Patents by Inventor Cheng-Yeh HSIAO

Cheng-Yeh HSIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D-SHAPED COMPONENT WITH A CIRCUIT TRACE PATTERN AND METHOD FOR MAKING THE SAME
    Publication number: 20130240252
    Abstract: A 3D-shaped component includes a 3D-shaped plastic film having a surface, and a circuit trace pattern that is disposed at the surface of the 3D-shaped plastic film, that is embedded in the 3D-shaped plastic film, and that is made from a cured conductive ink.
    Type: Application
    Filed: December 11, 2012
    Publication date: September 19, 2013
    Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD
    Inventors: Yen-Chou CHEN, Cheng-Yeh HSIAO, Wen-Pao YANG