Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.

Abstract: A dressing structure comprising a composite substrate layer and a gel layer is provided. The composite substrate layer comprises a first substrate layer and a second substrate layer. The first substrate layer comprises a plurality of first pores. The second substrate layer comprises a plurality of second pores. The second substrate layer and the first substrate layer are flat and unwrinkled. The gel layer is at least disposed between the first substrate layer and the second substrate layer.

Abstract: A dressing is provided. The dressing includes a back layer, a composite substrate, and a gel layer. The back layer has a surface. The composite substrate is disposed on the surface of the back layer, and includes a substrate layer and at least one barrier layer. The barrier layer is disposed between the back layer and the substrate layer. The gel layer is disposed on the composite substrate, wherein the substrate layer is located between the gel layer and the barrier layer. The barrier layer prevents liquid from permeating from the substrate layer to the surface of the back layer.

Abstract: The graphic representation and structure of physical inspection results focuses on renovation of previous health reports primarily including words and numeral data of patient information. The human body system has a unique background of color or gray standard system diagram, while the complaints, physical examination, laboratory data and instrumental examination results of patients are prepared into a patient transparent film (drawing), which shall correspond to standard system diagram with respect to the human size. Then, the patient transparent film is superimposed into a standard system diagram, thereby offering an innovative graphic display of physical inspection report thanks to the transparency of films. And, the reporter may track and collect the medical history and records to prepare a clear and complete report optimally suited for bridging the gap between patients and physicians.