Abstract: In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A fin field effect transistor (FinFET) device structure is provided. The FinFET device structure includes a plurality of fin structures above a substrate, an isolation structure over the substrate and between the fin structures, and a gate structure formed over the fin structure. The FinFET device structure includes a source/drain (S/D) structure over the fin structure, and the S/D structure is adjacent to the gate structure. The FinFET device structure also includes a metal silicide layer over the S/D structure, and the metal silicide layer is in contact with the isolation structure.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: An electronic device includes a display unit, a voltage generation unit, a grayscale adjustment unit, and an overdriving unit. The display unit has a relationship curve between the transmittance and the driving voltage. The relationship curve has a predetermined voltage value corresponding to the maximum transmittance. The voltage generation unit generates a first voltage according to a first grayscale, and generates a second voltage according to a second grayscale. The grayscale adjustment unit receives a first display grayscale value, and outputs the second grayscale value when the first display grayscale value is equal to the first grayscale. The overdriving unit overdrives the second voltage corresponding to the second grayscale to obtain a first target driving voltage, and it provides the first target driving voltage to the display unit.

Abstract: Methods of manufacturing a semiconductor structure are provided. One of the methods includes: receiving a substrate including a first conductive region of a first transistor and a second conductive region of a second transistor, wherein the first transistor and the second transistor have different conductive types; performing an amorphization on the first conductive region and the second conductive region; performing an implantation over the first conductive region of the first transistor; forming a contact material layer over the first conductive region and the second conductive region; performing a thermal anneal on the first conductive region and the second conductive region; and performing a laser anneal on the first conductive region and the second conductive region.

Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

Abstract: The present invention provides a smart tooth cleaning device comprises a hand piece having a bearing surface, a tooth cleaning piece, a driving module connected to the tooth cleaning piece for driving the tooth cleaning piece to move, a first camera module comprising a first optical lens and a first image capturing element, and a first light source module comprising a plurality of light-emitting elements. The tooth cleaning piece has a tooth cleaning body, a brush head, and a plurality of bristles. The first camera module is disposed on the bearing surface and is electrically connected to the control module. The first image capturing element receives light along an optical axis of the first optical lens. A first angle ?1 between the optical axis and a first direction, is in a range of 5°to 30°. The first light source module is disposed on the bearing surface.

Abstract: The present invention relates to a cursor control system, including a first electronic device, a second electronic device, and a mouse. The mouse is wirelessly connected to the first electronic device and the second electronic device and may move a cursor on a first working desktop corresponding to the first electronic device or a second working desktop corresponding to the second electronic device. When receiving a drive signal from the mouse, the first electronic device displays a jump image on the first working desktop. When the cursor is moved to the jump image, the mouse may transmit a switching signal to the second electronic device according to a masking signal from the first electronic device, so that the second electronic device can display the cursor on the second working desktop.

Abstract: Disclosures of the present invention describe an unlimited multiplexing testing system for press type switch, which mainly consists of a main board, a plurality of fixing bases, a test controlling module, a first interface unit, a button punching module, and a host device. Particularly, this novel unlimited multiplexing testing system is able to apply at least one button punching test procedure to a great quantity of mechanical switch components, keyboards or computer mice, thereby completing any one type of standard button punching test, such as life cycle test, loading test or endurance test. On the other hand, this unlimited multiplexing testing system can also be adopted for achieving any one of the foregoing standard button punching tests on the mechanical switch components, keyboards and computer mice, simultaneously.

Abstract: Disclosures of the present invention describe an unlimited multiplexing testing system for press type switch, which mainly consists of a main board, a plurality of fixing bases, a test controlling module, a first interface unit, a button punching module, and a host device. Particularly, this novel unlimited multiplexing testing system is able to apply at least one button punching test procedure to a great quantity of mechanical switch components, keyboards or computer mice, thereby completing any one type of standard button punching test, such as life cycle test, loading test or endurance test. On the other hand, this unlimited multiplexing testing system can also be adopted for achieving any one of the foregoing standard button punching tests on the mechanical switch components, keyboards and computer mice, simultaneously.

Abstract: An input module includes a keyboard device and an application program. The application program is installed in a host device. The application program generates a host message according to a host type of the host device and transmits the host message to the keyboard device. After a key of the keyboard device is depressed, a processing unit of the keyboard device generates a key code corresponding to the host type according to the received host message and transmits the key code to the host device. The present invention further provides an input method for the input module.

Abstract: An input device detection system includes a foundation, a cover plate and a trajectory detection plate. The foundation includes a base plate and plural first retractable rods. The base plate has a top surface, a bottom surface and a detection hole. The input device is pushed by the plural first retractable rods along a horizontal direction. The input device is pushed by plural second retractable rods of the cover plate along a vertical direction. The trajectory detection plate is located under the base plate. An optical sensing module of the input device emits a light beam. The light beam is transmitted through the detection hole and projected to the trajectory detection plate. When the trajectory detection plate is moved relative to the foundation and the light beam is reflected to the optical sensing module by the trajectory detection plate, a trajectory signal is generated.

Abstract: An adapter with an instrument control function, an instrument control system and an instrument control method are provided. The instrument control system includes a computer and a measuring instrument. The measuring instrument has a characteristic data. The computer and the measuring instrument are in communication with a first transmission interface and a second transmission interface of the adapter, respectively. The adapter detects the characteristic data, and compares the characteristic data with a database of the adapter. If a specified parameter profile corresponding to the characteristic data is present in the database according to the comparing result, the specified parameter profile is transmitted to the computer through the first transmission interface. A setting of a test program is completed according to the specified parameter profile. Consequently, the test program executes a task of testing the measuring instrument.

Abstract: The present invention relates to a cursor control system, including a first electronic device, a second electronic device, and a mouse. The mouse is wirelessly connected to the first electronic device and the second electronic device and may move a cursor on a first working desktop corresponding to the first electronic device or a second working desktop corresponding to the second electronic device. When receiving a drive signal from the mouse, the first electronic device displays a jump image on the first working desktop. When the cursor is moved to the jump image, the mouse may transmit a switching signal to the second electronic device according to a masking signal from the first electronic device, so that the second electronic device can display the cursor on the second working desktop.

Abstract: A circuit test system is provided for testing a circuit of a circuit board. The circuit test system includes a test platform, a pressing plate and a computing device. The test platform includes plural contact elements. Each contact element includes a strain gauge and a pogo pin. During the process of testing the circuit board, a test program of the computing device monitors and reads a pressure value, a downward displacement and an impedance value of the contact element. Moreover, the test program judges whether the function of the contact element is normal according to the pressure value, the downward displacement and the impedance value.

Abstract: A circuit test system is provided for testing a circuit of a circuit board. The circuit test system includes a test platform, a pressing plate and a computing device. The test platform includes plural contact elements. Each contact element includes a strain gauge and a pogo pin. During the process of testing the circuit board, a test program of the computing device monitors and reads a pressure value, a downward displacement and an impedance value of the contact element. Moreover, the test program judges whether the function of the contact element is normal according to the pressure value, the downward displacement and the impedance value.