Patents by Inventor Cheng Ya-an

Cheng Ya-an has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12002749
    Abstract: Some embodiments of the present disclosure relate to an integrated chip, including a semiconductor substrate and a dielectric layer disposed over the semiconductor substrate. A pair of metal lines are disposed over the dielectric layer and laterally spaced apart from one another by a cavity. A barrier layer structure extends along nearest neighboring sidewalls of the pair of metal lines such that the cavity is defined by inner sidewalls of the barrier layer structure and a top surface of the dielectric layer.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: June 4, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue, Hsiao-Kang Chang
  • Patent number: 11990400
    Abstract: Some embodiments relate to a method for forming an integrated chip, the method includes forming a first conductive wire and a second conductive wire over a substrate. A dielectric structure is formed laterally between the first conductive wire and the second conductive wire. The dielectric structure comprises a first dielectric liner, a dielectric layer disposed between opposing sidewalls of the first dielectric liner, and a void between an upper surface of the first dielectric liner and a lower surface of the dielectric layer. A dielectric capping layer is formed along an upper surface of the dielectric structure. Sidewalls of the dielectric capping layer are aligned with sidewalls of the dielectric structure.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Ya Lo, Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue, Shao-Kuan Lee, Cheng-Chin Lee
  • Publication number: 20240162084
    Abstract: A method for manufacturing a semiconductor structure includes preparing a dielectric structure formed with trenches respectively defined by lateral surfaces of the dielectric structure, forming spacer layers on the lateral surfaces, filling an electrically conductive material into the trenches to form electrically conductive features, selectively depositing a blocking layer on the dielectric structure, selectively depositing a dielectric material on the electrically conductive features to form a capping layer, removing the blocking layer and the dielectric structure to form recesses, forming sacrificial features in the recesses, forming a sustaining layer to cover the sacrificial features; and removing the sacrificial features to obtain the semiconductor structure formed with air gaps confined by the sustaining layer and the spacer layers.
    Type: Application
    Filed: January 26, 2024
    Publication date: May 16, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsin-Yen HUANG, Ting-Ya LO, Shao-Kuan LEE, Chi-Lin TENG, Cheng-Chin LEE, Shau-Lin SHUE, Hsiao-Kang CHANG
  • Patent number: 11980290
    Abstract: A blank dummy structure adaptable for slide rails and absence of slide rails, the blank dummy structure includes a main plate, two buckles, two rotating members, and two fasteners. The buckle comprises a snap component, the snap component is connected with the main plate to slide between first and second positions on the main plate. The rotating member and the snap component are arranged on the same side of the main plate, the rotating member on the main plate, comprises a limiting component. the rotating member being rotatably connected with the main plate to rotate the rotating member between a limit position and an avoidance position. The fastener configured to cooperate with the rack when the rotating member is in the avoidance position. The buckle, the rotating member, and the fastener are mounted on the main plate. A rack is also disclosed.
    Type: Grant
    Filed: August 23, 2022
    Date of Patent: May 14, 2024
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Bin-Bin Yang, Han-Yu Li, Cheng-He Li, Meng-Ya Cui
  • Publication number: 20240088023
    Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Shao-Kuan LEE, Kuang-Wei YANG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Ting-Ya LO, Chi-Lin TENG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Shau-Lin SHUE
  • Publication number: 20240076422
    Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Inventors: Jing-Cherng TSAI, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Jing-Yu LEE, Jun-Ye HONG, Zih-Yu SHIH, Cheng-Hung CHIANG, Gang-Wei SHEN, Yu-Chuan SUNG, Chung-Hua WENG, Hsing-Ya CHEN
  • Patent number: 11923243
    Abstract: A method for manufacturing a semiconductor structure includes preparing a dielectric structure formed with trenches respectively defined by lateral surfaces of the dielectric structure, forming spacer layers on the lateral surfaces, filling an electrically conductive material into the trenches to form electrically conductive features, selectively depositing a blocking layer on the dielectric structure, selectively depositing a dielectric material on the electrically conductive features to form a capping layer, removing the blocking layer and the dielectric structure to form recesses, forming sacrificial features in the recesses, forming a sustaining layer to cover the sacrificial features; and removing the sacrificial features to obtain the semiconductor structure formed with air gaps confined by the sustaining layer and the spacer layers.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue, Hsiao-Kang Chang
  • Publication number: 20240069878
    Abstract: Aspects of the present disclosure provide a method for training a predictor that predicts performance of a plurality of machine learning (ML) models on platforms. For example, the method can include converting each of the ML models into a plurality of instructions or the instructions and a plurality of intermediate representations (IRs). The method can also include simulating execution of the instructions corresponding to each of the ML models on a platform and generating instruction performance reports. Each of the instruction performance reports can be associated with performance of the instructions corresponding to one of the ML models that are executed on the platform. The method can also include training the predictor with the instructions or the IRs as learning features and the instruction performance reports as learning labels, compiling the predictor into a library file, and storing the library file in a storage device.
    Type: Application
    Filed: July 3, 2023
    Publication date: February 29, 2024
    Applicant: MEDIATEK INC.
    Inventors: Huai-Ting LI, I-Lin CHEN, Tsai JEN CHIEH, Cheng-Sheng CHAN, ShengJe HUNG, Yi-Min TSAI, Huang YA-LIN
  • Patent number: 11832967
    Abstract: A wearable physiological signal detecting device includes a device main body and a telescopic structure. The device main body has a strap which surrounds to form a wearable space. The telescopic structure is disposed in the strap and has first surfaces and second surfaces. Each of the first surfaces faces the corresponding second surface. Each of the first surfaces and the corresponding second surface continuously move close and contact each other to assume a first state. The strap can be forced so that each of the first surfaces and the corresponding second surface move away from each other and have an angle to assume a second state. The size of the wearable space when the first surface and the corresponding second surface assume the second state is greater than the size of the wearable space when the first surface and the corresponding second surface assume the first state.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: December 5, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Ken-Ping Lin, Chih-Wen Chiang, Cheng-Ya Chi, Chien-Chu Chen
  • Patent number: 11578728
    Abstract: A fan module including a body and a plurality of blades is provided. The body has a rotating axis and the body is telescopic along the rotating axis to have an elongated state and a shortened state. The blades are respectively disposed on the body and rotate along with the body along the rotating axis. At least a portion of each blade is flexible and a bending state of each blade is changed along with the elongated state or the shortened state of the body. An axial size of each blade along the rotating axis when the body is in the elongated state is greater than the axial size of each blade along the rotating axis when the body is in the shortened state.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: February 14, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Han-Hsuan Tsai, Jui-Min Huang, Wei-Hao Lan, Chien-Chu Chen, Ching-Ya Tu, Chih-Wen Chiang, Ching-Tai Chang, Ken-Ping Lin, Yao-Lin Chang, Cheng-Ya Chi
  • Patent number: 11531380
    Abstract: An electronic device including two bodies and at least one hinge structure is provided. The hinge structure includes a first bracket, a second bracket, a first rotation component, and a second rotation component. The hinge structure is connected to the two bodies via the first bracket and the second bracket respectively. The first rotation component is connected rotatably to the first bracket by taking a first axis as a rotation axis. The second rotation component is connected rotatably to the first rotation component by taking the first axis as a rotation axis, and is connected rotatably to the second bracket by taking a second axis as a rotation axis, wherein the first axis and the second axis are parallel to each other.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: December 20, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Cheng-Ya Chi, Chien-Chu Chen, Ken-Ping Lin, Cheng-Shiue Jan, Yao-Lin Chang, Han-Hsuan Tsai, Jui-Min Huang, Chih-Wen Chiang
  • Patent number: 11480190
    Abstract: A fan module including a first body, a second body, a first fan assembly, a power module, and a second fan assembly is provided. The second body is slidably disposed at the first body to form a circulation space together. The first fan assembly is rotatably disposed at the first body and has sliding grooves. The power module is disposed in the first body and connected to the first fan assembly. The second fan assembly is rotatably disposed at the second body and has sliding portions, respectively and slidably disposed in corresponding sliding grooves. The power module is adapted to drive the first and second fan assemblies to rotate relative to the first body. A link module is adapted to drive the first and second bodies to relatively slide along an axial direction, so that the first and second fan assemblies are relatively separated or overlapped along the axial direction.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: October 25, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Han-Hsuan Tsai, Jui-Min Huang, Wei-Hao Lan, Chien-Chu Chen, Ching-Ya Tu, Chih-Wen Chiang, Ching-Tai Chang, Ken-Ping Lin, Yao-Lin Chang, Cheng-Ya Chi
  • Patent number: 11435972
    Abstract: An immersive multimedia system, an immersive interactive method and a movable interactive unit are provided in the disclosure. The immersive multimedia system includes multiple movable interactive units, an imaging apparatus, and a computer device. The multiple movable interactive units are disposed on at least one of the wall and the ground. The imaging apparatus is adapted to display an image screen on at least one of the wall and the ground. The computer device is connected to the multiple movable interactive units and the imaging apparatus. The computer device is adapted to control the multiple movable interactive units and the imaging apparatus. The multiple movable interactive units each include a touch sensing unit, and the image screen provided by the imaging apparatus changes in response to the touch sensing unit of at least one of the multiple movable interactive units sensing being touched.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: September 6, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Yao-Lin Chang, Ching-Tai Chang, Chien-Chu Chen, Jui-Min Huang, Cheng-Ya Chi, Ken-Ping Lin, Han-Hsuan Tsai, Chih-Wen Chiang
  • Patent number: 11397448
    Abstract: Provided is a notebook computer with a functional body, including a host, a functional body and a display body. The host has a keyboard portion and a receiving portion, and a height difference is formed between the keyboard portion and the receiving portion. The functional body has a first end and a second end. The first end is in pivot connection to the keyboard portion of the host. The display body has a display portion and a base. The second end of the functional body is in pivot connection to the display body. The display body is adapted to be rotated relative to the host and the functional body, so that the base is in contact with the receiving portion to switch to a folded state or a first unfolded state. The functional body is adapted to be rotated relative to the host, so that the base of the display body is relatively away from the receiving portion to switch to a second unfolded state.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: July 26, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Han-Tsai Liu, Chih-Wen Chiang, Jyh-Chyang Tzou, Hsin Yeh, Yao-Hsien Yang, Cheng-Ya Chi
  • Patent number: 11116120
    Abstract: A positioning module includes a positioning element, an arc-shaped guiding unit, an actuating element, and a magnetic element. The positioning element is rotatably disposed at an object. The arc-shaped guiding unit is disposed between the positioning element and the object and is configured to enable the positioning element to rotate on an arc center of the arc-shaped guiding unit. The actuating element is connected to the positioning element and is configured to drive the positioning element. The magnetic element is disposed at another object and is configured to drive the actuating element. An engaging surface of the object is connected to another engaging surface of the another object, and a position of the actuating element corresponds to the magnetic element, so that a portion of the positioning element extends into another accommodation space of the another object. An electronic device having the positioning module is further provided.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: September 7, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Cheng-Ya Chi, Ken-Ping Lin, Chien-Chu Chen, Han-Hsuan Tsai, Yao-Lin Chang, Ching-Tai Chang, Jui-Min Huang
  • Publication number: 20210196208
    Abstract: A physiological signal sensing and compensation system is provided, for contacting an object to be measured and sensing a physiological signal. The physiological signal sensing and compensation system includes a physiological signal sensing module, a compensation module, and a computing unit. The physiological signal sensing module provides an initial sensing signal. The compensation module includes a collecting mechanism for collecting a physiological liquid of the object to be measured. The compensation module provides a compensation signal according to the physiological liquid collected by the collection mechanism. The computing unit is electrically connected to the physiological signal sensing module and the compensation module, and calculates and provides a compensated sensing signal based on the initial sensing signal and the compensation signal.
    Type: Application
    Filed: April 17, 2020
    Publication date: July 1, 2021
    Inventors: Shuen-Yu YU, Cheng-Ya LEE, Kuang-Ching FAN
  • Patent number: D962920
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: September 6, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Han-Tsai Liu, Jyh-Chyang Tzou, Hsin Yeh, Yao-Hsien Yang, Cheng-Ya Chi
  • Patent number: D965585
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: October 4, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Han-Tsai Liu, Jyh-Chyang Tzou, Hsin Yeh, Yao-Hsien Yang, Cheng-Ya Chi
  • Patent number: D965586
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: October 4, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Han-Tsai Liu, Jyh-Chyang Tzou, Hsin Yeh, Yao-Hsien Yang, Cheng-Ya Chi
  • Patent number: D968390
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: November 1, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Cheng-Ya Chi, Hsin Yeh, Pai-Feng Chen, Chien-Chu Chen