Patents by Inventor Cheng-Yao CHANG

Cheng-Yao CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure sensor package
    Patent number: 11041774
    Abstract: A pressure sensor package includes a package lead frame including a molding plastic layer with a top surface and a plurality of lead frame units mounted in the molding plastic layer, a sidewall disposed on the top surface of the molding plastic layer and surrounding a receiving chamber, a pressure sensor module mounted on the top surface of the molding plastic layer and disposed in the receiving chamber, and a packaging silicone mounted in the receiving chamber to encapsulate the pressure sensor module.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: June 22, 2021
    Assignee: LINGSEN PRECISION INDUSTRIES, LTD.
    Inventors: Ming-Te Tu, Chiung-Yueh Tien, Cheng-Yao Chang, Mei-Yen Su
  • PRESSURE SENSOR PACKAGE
    Publication number: 20190265118
    Abstract: A pressure sensor package includes a package lead frame including a molding plastic layer with a top surface and a plurality of lead frame units mounted in the molding plastic layer, a sidewall disposed on the top surface of the molding plastic layer and surrounding a receiving chamber, a pressure sensor module mounted on the top surface of the molding plastic layer and disposed in the receiving chamber, and a packaging silicone mounted in the receiving chamber to encapsulate the pressure sensor module.
    Type: Application
    Filed: March 16, 2018
    Publication date: August 29, 2019
    Inventors: Ming-Te TU, Chiung-Yueh TIEN, Cheng-Yao CHANG, Mei-Yen SU