Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.

Abstract: An ink-sack-replaceable ink cartridge includes a cartridge body, which includes a bottom wall, two lateral walls extending upward from two sides of the bottom wall, and two end walls extending upward from two ends of the bottom wall and connected to the lateral walls. The bottom wall, the lateral walls, and the end walls jointly define a receiving space. The bottom wall is formed with a through hole. Each of the lateral walls includes a cartridge-body slide coupling section. A cartridge cover includes a top wall and two side walls extending downward from two sides of the top wall. Each of the side walls includes a cartridge-cover slide coupling section. The cartridge-cover slide coupling sections are slidably connectable with the cartridge-body slide coupling sections, so that the cartridge cover is combinable with and separable from the cartridge body through slidable connection for closing or opening the receiving space.

Abstract: An ink-sack-replaceable ink cartridge includes a cartridge body, which includes a bottom wall, two lateral walls extending upward from two sides of the bottom wall, and two end walls extending upward from two ends of the bottom wall and connected to the lateral walls. The bottom wall, the lateral walls, and the end walls jointly define a receiving space. The bottom wall is formed with a through hole. Each of the lateral walls includes a cartridge-body slide coupling section. A cartridge cover includes a top wall and two side walls extending downward from two sides of the top wall. Each of the side walls includes a cartridge-cover slide coupling section. The cartridge-cover slide coupling sections are slidably connectable with the cartridge-body slide coupling sections, so that the cartridge cover is combinable with and separable from the cartridge body through slidable connection for closing or opening the receiving space.

Abstract: A wafer image capturing apparatus, including a loud/unload system, at least one imaging station and a conveying device, are provided. The loud/unload system contains a plurality of wafers. The at least one imaging includes a platform and an image capturing device. The conveying device includes a movable component for moving the wafer to a platform of at least one imaging station. An image capturing device is configured to capture an image of the wafer. A method for image capturing is also provided, including: operating a conveying device to pick a wafer from a load/unload system and move the wafer to at least one imaging station; and operating at least one image capturing device to capture an image from above or below the imaging station. Thus, the flexibility and efficiency of wafer image capturing can be improved.

Abstract: A connector structure of an ink pouch includes a connector body including a joining section, a sealing section, and an ink passage extending through the joining section and the sealing section, the sealing section having a hollow fitting peg, insertion slots, and an annular retaining groove in communication with the insertion slots; a sealing cap including a pressing section and a fitting trough corresponding in position to the pressing section and engaging and retaining sections, each of which has an insertion arm and an engaging block protruding from the insertion arm; and a flexible plug. To combine, the flexible plug is positioned in the fitting trough and the insertion arms of the engaging and retaining sections are inserted into the insertion slots to have the engaging blocks protrude into the annular retaining groove. The fitting peg is received in the fitting trough and the flexible plug closes the ink passage.

Abstract: A connector structure of an ink pouch includes a connector body including a joining section, a sealing section, and an ink passage extending through the joining section and the sealing section, the sealing section having a hollow fitting peg, insertion slots, and an annular retaining groove in communication with the insertion slots; a sealing cap including a pressing section and a fitting trough corresponding in position to the pressing section and engaging and retaining sections, each of which has an insertion arm and an engaging block protruding from the insertion arm; and a flexible plug. To combine, the flexible plug is positioned in the fitting trough and the insertion arms of the engaging and retaining sections are inserted into the insertion slots to have the engaging blocks protrude into the annular retaining groove. The fitting peg is received in the fitting trough and the flexible plug closes the ink passage.

Abstract: A removal apparatus includes a main body, a carrying device, a heating device and a brush device. The carrying device is disposed on the main body, and includes a holding module for holding a circuit board. The heating device is disposed on the main body for heating up the circuit board to melt bonding material that bonds electronic components and a board body of the circuit board. The brush device is disposed on the main body, and includes at least one brush body that is made of heat-resistant material, and that is operable to move relative to a surface of the circuit board to remove the electronic components from the board body after the bonding material are melted.

Abstract: A removal apparatus includes a main body, a carrying device, a heating device and a brush device. The carrying device is disposed on the main body, and includes a holding module for holding a circuit board. The heating device is disposed on the main body for heating up the circuit board to melt bonding material that bonds electronic components and a board body of the circuit board. The brush device is disposed on the main body, and includes at least one brush body that is made of heat-resistant material, and that is operable to move relative to a surface of the circuit board to remove the electronic components from the board body after the bonding material are melted.

Abstract: The present invention provides a nano-ranged wide color gamut and environmental-friendly UV inkjet printing system for a hard substrate comprising a carrier, an ink supplier, a printing head and a controller. The carrier receives the hard substrate thereon and the ink supplier includes a container space for containing an ink. The color gamut of the ink comprises basic colors of RYBK. The printing head receives the ink from the ink supplier, and the controller generates a control signal to control the printing head to spray coating the ink onto the surface of the hard substrate directly. The present invention is able to print the ink directly onto the surface of the hard substrate while utilizing the UV light for curing the ink into solid. The ink exhibits the physical properties of low surface tension, nano particles, environmental friendly, UV excitable, short duration of drying, great adhesiveness and high transparency.

Abstract: A method of circuit layout by photosensitive environment-friendly ink, which is used in a printed circuit board having a copper foil layer. The method comprises: providing photosensitive environment-friendly ink; disposing a circuit layout pattern, and injecting the photosensitive environment-friendly ink on the copper foil layer according to the circuit layout pattern to form the printed circuit board having the circuit layout pattern thereon; exposing the printed circuit board under light to have the photosensitive environment-friendly ink reacted with ultraviolet light in the light; and copper cleaning and alkaline cleaning the copper foil layer to expose the circuit layout pattern corresponding to the photosensitive environment-friendly ink on the printed circuit board.

Abstract: A nano wide color gamut transparent environment-friendly inkjet ink composition used on a base, which comprises color paste, mixed solvent, resin and additive. The color paste is used for polymerizing red toner, yellow toner, blue toner and black toner having nanoparticles. The mixed solvent is used for diluting the ink composition and being a carrier of the ink composition. The resin is used for providing drip-drying, dispersity and glossiness of the ink composition. The ink composition of the invention can be used to achieve high permeability, wide color gamut, drip drying, low ink bleeding, and high resolution.

Abstract: A method of making a light-guiding module includes the steps of applying a layer of light guide material containing methyl methacrylate oligomers on a reflector, and polymerizing the methyl methacrylate oligomers of the light guide material at a temperature ranging from 60 to 65° C. for 2.5 to 3 hours to form a light guide plate containing polymethylmethacrylate and integrally combining the reflector. Since there is no any gap between the light guide plate and the reflector, the light-guiding module reduces light loss, and improves the luminous efficiency of the backlight unit in which the light-guiding module is used.

Abstract: A light guiding plate includes a substrate made of thermoplastic, and a plurality of optically reflecting particles evenly distributed in the substrate and having an average particle size ranging from 0.1 ?m to 100 ?m. Each reflecting particle has a shell made of a metal oxide such as Al2O3, ZnO or ZrO2, and a core made of SiO2, TiO2, or the same material of the shell. Thus, the light guiding plate has a high light transmittance and can diffuse incident light evenly so that it can be used to substitute a conventional light guiding plate and diffuser combination.

Abstract: An optical device. A guide bar is connected to a base, with a first central axis in an optical axis direction of the optical device. A coil slides on the guide bar and has a second central axis in the optical axis direction and a first central elevation axis. The second central axis is perpendicular to the first central elevation axis. A fixed magnetic member is disposed in the coil and has a central magnetizing axis and a second central elevation axis. The central magnetizing axis is perpendicular to the second central elevation axis and aligned with the second central axis of the coil. The second central elevation axis is separated from the first central elevation axis. A lens housing is connected to the coil. When the coil is energized by application of a current, a magnetic force is generated, moving the coil and lens housing along the guide bar.

Abstract: An optical device. At least one guide bar is connected to a base. A coil is disposed in the base. A central axis of the coil in an optical axis direction of the optical device is parallel to a central axis of the guide bar in the optical axis direction. A lens housing slidably fits on the guide bar. A central axis of the lens housing in the optical axis direction is parallel to that of the guide bar. The lens housing slides along the central axis of the guide bar. A magnetic member is connected to the lens housing opposite the coil, providing a first magnetic field. When the coil is energized to generate a second magnetic field, the lens housing slides on the guide bar by attraction or repulsion of the first and second magnetic fields.

Abstract: A dynamic vibration reduction system, applicable in an electronic product, includes a main buffering unit, an auxiliary buffering unit, and a driving module. The main buffering unit is connected to a carrier of the electronic product to reduce vibrations of the carrier. The auxiliary buffering unit is movably mounted on one side of the carrier. The driving module is assembled in the auxiliary buffering unit to either abut the auxiliary buffering unit against the carrier and reduce the vibration of the carrier, or space the auxiliary buffering unit away from the carrier at a predetermined distance. The vibration reduction of a system is variable with the control of the connection between the auxiliary buffering unit and the carrier to maximize the performance of the electronic product.