: Cheng Wen Chen
  • Patent number: 6379725
    Abstract: Protein-based, edible chewable pet toys, such as artificial dog bones, and methods of preparing such chewable pet toys are disclosed. The chewable pet toys are made from protein-based thermoplastic composition containing plant and animal derived proteinic material and various additive and nutrient ingredients. Chewable pet toys within the scope of the present invention possess properties of conventional artificial dog bones made of synthetic polymer, such as good strength and hardness, but they are biodegradable and edible. In addition, the chewable pet toys contain vitamins, minerals, flavorings, oral hygiene additives and other ingredients to help keep teeth and bones strong and to promote the growth and health of the pet.
    Type: Grant
    Filed: September 2, 1998
    Date of Patent: April 30, 2002
    Assignee: Natural Polymer International Corporation
    Inventors: Shu Huan Wang, Cheng-Wen Chen