Patents by Inventor Cheng Yeh

Cheng Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220191624
    Abstract: A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
    Type: Application
    Filed: October 5, 2021
    Publication date: June 16, 2022
    Inventors: Roberto Brioschi, Kazunori Hayata, JR-Cheng Yeh, Dinesh Kumar Solanki
  • Patent number: 11359760
    Abstract: A hinge device for supporting a display device is provided. The hinge device comprises a supporting seat, a shaft, a bearing plate, and an elastic module. The shaft rotatably passes through the supporting seat. The bearing plate is disposed on the shaft, and the display device is disposed on the bearing plate. The elastic module includes a cam and at least one elastic plate. The cam is configured on the shaft, and the cam and the shaft rotate synchronously. A fixed end of the elastic plate is fixed to the supporting seat. The elastic plate has a deformation amount to provide a balance torque to the cam when a free end of the elastic plate abuts against the cam. When an external force is applied on the display device, the bearing plate is actuated to drive the shaft and the cam to rotate to change the deformation amount and the balance torque of the elastic plate. When the external force is removed, the display device can be stopped at once.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: June 14, 2022
    Assignee: SYNCMOLD ENIERPRISE CORP.
    Inventors: Chun-Hao Huang, Chien-Cheng Yeh
  • Publication number: 20220167514
    Abstract: A hinge mechanism being used for a foldable electronic device is provided. The foldable electronic device comprises a first panel body and a second panel body, which are pivotable with respect to each other The hinge mechanism comprises a central plate, a first pivoting element and a second pivoting element. The central plate comprises a first curved section and a second curved section. The first pivoting element is fixed to the first panel body and grips the first curved section. The second pivoting element is fixed to the second panel body and grips the second curved section. When the first pivoting element and the second pivoting element switch between a retracted position and a stretched position, the first panel body and the second panel body change between an unfolded status and a folded status correspondingly.
    Type: Application
    Filed: November 9, 2021
    Publication date: May 26, 2022
    Inventors: Chun-Hao HUANG, Chien-Cheng YEH
  • Patent number: 11341961
    Abstract: A multi-lingual speech recognition and theme-semanteme analysis method comprises steps executed by a speech recognizer: obtaining an alphabet string corresponding to a voice input signal according to a pronunciation-alphabet table, determining that the alphabet string corresponds to original words according to a multi-lingual vocabulary, and forming a sentence according to the multi-lingual vocabulary and the original words, and comprises steps executed by a sematic analyzer: according to the sentence and a theme vocabulary-semantic relationship data set, selectively executing a correction procedure to generate a corrected sentence, an analysis state determining procedure or a procedure of outputting the sentence, outputting the corrected sentence when the correction procedure successes, and executing the analysis state determining procedure to selectively output a determined result when the correction procedure fails.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: May 24, 2022
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Wen-Hsiang Lu, Chun-Yu Chien, Shao-Chuan Shen, Wei-Cheng Yeh
  • Patent number: 11340661
    Abstract: A foldable electronic device is provided. The foldable electronic device comprises a central body, a first hinge module, a second hinge module, a first panel body, and a second panel body. When an external force is applied to rotate the first panel body or the second panel body about the first axis or the second axis, the first hinge module moves synchronously with second hinge module, the second panel body or the first panel body rotates correspondingly, and the first panel body and the second panel body are able to convert between an unfolded state and a folded state relative.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: May 24, 2022
    Assignee: SYNCMOLD ENTERPRISE CORP.
    Inventors: Ching-Hui Yen, Chien-Cheng Yeh, Chun-Hao Huang
  • Patent number: 11334703
    Abstract: Various examples of conductor features in integrated circuit layouts are disclosed herein. In an example, a method includes initializing a layout for fabricating an integrated circuit. A plurality of fill cells is inserted into the layout. The plurality of fill cells includes a plurality of fill line shapes that correspond to conductive lines of the integrated circuit. Thereafter, a design is inserted into the layout that includes a plurality of functional shapes. A conflicting subset of the plurality of fill line shapes of the plurality of fill cells that conflict with the plurality functional shapes are removed. The layout that includes the plurality of fill cells and the design is provided for fabricating the integrated circuit.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: May 17, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Cheng Yeh, Yen-Sen Wang, Ming-Yi Lin
  • Patent number: 11333295
    Abstract: The present invention relates to a tilt stand for bearing a display device. The tilt stand comprises a seat body, a shaft, a tilting frame, and an elastic module. When an external force is applied to the display device to adjust a tilt angle, the tilting frame rotates about the shaft, a positional relationship of the curved surface and the elastic plate is changed, and a deformation amount and a balance torque are changed. When the external force is removed, the tilting frame is stopped at once at a position between the first position and the second position.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: May 17, 2022
    Assignee: SYNCMOLD ENTERPRISE CORP.
    Inventors: Chun-Hao Huang, Chien-Cheng Yeh
  • Publication number: 20220139746
    Abstract: A container includes a container body and an air processing system. The container body includes a plurality of walls defining an interior space for receiving wafers. The air processing system is attached to the container body. The air processing system includes an exchange module, an air extraction module, a first contaminant removal module, a processing module, a second contaminant removal module, a controller module and a power module. The exchange module is coupled to one of the walls of the container body. The air extraction module extracts air from the container body. The first contaminant removal module is coupled to the air extraction module and the exchange module. The processing module is coupled to the air extraction module. The second contaminant removal module is coupled to the processing module and the exchange module. The controller module is configured to turn the air extraction module on and off.
    Type: Application
    Filed: February 24, 2021
    Publication date: May 5, 2022
    Inventors: YOU-CHENG YEH, MAO-CHIH HUANG, YEN-CHING HUANG, YU HSUAN CHUANG, TAI-HSIANG LIN, JIAN-SHIAN LIN
  • Patent number: 11322670
    Abstract: A pixel array substrate has a plurality of sub-pixel regions, wherein a pixel structure of an individual sub-pixel region includes a first signal line, a second signal line, a first contact pad, a second contact pad, a light-emitting diode, a first conductive structure, and a flux structure layer. The first contact pad and the second contact pad are respectively electrically connected with the first signal line and the second signal line. The light-emitting diode is disposed on the first contact pad. A portion of the first conductive structure is disposed between the first contact pad and a first electrode of the light-emitting diode. The flux structure layer partially surrounds the first conductive structure and the light-emitting diode. A top portion of the flux structure layer is higher than a top surface of the first electrode and is lower than a bottom surface of a light-emitting layer of the light-emitting diode.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: May 3, 2022
    Assignee: Au Optronics Corporation
    Inventors: Fang-Cheng Yu, Cheng-Yeh Tsai
  • Patent number: 11317527
    Abstract: A supporting device for bearing a display is provided. The supporting device comprises a base, a hollow housing, a bearing module, a linkage module, and an elastic element, wherein an elastic force provided by the elastic element is the greatest when the hollow housing is in a horizontal position; the elastic force decreases when the hollow housing moves from the horizontal position to a raised position, hence, the hollow housing can stop at any positons between the horizontal position and the raised position.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: April 26, 2022
    Assignee: SYNCMOLD ENTERPRISE CORP.
    Inventors: Chun-Hao Huang, Chien-Cheng Yeh
  • Patent number: 11281835
    Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: March 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tung-Heng Hsieh, Sheng-Hsiung Wang, Hui-Zhong Zhuang, Yu-Cheng Yeh, Tsung-Chieh Tsai, Juing-Yi Wu, Liang-Yao Lee, Jyh-Kang Ting
  • Publication number: 20220077330
    Abstract: A solar cell structure includes a semiconductor substrate having a front side and a back side; a pyramid structure disposed on the front side of the semiconductor substrate; a front passivation layer disposed on the pyramid structure; and a first anti-reflection layer disposed on the pyramid structure. The first reflective layer is a multi-layered anti-reflection layer having at least three coating layers. A front electrode is provided on the first anti-reflection layer. A rear passivation layer is provided on the back side of the semiconductor substrate. A second anti-reflection layer is disposed on the rear passivation layer. A back electrode is disposed on the second anti-reflection layer.
    Type: Application
    Filed: November 17, 2021
    Publication date: March 10, 2022
    Applicant: TSEC Corporation
    Inventors: Cheng-Wen Kuo, Yung-Chih Li, Ying-Quan Wang, Sheng-Kai Wu, Wen-Ching Chu, Yu-Hui Liu, Ta-Ming Kuan, Hung Cheng, Jen-Ho Kang, Cheng-Yeh Yu
  • Publication number: 20220077289
    Abstract: Disclosed are a semiconductor device and a manufacturing method thereof. The method includes: providing a semiconductor substrate; forming a first wordline trench structure; forming a first sacrificial layer at the bottom of the first wordline trench structure; filling the first wordline trench structure located in active regions by epitaxial growth; forming a first insulation layer covering the top of the semiconductor substrate and the first wordline trench structure; forming a second wordline trench structure and a fin-type structure in the active regions, a depth of the second wordline trench structure being less than that of the first wordline trench structure, and a projection of the second wordline trench structure in a vertical direction completely overlapping with a projection of the first sacrificial layer in the vertical direction; removing the first sacrificial layer; and filling the first wordline trench structure, the second wordline trench structure and the wordline tunnel.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Inventors: Qu Luo, Cheng Yeh Hsu
  • Publication number: 20220069448
    Abstract: Aspects of the disclosure relate to methods, apparatus, and systems for mitigating signal attenuation at a body-worn device transmitting a radio signal. An antenna structure for the body-worn device includes an antenna array configured to radiate at least one radio signal and a conductive band capacitively coupled to the antenna array. The conductive band is configured to detachably couple to a body of a user, and mitigate attenuation of the at least one radio signal when the conductive band is coupled to the body. The conductive band mitigates the attenuation by facilitating a radio frequency (RF) signal current corresponding to the at least one radio signal to flow through the conductive band and preventing absorption of the RF signal current by the body.
    Type: Application
    Filed: August 24, 2021
    Publication date: March 3, 2022
    Inventors: Wei Cheng YEH, Rachel Elise RODGERS, Jason Arthur GILL, Sam James DEANE, Eric James BIEL, Charles Edward GREENE
  • Publication number: 20220054948
    Abstract: An attraction system for entertaining guests includes a millimeter wave (mmWave) sensor configured to transmit a signal within the attraction system and to receive a reflection of the signal and a control system communicatively coupled to the mmWave sensor. The mmWave sensor is configured to transmit data to the control system based on the reflection of the signal, and the control system is configured to perform operations that include determining a target operation of the attraction system based on the data received from the mmWave sensor and operating the attraction system based on the target operation.
    Type: Application
    Filed: June 24, 2021
    Publication date: February 24, 2022
    Inventors: Wei Cheng Yeh, Rachel Elise Rodgers
  • Patent number: 11252833
    Abstract: A hinge module and a foldable electronic device comprising the same are disclosed. The hinge module comprises a support piece. The foldable electronic device comprises a central body, a first panel body, a second panel body, and a flexible screen. When the first panel body and the second panel body are in an unfolded state, the flexible screen is flattened and the support piece is located at the first position for the supporting surface abutting against the bendable area of the flexible screen; and when the first panel body and the second panel body are in a folded state, the bendable area is bent, the support piece is located at the second position, and the support piece, the first panel body, and the second panel body collaboratively form a receiving space for accommodating the bendable area of the flexible screen.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: February 15, 2022
    Assignee: SYNCMOLD ENTERPRISE CORP.
    Inventors: Ching-Hui Yen, Chien-Cheng Yeh, Chun-Hao Huang
  • Publication number: 20220037481
    Abstract: Embodiments of the present application provide a semiconductor structure and its fabricating method, and a semiconductor memory. The method of fabricating a semiconductor structure comprises providing a substrate and performing ion implantation on the substrate to form an active area, forming a gate groove on surface of the substrate, measuring depth of the gate groove, and performing ion implantation compensation, if the depth of the gate groove meets a preset condition, on the substrate according to the depth of the gate groove, and forming an ion compensation region in the active area at one side of the gate groove.
    Type: Application
    Filed: October 13, 2021
    Publication date: February 3, 2022
    Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Bing ZOU, Cheng Yeh HSU
  • Publication number: 20210407560
    Abstract: A pseudo-analog memory computing circuit includes at least one input circuit, at least one output circuit and at least one pseudo-analog memory computing unit. Each pseudo-analog memory computing unit is coupled between one of the at least one input circuit and one of the at least one output circuit and has at least one weight mode. Each pseudo-analog memory computing unit generates at least first computing result for a coupled output circuit according to a weight of a selected weight mode and at least one input signals of a coupled input circuit.
    Type: Application
    Filed: June 23, 2021
    Publication date: December 30, 2021
    Inventors: LI CHE CHEN, CHENG JYE LIU, HENG CHENG YEH
  • Publication number: 20210391516
    Abstract: A light emitting device including a substrate, a first pad, a second pad, a light emitting diode, a first connection structure, a second connection structure, and a patterned adhesive layer and a method for manufacturing the same are provided. The first pad and the second pad are located on the substrate. The light emitting diode includes a first semiconductor layer, a second semiconductor layer overlapping the first semiconductor layer, a first electrode and a second electrode. The first electrode and the second electrode are respectively connected to the first semiconductor layer and the second semiconductor layer. The first connection structure electrically connects the first electrode to the first pad. The second connection structure electrically connects the second electrode to the second pad. The patterned adhesive layer is located between the substrate and the light emitting diode and does not contact the first connection structure and the second connection structure.
    Type: Application
    Filed: November 20, 2020
    Publication date: December 16, 2021
    Applicant: Au Optronics Corporation
    Inventors: Fang-Cheng Yu, Cheng-Chieh Chang, Cheng-Yeh Tsai
  • Patent number: D943381
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: February 15, 2022
    Inventor: Jih-Cheng Yeh