Abstract: A fixture for welding fabrication of a golf club head features a golf club head's hitting surface facing up and placed on a platform for a welding process so that a reverse side opposite to the welded hitting surface of the golf club head is held in a V-shaped groove on a fifth clamping part and the golf club head's peripheral surface contacts a first clamping part and a second clamping part; the golf club head can be held among the first clamping part, the second clamping part, a third clamping part driven by a first stroke unit to move toward the first clamping part, and a fourth clamping part driven by a second stroke unit to move toward the second clamping part; the hitting surface can be welded because of the golf club head free from movement toward the reverse side, which is opposite to the welded hitting surface, by means of the fifth clamping part.

Abstract: A flip-chip light-emitting diode (LED) unit includes a substrate, an electrode pad set disposed on the substrate, and three flip-chip LEDs disposed on the electrode pad set in a flip-chip manner and including one first LED and two second LEDs that are spaced apart from the first LED and that are electrically coupled to the first LED in a series configuration.

Abstract: A fiber-optic communication apparatus includes first and second communication devices interconnected by an optical fiber cable. The first communication device converts one of a calibration signal with a predetermined power level and a radio frequency (RF) signal into an optical signal. The second communication device converts the optical signal, which is transmitted through the optical fiber cable, into an electrical signal, detects a power level of the electrical signal associated with the calibration signal, obtains a power attenuation ratio based on the power level detected thereby and the predetermined power level, and adjusts the power level of the electrical signal associated with the RF signal based on the power attenuation ratio.

Abstract: A wavelength converting substance is made of semiconductor material. The wavelength converting substance is suitable for absorbing an exciting light with the wavelength range falling between 300 nanometers and 490 nanometers and converting the exciting light to an emitted light with wavelength range falling between 450 nanometers and 750 nanometers.

Abstract: A sterilization apparatus having UV light capable of assembling to a container is provided. The sterilization apparatus having UV light includes a body, a light-emitting component and a heat dissipating component. The body is detachably assembled to an opening of the container to contact a fluid in the container. The light-emitting component is disposed on the body and emits UV light to irradiate the fluid in the container. The heat dissipating component is disposed in the body and is thermally coupled to the light-emitting component. The body exposes part of the heat dissipating component, such that the heat dissipating component contacts the fluid in the container.

Abstract: A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.

Abstract: A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover.

Abstract: A light source module including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. A first distance is between a top surface of each of the first LED chips away from the upper surface of the substrate and the upper surface, a second distance is between a top surface of the second LED chip away from the upper surface of the substrate and the upper surface, and the second distance is greater than each of the first distances.

Abstract: A lamp structure is disclosed. The lamp structure includes: a lamp cover having a bottom side and light-emitting side opposing to the bottom side, a reflection layer being disposed on the bottom layer; a substrate disposed on the bottom side of the lamp cover; at least one light-emitting unit disposed on the substrate to emit a plurality of light beams; and a reflection member disposed above the light-emitting unit. The light beams are at least reflected by the reflection layer of the lamp cover, and are emitted from the light-emitting side of the lamp cover.

Abstract: A method of forming light emitting diode dies includes: forming an epitaxial layered structure that defines light emitting units on a front surface of a substrate wafer; forming a photoresist layer over a back surface of the substrate wafer; aligning the substrate wafer and patterning the photoresist layer so as to form openings in the photoresist layer, each of the openings having an area less than a projected area of the respective light emitting unit; forming a solder layer on the photoresist layer such that the solder layer fills the openings in the photoresist layer; removing the photoresist layer and a portion of the solder layer that covers the photoresist layer from the substrate wafer; and dicing the substrate wafer.

Abstract: A distributed antenna in-door locating system has multiple antenna units, a head unit and a locating unit. The head unit is wired connected to the multiple antenna units respectively to assign a RF communication band to each user device. The locating unit is connected to the head unit and has a build-in locating process comprising steps of: (a) reading the assigned RF communication bands, and signal strength of RF signals in the assigned RF communication bands. (b) determining a location of each user device based on the assigned RF communication bands of each antenna unit and the signal strength of RF signals in the assigned RF communication bands. A administrator of the distributed antenna in-door locating system can obtain the location of each user device, and further obtain suitable locations for mounting the multiple antenna units in the area.

Abstract: A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover.

Abstract: A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit plural light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold. A separation process is performed to separate the male mold and the other portion of the photocuring resin, the LED and the substrate. A rollover process is performed to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold. A forming process is performed to form a package component with a shape identical to that of the male mold.

Abstract: A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover.

Abstract: A light source module includes a substrate, at least two light emitting diode (LED) chips and at least one dummy chip. The LED chips are disposed on the substrate. The dummy chip is disposed on the substrate and located between the LED chips. The LED chips, the dummy chip and the substrate are electrically connected to one another. The dummy chip is used to redirect a lateral light emitted from the LED chips.

Abstract: A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit plural light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold. A separation process is performed to separate the male mold and the other portion of the photocuring resin, the LED and the substrate. A rollover process is performed to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold. A forming process is performed to form a package component with a shape identical to that of the male mold.

Abstract: A method of transmitting a downlink radio signal from a distributed antenna system to a mobile device is provided. The distributed antenna system includes a plurality of transceivers and a control module. Each of the transceivers receives an uplink radio signal from the mobile device as a respective received signal. Each of the transceivers transmits the received signal to the control module. The control module provides to each of the transceivers the downlink radio signal with a respective intensity, which is determined by the control module according to an intensity of the received signal from the transceiver. Each of the transceivers transmits the downlink radio signal to the mobile device.

Abstract: An adaptive distributed antenna system comprises a control module coupled between multiple base stations, and multiple antenna groups, each of which includes multiple antenna devices each coupled to the control module via a transmission line, and operable to convert an external wireless signal and a transmitting signal from the transmission line respectively into a receiving signal and a signal to be radiated. The control module converts a downlink signal from any base station and the receiving signal from any transmission line respectively into the transmitting signal and an uplink signal. The control module is configured to establish a transmission link between one base station and one antenna device of the antenna groups.

Abstract: A fiber-optic communication apparatus includes first and second communication devices interconnected by an optical fiber cable. The first communication device converts one of a calibration signal with a predetermined power level and a radio frequency (RF) signal into an optical signal. The second communication device converts the optical signal, which is transmitted through the optical fiber cable, into an electrical signal, detects a power level of the electrical signal associated with the calibration signal, obtains a power attenuation ratio based on the power level detected thereby and the predetermined power level, and adjusts the power level of the electrical signal associated with the RF signal based on the power attenuation ratio.

Abstract: A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover.