Patents by Inventor CHENG-YING LEE

CHENG-YING LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240247773
    Abstract: A package structure includes a carrier, a frame, and at least one photonic device. The carrier includes a substrate and a plurality of first metal pads and second metal pads. The substrate includes a first surface and a second surface that are opposite to each other. The first metal pads are disposed on the first surface. The second metal pads are disposed on the second surface. A thickness of each of the second metal pads is greater than that of each of the first metal pads. The frame is disposed on the carrier, and an accommodating space is formed between the frame and the carrier. The at least one photonic device is disposed in the accommodating space.
    Type: Application
    Filed: April 8, 2024
    Publication date: July 25, 2024
    Inventors: CHEN-HSIU LIN, CHENG-YING LEE, MING-SUNG TSAI
  • Patent number: 11959606
    Abstract: A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: April 16, 2024
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Cheng-Ying Lee, Ming-Sung Tsai
  • Patent number: 11787332
    Abstract: A light-emitting device includes a substrate including circuit pads and a resin portion. A frame disposed on the substrate to form a first space, first to third light sources, and first and second encapsulants. The frame includes an outer wall and a first partition in the first space to form the first space as independent second and third spaces. A first and second light sources are disposed at the second space and provide first and second light beams respectively. A third light source is disposed at the third space and provides a third light beam. A first encapsulant is filled at the second space to seal the first and second light sources. A second encapsulant is filled at the third space to seal the third light source. The second encapsulant includes a first wavelength conversion material converting the third light beam into a fourth light beam.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: October 17, 2023
    Assignee: Lite-On Technology Corporation
    Inventors: Kai Yu Hsieh, Chih Chiang Kao, Cheng Ying Lee, Tsung Lin Lu
  • Publication number: 20220242305
    Abstract: A light-emitting device includes a substrate including circuit pads and a resin portion. A frame disposed on the substrate to form a first space, first to third light sources, and first and second encapsulants. The frame includes an outer wall and a first partition in the first space to form the first space as independent second and third spaces. A first and second light sources are disposed at the second space and provide first and second light beams respectively. A third light source is disposed at the third space and provides a third light beam. A first encapsulant is filled at the second space to seal the first and second light sources. A second encapsulant is filled at the third space to seal the third light source. The second encapsulant includes a first wavelength conversion material converting the third light beam into a fourth light beam.
    Type: Application
    Filed: December 14, 2021
    Publication date: August 4, 2022
    Applicant: Lite-On Technology Corporation
    Inventors: Kai Yu Hsieh, Chih Chiang Kao, Cheng Ying Lee, Tsung Lin Lu
  • Publication number: 20210301993
    Abstract: A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.
    Type: Application
    Filed: March 30, 2021
    Publication date: September 30, 2021
    Inventors: CHEN-HSIU LIN, CHENG-YING LEE, MING-SUNG TSAI