Abstract: A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.

Abstract: A lampshade including a plurality of plate structures is provided. The plurality of plate structures are connected to one another to form a hollow casing having an opening. An illumination module including a base plate, a light source, and a lampshade is further provided. The light source is disposed on the base plate. The lampshade is covered on the base plate, and the light source is sited between the base plate and the lampshade. The lampshade includes a plurality of plate structures, wherein the plurality of plate structures are connected to one another to form a hollow casing having an opening.

Abstract: A light source module includes a base plate, a projection, and a plurality of light-emitting devices. The projection is disposed on the base plate. The light-emitting devices surround the projection and are disposed on the projection.

Abstract: A common mode filter includes a first coil, a second coil, a first insulating layer separating the first coil from the second coil, a third coil serially connected with the first coil, a second insulating layer separating the second coil from the third coil, a fourth coil serially connected with the second coil, and a third insulating layer separating the third coil from the fourth coil. The second coil is between the first and third coils, and the third coil is between the second and fourth coils. At least one of the first insulating layer, the second insulating layer and the third insulating layer may include magnetic material.

Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.

Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, and a fourth coil connected in series with the second coil. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils.

Abstract: A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.

Abstract: A manufacturing method of a single chip semiconductor coating structure includes following steps. Step 1 is providing a single chip semiconductor which has a plurality of surfaces, and two opposite surfaces selected from the plurality of surfaces are manufacturing surfaces and have a conductive area with a pad thereon, respectively. Step 2 is providing a tool to cover one of the conductive areas with the pad. Step 3 is providing a coating step to form an insulating layer on the single chip semiconductor. Step 4 is providing a removing step to remove the insulating layer for exposing the covered conductive area and the pad. Step 5 is forming two electrodes and each of the two electrodes covers the conductive area with the pad.

Abstract: A supply system capable of providing a working fluid is provided. The supply system includes an access device, a first energizer, a second energizer, a third energizer and an output device. The access device utilized to access the working fluid includes a connecting port. The first energizer provides a first energy to energize the working fluid, thereby expelling the bubbles from the working fluid. The second energizer provides a second energy to energize the working fluid received in the access device, thereby expelling the working fluid through the connecting port of the access device. The output device is connected to the access device, thereby receiving and outputting the working fluid. The third energizer provides a third energy to heat the working fluid passing through the access device and the output device.

Abstract: A supply system capable of providing a working fluid is provided. The supply system includes an access device, a first energizer, a second energizer, a third energizer and an output device. The access device utilized to access the working fluid includes a connecting port. The first energizer provides a first energy to energize the working fluid, thereby expelling the bubbles from the working fluid. The second energizer provides a second energy to energize the working fluid received in the access device, thereby expelling the working fluid through the connecting port of the access device. The output device is connected to the access device, thereby receiving and outputting the working fluid. The third energizer provides a third energy to heat the working fluid passing through the access device and the output device.

Abstract: A manufacturing method of a single chip semiconductor coating structure includes following steps. Step 1 is providing a single chip semiconductor which has a plurality of surfaces, and two opposite surfaces selected from the plurality of surfaces are manufacturing surfaces and have a conductive area with a pad thereon, respectively. Step 2 is providing a tool to cover one of the conductive areas with the pad. Step 3 is providing a coating step to form an insulating layer on the single chip semiconductor. Step 4 is providing a removing step to remove the insulating layer for exposing the covered conductive area and the pad. Step 5 is forming two electrodes and each of the two electrodes covers the conductive area with the pad.

Abstract: A probing apparatus for integrated circuit testing at least includes a substrate, a probe body and a bypass capacitor. The substrate is fixed in an external conductor after an internal conductor is filled with an insulating material. One end of the substrate has a section, so that both the internal conductor and the insulating material are exposed on the section. One end of the probe body is electrically connected to the internal conductor exposed on the section. A tip end of the probe body is used for contacting a pad of an element to be tested. The bypass capacitor has a first electrode terminal and a second electrode terminal. The first electrode terminal is electrically connected to the probe body, and the second electrode terminal is connected to the external conductor at the end of the substrate.

Abstract: A chip-scale semiconductor device package includes a die, an insulating substrate having a through hole, a first metal layer, a second metal layer, and an insulating layer. The first metal layer is on a first surface of the insulating substrate and a first side of the through hole. The insulating layer is overlaid on a second surface of the insulating substrate and surrounds a second side of the through hole. The second metal is on the insulating layer and the second side of the through hole. The die is in the through hole and includes a first electrode and a second electrode. The first electrode is electrically connected to the first metal layer, and the second electrode is electrically connected to the second metal layer.

Abstract: A manufacturing method of a single chip semiconductor coating structure includes following steps. Step 1 is providing a single chip semiconductor which has a plurality of surfaces, and two opposite surfaces selected from the plurality of surfaces are manufacturing surfaces and have a conductive area with a pad thereon, respectively. Step 2 is providing a tool to cover one of the conductive areas with the pad. Step 3 is providing a coating step to form an insulating layer on the single chip semiconductor. Step 4 is providing a removing step to remove the insulating layer for exposing the covered conductive area and the pad. Step 5 is forming two electrodes and each of the two electrodes covers the conductive area with the pad.

Abstract: A security monitor method and monitor apparatus utilizing a RFID tag. A wearer wears a RFID tag having an acceleration sensor and a magnetic field sensor. The status of the wearer is determined by an acceleration variation and an angle variation of an included angle with the terrestrial magnetism on X axis, Y axis and Z axis detected and calculated by the acceleration sensor and the magnetic field sensor. If the status determined is abnormal, the monitor apparatus transmits wireless warning signals to monitor ends such as a hospital or a home for the aged.

Abstract: An apparatus for roll-to-roll processing includes a first roller for converting the transmission of a roll of flexible material from a first direction to a second direction substantially orthogonal to the first direction, a second roller spaced apart from the first roller and extending transversely with respect to the first roller for converting the transmission of the roll of flexible material from the second direction to a third direction substantially orthogonal to the first direction and the second direction, and a third roller spaced apart from the second roller and extending perpendicularly with respect to the first roller for converting the transmission of the roll of flexible material from the third direction to a fourth direction, wherein the roll of flexible material includes a first side and a second side, and wherein the first roller, the second roller and the third roller contact the same one of the first side and the second side of the roll of flexible material.

Abstract: A common mode filter comprises an insulating substrate, a lower coil leading layer, a coil main body multilayer, and an upper coil leading layer. The upper coil leading layer comprises at least one upper lead, at least one upper terminal, and at least one upper contact, and the lower coil leading layer comprises at least one lower lead, at least one lower terminal, and at least one lower contact. The two ends of the upper lead are respectively connected to the upper terminal and the upper contact, and the upper lead surrounds the upper contact. The two ends of the lower lead are respectively connected to the lower terminal and the lower contact, and the lower lead surrounds the lower contact. The upper coil leading layer and the lower coil leading layer sandwich the coil main body multi-layer, and the lower coil leading layer is disposed on the insulating substrate.

Abstract: A supply system capable of providing a working fluid is provided. The supply system includes an access device, a first energizer, a second energizer, a third energizer and an output device. The access device utilized to access the working fluid includes a connecting port. The first energizer provides a first energy to energize the working fluid, thereby expelling the bubbles from the working fluid. The second energizer provides a second energy to energize the working fluid received in the access device, thereby expelling the working fluid through the connecting port of the access device. The output device is connected to the access device, thereby receiving and outputting the working fluid. The third energizer provides a third energy to heat the working fluid passing through the access device and the output device.

Abstract: A probe card and a method for assembling the same, the probe card has a base plate, a plurality of probes, a fixing ring, and a fixing member. The fixing ring is provided with a hole and the outer wall of its bottom is used for connecting the probes. The fixing ring is spaced from the probes in a distance so that when the fixing ring is inserted through a hole of the base plate, the terminal ends of main bodies of the probes are located under the hole while the anterior ends are electronically connected with the base plate or outer circuit. The fixing member is inserted through the hole of the fixing ring, the terminal end of which protrudes out of the hole so that a micro strip line is formed between the terminal end of the fixing member and the terminal ends of the probes.

Abstract: A liquid cosmetics container has a brushing device, which includes an applying component joined to a container body, and a clipping component around the applying component; the applying component is positioned over an opening of the container body, and has a passage therein for liquid cosmetics to flow through; the applying component has an applying portion at a tail, which is around a tail end of the passage; the clipping element has an opening end, and two gaps extending through the opening end, therefore the opening end is compressible; the clipping component has two opposing clipping portions on an inner side of the opening end; a cap is used to cover the opening of the container body; the cap has a squeezing portion on an inner side to compress the opening end of the clipping component so as to block the passage of the applying component.