Patents by Inventor Cheng-Yan Wu

Cheng-Yan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11757789
    Abstract: The present invention provides a frame transmission method of an electronic device, wherein the frame transmission method includes the steps of: receiving a pause frame from another electronic device, wherein the pause frame includes a plurality of inter frame gap control indicator, and each of the inter frame gap control indicator includes a plurality of packet size ranges and corresponding pause times; selecting one of the inter frame gap control indicator according to a priority of a first packet to be sent to the other electronic device, and determining a first inter frame gap according to which packet size range the first packet belongs to; and after a first frame including the first packet is sent to the other electronic device, at least waiting for the first inter frame gap before starting to send a second frame to the other electronic device.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: September 12, 2023
    Assignee: Realtek Semiconductor Corp.
    Inventors: Han-Yi Hung, Cheng-Yan Wu, Sheng-Pin Lin, Yi-Kuang Ko
  • Publication number: 20230122404
    Abstract: The present invention provides a frame transmission method of an electronic device, wherein the frame transmission method includes the steps of: receiving a pause frame from another electronic device, wherein the pause frame includes a plurality of inter frame gap control indicator, and each of the inter frame gap control indicator includes a plurality of packet size ranges and corresponding pause times; selecting one of the inter frame gap control indicator according to a priority of a first packet to be sent to the other electronic device, and determining a first inter frame gap according to which packet size range the first packet belongs to; and after a first frame including the first packet is sent to the other electronic device, at least waiting for the first inter frame gap before starting to send a second frame to the other electronic device.
    Type: Application
    Filed: September 22, 2022
    Publication date: April 20, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventors: Han-Yi Hung, Cheng-Yan Wu, Sheng-Pin Lin, Yi-Kuang Ko
  • Patent number: 10297943
    Abstract: An electrical receptacle connector includes a plurality of first terminals, a plurality of second terminals, a first insulator, a second insulator, a shielding plate and a third insulator. The first insulator includes a first front insulating portion and a first rear insulating portion. The first front insulating portion covers a part of each of the first terminals. The second rear insulating portion covers another part of each of the first terminals. The second insulator partially covers each of the second terminals. The third insulator partially covers each of the first terminals, the second terminals, the first insulator, the second insulator and the shielding plate.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: May 21, 2019
    Assignee: Advanced Connectek Inc.
    Inventors: Pin-Yuan Hou, Yu-Lun Tsai, Long-Fei Chen, Kang Qin Li, Hsu-Fen Wang, Chien-Tsung Chuang, Cheng-Yan Wu
  • Publication number: 20180323530
    Abstract: An electrical receptacle connector includes a plurality of first terminals, a plurality of second terminals, a first insulator, a second insulator, a shielding plate and a third insulator. The first insulator includes a first front insulating portion and a first rear insulating portion. The first front insulating portion covers a part of each of the first terminals. The second rear insulating portion covers another part of each of the first terminals. The second insulator partially covers each of the second terminals. The third insulator partially covers each of the first terminals, the second terminals, the first insulator, the second insulator and the shielding plate.
    Type: Application
    Filed: May 3, 2018
    Publication date: November 8, 2018
    Applicant: Advanced Connectek Inc.
    Inventors: Pin-Yuan Hou, Yu-Lun Tsai, Long-Fei Chen, Kang Qin Li, Hsu-Fen Wang, Chien-Tsung Chuang, Cheng-Yan Wu