Patents by Inventor Cheng-Xuan LIN

Cheng-Xuan LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240112957
    Abstract: A fabrication method is disclosed that includes: forming a first metal layer over first and second semiconductor structures; forming a first patterned photolithographic layer with an opening that exposes a portion of the first metal layer over the first semiconductor structure but not to a boundary between semiconductor structures; removing the exposed portion of the first metal layer; forming a second metal layer over the first and second semiconductor structures; forming a second patterned photolithographic layer with an opening that exposes a portion of the second metal layer over the second semiconductor structure but not to the boundary; removing the exposed portion of the first and second metal layers; wherein a barrier structure is generated between the first and second semiconductor structures that includes remaining portions of the first metal layer and a portion of the second metal layer overlying the remaining portions of the first metal layer.
    Type: Application
    Filed: January 12, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Xuan Wang, Cheng-Chun Tseng, Yi-Chun Chen, Yu-Hsien Lin, Ryan Chia-Jen Chen
  • Patent number: 9348019
    Abstract: An image-sensing apparatus is provided. The image-sensing apparatus includes: an optical filter array including a two-band passing filter and an infrared filter; an RGB pixel array placed below the two-band passing filter; and a TOF pixel array adjacent to the RGB pixel array and placed below the two-band passing filter and the infrared filter, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: May 24, 2016
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Wei-Ko Wang, Chin-Ching Chang, Chia-Hui Wu, Chien-Hsiung Huang, Cheng-Xuan Lin, Chang-Wei Chen
  • Publication number: 20140183334
    Abstract: An image sensor for light field devices includes a plurality of sub-microlenses, a space layer, and a plurality of main microlenses. The space layer is disposed on the sub-microlenses, and the main microlenses are disposed on the space layer. The diameter of each of the main microlenses exceeds that of each of the sub-microlenses.
    Type: Application
    Filed: January 3, 2013
    Publication date: July 3, 2014
    Applicant: VisEra Technologies Company Limited
    Inventors: Wei-Ko WANG, Chin-Ching CHANG, Chia-Hui WU, Chien-Hsiung HUANG, Cheng-Xuan LIN, Chieh-Yuan CHENG, Chang Wei CHEN
  • Publication number: 20140138519
    Abstract: An image-sensing apparatus is provided. The image-sensing apparatus includes: an optical filter array including a two-band passing filter and an infrared filter; an RGB pixel array placed below the two-band passing filter; and a TOF pixel array adjacent to the RGB pixel array and placed below the two-band passing filter and the infrared filter, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array.
    Type: Application
    Filed: November 20, 2012
    Publication date: May 22, 2014
    Inventors: Wei-Ko WANG, Chin-Ching CHANG, Chia-Hui WU, Chien-Hsiung HUANG, Cheng-Xuan LIN, Chang Wei CHEN