Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.

Abstract: A method of forming a semiconductor device includes forming an opening in a dielectric layer, and forming a barrier layer in the opening. A combined liner layer is formed over the barrier layer by first forming a first liner layer over the barrier layer, and forming a second liner layer over the first liner layer, such that the first liner layer and the second liner layer intermix. A conductive material layer is formed over the combined liner layer, and a thermal process is performed to reflow the conductive material layer.

Abstract: A solar cell structure includes a semiconductor substrate having a front side and a back side. A pyramid structure is disposed on the front side of the semiconductor substrate. The pyramid structure has an aspect ratio between 0.5-1.2. A front passivation layer is disposed on the pyramid structure. A first anti-reflection layer is disposed on the pyramid structure. The first anti-reflection layer is a multi-layered, graded anti-reflection layer having at least three coating layers. The at least three coating layers comprise a silicon oxynitride layer having a thickness of 15-30 nm and a refractive index between 1.65 and 1.75. The silicon oxynitride layer is an outermost layer of the multi-layered, graded anti-reflection layer.

Abstract: A solar cell structure includes a semiconductor substrate having a front side and a back side; a pyramid structure disposed on the front side of the semiconductor substrate; a front passivation layer disposed on the pyramid structure; and a first anti-reflection layer disposed on the pyramid structure. The first reflective layer is a multi-layered anti-reflection layer having at least three coating layers. A front electrode is provided on the first anti-reflection layer. A rear passivation layer is provided on the back side of the semiconductor substrate. A second anti-reflection layer is disposed on the rear passivation layer. A back electrode is disposed on the second anti-reflection layer.

Abstract: A solar cell structure includes a semiconductor substrate having a front side and a back side; a pyramid structure disposed on the front side of the semiconductor substrate; a anti-reflection layer disposed on the pyramid structure; a front electrode provided on the anti-reflection layer; a passivation layer provided on the back side of the semiconductor substrate; a dielectric layer disposed on the passivation layer; and a back electrode disposed on the dielectric layer. The reflective layer is a multi-layer anti-reflection layer having at least three coating layers.