Abstract: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

Abstract: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

Abstract: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.

Abstract: An image sensor is packaged by attaching the image sensor to a substrate, forming metallic bumps on either the image sensor or a transparent cover, where the metallic bumps are formed in a pattern around the perimeter of the active area of the image sensor. The transparent cover is then glued to the image sensor at the metallic bumps. Electrical connections are formed between the image sensor and the substrate using, for example, conventional wire bonding techniques. The electrical connections are encapsulated within an epoxy for protection. In an embodiment, multiple image sensors are packaged together on the same substrate and separated into individually packaged image sensors by, for example, sawing.

Abstract: A circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon is disclosed. The die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. The first contact point on the die is connected to a first trace bonded to the top surface of the heat-conducting body. An encapsulating cap covers the die. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device.

Abstract: A reflection-based optical encoding apparatus for the detection of position and/or motion of a mechanical device includes an encoding medium having at least a first reflective portion, and an encoder housing having a light-emitting source and a light-detecting sensor embedded within, the encoder housing being placed in proximity to the encoding medium such that a functional light path can be established from the light-emitting source to the light-detecting sensor via the first reflective portion of the encoding medium. The encoder housing includes a first flat facet positioned between the light-emitting source and the encoding medium, the first flat facet having a first angle relative to a common geometric plane such that light passing from the light-emitting source to the encoding medium is refracted along a first angled path in a manner that the refracted light strikes a desired location of the encoding medium.

Abstract: An encoder having a code strip and an emitter-detector module is disclosed. The code strip includes alternating reflective and opaque stripes. The emitter-detector module includes a housing, a lens insert, a light source and a photodetector. Light from the light source illuminates the code strip, and light reflected from the code strip is incident on the photodetector. The lens insert includes a lens that processes light generated by the light source either before the light reaches the code strip or after the light is reflected from the code strip. The lens insert mates with the housing to position the lens at a predetermined point relative to the light source or the photodetector. The housing will accept a plurality of lens inserts, each lens insert having a different lens from the others of the lens inserts.

Abstract: Optical encoders having one or more of a number of disclosed features are disclosed. The features of the optical encoder in accordance with the present invention include a symmetrical (for example, circular) emitter; baffle between the emitter and a detector; double-dome or single-dome encapsulant; multiple detector; and multiple (at least three) data channels.

Abstract: A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Abstract: The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Abstract: A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.

Abstract: The light-emitting device includes a light source and a gradient index (GRIN) element. The GRIN element has a cylindrical refractive index profile in which the refractive index varies radially and is substantially constant axially. The GRIN element includes a first end surface opposite a second end surface and is characterized by a length-to-pitch ratio. The GRIN element is arranged with the first end surface adjacent the light source to receive light from the light source, and emits the light from the second end surface in a radiation pattern dependent on the length-to-pitch ratio. Since the radiation pattern depends on the length-to-pitch ratio of the GRIN element, LEDs with different radiation patterns can be made simply by using GRIN elements of appropriate lengths.

Abstract: A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Abstract: The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Abstract: An optical source includes an optical emitter with an encapsulant covering the optical emitter. A diffractive element is integrated into the encapsulant, wherein the encapsulant passes an optical signal from the optical emitter to the diffractive element.

Abstract: A packaging structure for a semiconductor device includes a substrate surface-mountable on a mounting surface of a circuit board. The substrate has a first side facing away from the mounting surface and a second side being on the same side of the structure as the mounting surface. A recess is formed in the second side of the substrate. A semiconductor die having a first side and a second side is mounted in the recess, with the first side of the semiconductor die facing away from the mounting surface and a portion of the first side of the semiconductor die bonded to the substrate within the recess.

Abstract: A device package has a conductive substrate with at least one mounting site, and an insulating substrate with a first side on the side of the conductive substrate with the one or more mounting sites. The insulating substrate has at least one aperture providing access between a second side of the insulating substrate and the one or more mounting sites. The insulating substrate has one or more signal paths on the second side that couple the one or more apertures to one or more contact sites disposed about the insulating substrate. A series of conductive tabs is coupled to corresponding contact sites.

Abstract: A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned recess. A light emitting diode is mounted in the recess and the substrate is encapsulated by a transparent encapsulant material forming an ellipsoidal dome over the light emitting diode.

Abstract: The present invention provides an electronic package with improved thermal performance. The electronic package includes a thermally conductive heat dissipator and a transmission circuit. The thermally conductive heat dissipator has a first surface and a second surface with the first surface of the thermally conductive heat dissipator including extended portions. The transmission circuit defines a cavity, and includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first and second conductive layers. The second conductive layer is coupled to the second surface of the thermally conductive heat dissipator and the cavity extends through the transmission circuit to the thermally conductive heat dissipator.

Abstract: A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.