Patents by Inventor Cheng-Yi Yang

Cheng-Yi Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12219258
    Abstract: An anti-shake assembly with reduced size is disclosed which includes a circuit board, a photosensitive chip, and a magnetic component. The circuit board includes a first rigid board, a second rigid board, a plurality of connectors, and a plurality of coils. The first rigid board has a housing space. The second rigid board is movably housed in the housing space. The connectors are flexibly connected between the first rigid board and the second rigid board. The photosensitive chip and the coils are provided on the second rigid board. The magnetic component includes a base and a plurality of magnets. The base includes a central plate and a side plate. The side plate is arranged around a periphery of the central plate to form a housing space. The magnets are provided on the central plate facing the housing space. The magnets are arranged opposite to the coils.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: February 4, 2025
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Cheng-Yi Yang, Qiang Song, Yan-Qiong He, Yao-Cai Li, Biao Li, Zu-Ai Li, Mei-Hua Huang
  • Publication number: 20250022668
    Abstract: A multilayer polymer capacitor (MLPC), including a casing, a multilayer core, an electroplated positive terminal, a first electroplated negative terminal, and a second electroplated negative terminal. The casing includes a casing body and a cover plate. The casing body is provided with an accommodating cavity, whose bottom is provided with a through hole. The multilayer core is provided in the accommodating cavity. An anode lead-out part and a cathode lead-out part are provided at two ends of the accommodating cavity, respectively. The electroplated positive terminal and the first electroplated negative terminal are provided on outer side surfaces of two ends of the casing, respectively. The second electroplated negative terminal is provided on an outer bottom surface of the casing, and is electrically connected to the multilayer core.
    Type: Application
    Filed: September 29, 2024
    Publication date: January 16, 2025
    Inventors: CHENG-YI YANG, I-CHU LIN, YUAN-YU LIN, CHIN-TSUN LIN, Qirui CHEN, HSIU-WEN WU
  • Publication number: 20240427399
    Abstract: The disclosed technology is directed to a computing device for detecting and preventing melting of a component of the computing device. In some examples, the computing device includes a cable that connects a power supply unit and an add-on card, and a thermal protection controller. Based on a sensor signal from a temperature sensor of the cable, the thermal protection controller determines that a temperature associated with the cable exceeds a threshold temperature. Responsive to determining that the temperature associated with the cable exceeds the threshold temperature, the thermal protection controller causes the power supply unit to cease supplying power to the add-on card by transmitting an overtemperature signal through the cable.
    Type: Application
    Filed: June 26, 2023
    Publication date: December 26, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wen-Bin Lin, Chao-Wen Cheng, Cheng-Yi Yang, Chien-Wei Chen
  • Patent number: 12156348
    Abstract: An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.
    Type: Grant
    Filed: December 28, 2023
    Date of Patent: November 26, 2024
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Cheng-Yi Yang, Hao-Wen Zhong, Biao Li, Ming-Jaan Ho, Ning Hou
  • Patent number: 11991838
    Abstract: An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: May 21, 2024
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Cheng-Yi Yang, Hao-Wen Zhong, Biao Li, Ming-Jaan Ho, Ning Hou
  • Publication number: 20240130050
    Abstract: An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Inventors: Cheng-Yi Yang, Hao-Wen Zhong, Biao Li, Ming-Jaan Ho, Ning Hou
  • Publication number: 20240103577
    Abstract: In one example, an electronic device may include a main body, and a back cover having an opening. The back cover may include an inner surface, and a hook protruding from the inner surface. The hook may be engageable with a receiving portion of the main body to slidably couple the back cover to the main body. Further, electronic device may include a component housing connected to the main body through the opening in the back cover to fixedly couple the back cover to the main body.
    Type: Application
    Filed: November 5, 2019
    Publication date: March 28, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Cheng-Yi Yang, Szu Tao Tong, Hai-Lung Hung
  • Publication number: 20230289302
    Abstract: In example implementations, a computing device is provided. The computing device includes a memory bus, a first memory module connected to a first slot of the memory bus, a second memory module connected to a second slot of the memory bus, and a processor communicatively coupled to the memory bus. The processor is to detect a mixed memory module configuration caused by the first memory module and the second memory module and train the first memory module and the second memory module to operate at a maximum mixed memory module configuration speed.
    Type: Application
    Filed: March 10, 2022
    Publication date: September 14, 2023
    Inventors: Wen-Bin Lin, Chao-Wen Cheng, Cheng-Yi Yang
  • Publication number: 20230284406
    Abstract: Example latching assemblies and electronic devices including the latching assemblies are disclosed. In an example, an electronic device includes a housing including a cavity to receive a peripheral device therein. In addition, the electronic device includes a latching assembly disposed within the housing. The latching assembly includes a latch biased toward the cavity to engage with the peripheral device, and a block. Displacement of the block is to slidingly engage the block along the latch and thereby withdraw the latch from the cavity.
    Type: Application
    Filed: January 30, 2020
    Publication date: September 7, 2023
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Cheng-Yi Yang, Timothy Arthur Kubicki, Owen P. Columbus, Matthew William Tivnon
  • Publication number: 20230071772
    Abstract: Examples of electronic devices and connectors for providing a secure connection are described herein. In an example, an electronic device may securely hold an external device, upon engagement of a connector of the external device in a corresponding port of the electronic device.
    Type: Application
    Filed: January 31, 2020
    Publication date: March 9, 2023
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Hai-Lung Hung, Cheng-Yi Yang, Po Cheng Liao
  • Patent number: 11599190
    Abstract: In an example, an electronic device may include a housing and a first acoustic device pivotally disposed in the housing. The first acoustic device may move between a first position within the housing and a second position outside the housing. The first acoustic device may direct an acoustic signal in a direction. Further, the electronic device may include a camera to capture an image of an area in front of the electronic device. Furthermore, the electronic device may include a processor operatively coupled to the camera and the first acoustic device. The processor may determine a location of a facial feature of an operator using the captured image. Further, the processor may control an angle of rotation of the first acoustic device relative to the housing based on the location of the facial feature to modify the direction of the acoustic signal.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: March 7, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chih-Hua Chen, Cheng-Yi Yang, Hai-Lung Hung
  • Publication number: 20220413600
    Abstract: In an example, an electronic device may include a housing and a first acoustic device pivotally disposed in the housing. The first acoustic device may move between a first position within the housing and a second position outside the housing. The first acoustic device may direct an acoustic signal in a direction. Further, the electronic device may include a camera to capture an image of an area in front of the electronic device. Furthermore, the electronic device may include a processor operatively coupled to the camera and the first acoustic device. The processor may determine a location of a facial feature of an operator using the captured image. Further, the processor may control an angle of rotation of the first acoustic device relative to the housing based on the location of the facial feature to modify the direction of the acoustic signal.
    Type: Application
    Filed: June 23, 2021
    Publication date: December 29, 2022
    Inventors: Chih-Hua CHEN, Cheng-Yi Yang, Hai-Lung Hung
  • Publication number: 20220350376
    Abstract: In some examples a computing device can comprise a back plate and an electrical connection. The electrical connection is not in contact with a detect mechanism if a first voltage is generated; and the detect mechanism is in contact with the electrical connection if a second voltage is generated.
    Type: Application
    Filed: October 18, 2019
    Publication date: November 3, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Cheng-Yi Yang, Szu-Tao Tong, Hai-Lung Hung, Chia Ching Lu
  • Patent number: 11460392
    Abstract: A non-contact fiber permeability measurement system includes a mold device, a fluid supplying device, a capacitance detecting device and a permeability converting device. The mold device includes an upper plate, a lower plate and a fluid inlet. The lower plate is parallel to and disposed below the upper plate for forming an accommodating space disposing a measured fibrous fabric insulated against the upper plate and the lower plate. The fluid inlet is disposed through the upper plate. The fluid supplying device is connected to the mold device and for providing a fluid perfused from the fluid inlet into the accommodating space. The capacitance detecting device is electrically connected to the upper plate and the lower plate. The permeability converting device is electrically connected to the capacitance detecting device and for receiving the capacitance detected via the capacitance detecting device to convert the capacitance to a permeability.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: October 4, 2022
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Yuan Yao, Cheng-Yi Yang
  • Publication number: 20220290703
    Abstract: An apparatus may include a collar, a first bracket and a second bracket. The collar may be retained in a substrate through hole of a substrate. For example, a portion of the collar may be inserted into the substrate through hole. The first bracket may include a first bracket screw hole and the second bracket may include a second bracket screw hole. The second bracket may be adjustable from a first (down) position to a second (upright) position. When the second bracket is in the first position, a mount retaining screw may be received through the first bracket screw hole to retain a mount to the substrate for a first thickness of the substrate. When the second bracket is in the second position, the mount retaining screw may be received through the second bracket screw hole to retain the mount to adjust to a second thickness of the substrate.
    Type: Application
    Filed: July 31, 2019
    Publication date: September 15, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hai-Lung Hung, Cheng-Yi Yang, Szu Tao Tong
  • Publication number: 20220225512
    Abstract: An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.
    Type: Application
    Filed: March 31, 2022
    Publication date: July 14, 2022
    Inventors: CHENG-YI YANG, HAO-WEN ZHONG, BIAO LI, MING-JAAN HO, NING HOU
  • Publication number: 20220208317
    Abstract: An image content extraction method and an image content extraction device are disclosed. The method includes the following. An image file is obtained; the image file is analyzed to obtain distribution information of at least one grid in an image frame corresponding to the image file; template information is determined according to the distribution information of the at least one grid; text information is extracted from the image file according to the template information; and integration information related to a medical record of a user is generated according to the text information.
    Type: Application
    Filed: December 29, 2020
    Publication date: June 30, 2022
    Applicant: Industrial Technology Research Institute
    Inventors: Cheng-Yi Yang, Cheng-Liang Lin, Hsing-Chen Lin
  • Publication number: 20220192507
    Abstract: A method for dynamic physiological characteristic region capturing includes: detecting a human body and generate thermal images with continuous time-sequence data; detecting the thermal images and locate a skeleton from one thermal images; based on the skeleton to capture a nose and a human face, the human face is set as an ROI is further divided into image blocks; relating the image blocks to the thermal images; based on variation of temperature information in continuous time-sequence data for the image blocks to divide the image blocks into the first and the second frequency variation blocks; and, analyzing the temperature information in the continuous time-sequence data to the first and the second frequency variation blocks to obtain different physiological information of the human body. In addition, a system for the same is also provided.
    Type: Application
    Filed: December 17, 2020
    Publication date: June 23, 2022
    Inventors: Hsing-Chen Lin, Cheng-Yi Yang, Zhong-Wei Liao, Cheng-Lii Chang
  • Publication number: 20210389112
    Abstract: A detection device includes: a body; a first set of at least three contact areas on the body to contact a corresponding set of at least three contact areas of a central processing unit (CPU) cover; and a second set of at least three contact areas on the body to contact a set of at least three contact areas on heatsink componentry. An incorrect assembly position of a heatsink is indicated when one or more points of contact with the heatsink componentry and the CPU cover is incorrect.
    Type: Application
    Filed: December 11, 2018
    Publication date: December 16, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hai-Lung Hung, Cheng-Yi Yang, Szu Tao Tong
  • Patent number: 11157647
    Abstract: An access system, an access device and an access method for accessing health information are disclosed. The access system includes a decentralized database for recording an authorization file corresponding to health information and a public key corresponding to the authorization file, a centralized database for using the public key corresponding to the authorization file to encrypt and store the health information corresponding to the authorization file into an access space, and an access device for issuing an access request of health information to the decentralized database based on user identification, for the decentralized database to identify and authorize the user identification based on the authorization file corresponding to the health information and ratify the access request and provide an instruction after identifying and authorizing the user identification, and for acquiring the encrypted health information from the access space based on the instruction.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: October 26, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Yi Yang, Yu-Chieh Pan, Hsing-Chen Lin