Patents by Inventor Cheng-Yen Chiang

Cheng-Yen Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED chip package structure using sedimentation and method for making the same
    Patent number: 8623680
    Abstract: An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: January 7, 2014
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Shih-Yu Wu, Chao-Yuan Huang, Ping-Chou Yang, Cheng-Yen Chiang
  • LED CHIP PACKAGE STRUCTURE USING SEDIMENTATION AND METHOD FOR MAKING THE SAME
    Publication number: 20120003765
    Abstract: An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
    Type: Application
    Filed: September 14, 2011
    Publication date: January 5, 2012
    Applicant: HARVATEK CORPORATION
    Inventors: BILY WANG, SHIH-YU WU, CHAO-YUAN HUANG, PING-CHOU YANG, CHENG-YEN CHIANG
  • Led chip package structure using sedimentation and method for making the same
    Publication number: 20100006880
    Abstract: An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
    Type: Application
    Filed: June 4, 2009
    Publication date: January 14, 2010
    Inventors: Bily Wang, Shih-Yu Wu, Chao-Yuan Huang, Ping-Chou Yang, Cheng-Yen Chiang