Abstract: A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.

Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.

Abstract: A method includes bonding a first wafer to a second wafer, with a first plurality of dielectric layers in the first wafer and a second plurality of dielectric layers in the second wafer bonded between a first substrate of the first wafer and a second substrate in the second wafer. A first opening is formed in the first substrate, and the first plurality of dielectric layers and the second wafer are etched through the first opening to form a second opening. A metal pad in the second plurality of dielectric layers is exposed to the second opening. A conductive plug is formed extending into the first and the second openings.

Abstract: A method and device for removing an electromagnetic core, the method including: using an electromagnet to magnetize or demagnetize a metallic upper nozzle when a magneto-conductive workpiece is cut off in a WEDM manner; attracting a core capable of being completely cut off and separated in the workpiece; utilizing the metallic upper nozzle to detect whether attracted; if the core is attracted, moving the core to a target area; demagnetizing and dropping the core in a trash area. The device is applied to a WEDM machine; after the metallic magneto-conductive upper nozzle is magnetized by the electromagnet, the upper nozzle is used to attract the magneto-conductive core; a metallic water spray cover is utilized to detect whether the core is attracted; the core is moved to the target area by a motion system of the WEDM machine, and dropped in a trash device after the upper nozzle is demagnetized.

Abstract: A method and device for removing an electromagnetic core, the method including: using an electromagnet to magnetize or demagnetize a metallic upper nozzle when a magneto-conductive workpiece is cut off in a WEDM manner; attracting a core capable of being completely cut off and separated in the workpiece; utilizing the metallic upper nozzle to detect whether attracted; if the core is attracted, moving the core to a target area; demagnetizing and dropping the core in a trash area. The device is applied to a WEDM machine; after the metallic magneto-conductive upper nozzle is magnetized by the electromagnet, the upper nozzle is used to attract the magneto-conductive core; a metallic water spray cover is utilized to detect whether the core is attracted; the core is moved to the target area by a motion system of the WEDM machine, and dropped in a trash device after the upper nozzle is demagnetized.

Abstract: A decorative substrate and a touch panel are provided. The decorative substrate has a first region and a second region at least partially surrounding the first region. The decorative substrate includes a substrate, a decorative layer and a protective layer. The substrate has a first surface and a first sidewall. The decorative layer is disposed on the first surface and located in the second region. The decorative layer has a second sidewall adjacent to the first sidewall of the substrate, and a portion of the first surface disposed between the second sidewall and the first sidewall is defined as an outer border region. The protective layer is at least partially disposed in the outer border region of the first surface.

Abstract: A method for strengthening glass and a glass using the same are provided. The method for strengthening glass includes the following steps. Firstly, a glass substrate, which has a first surface and a second surface opposite to the first surface, is provided. Next, a barrier film is formed on at least one of the first surface and the second surface. Then, the glass substrate with the barrier film is immersed in a strengthening solution. The strengthening solution includes first ions, and the barrier film can limit the first ions in the quantity entering the glass substrate.

Abstract: A method for strengthening glass and a glass using the same are provided. The method for strengthening glass includes the following steps. Firstly, a glass substrate, which has a first surface and a second surface opposite to the first surface, is provided. Next, a barrier film is formed on at least one of the first surface and the second surface. Then, the glass substrate with the barrier film is immersed in a strengthening solution. The strengthening solution includes first ions, and the barrier film can limit the first ions in the quantity entering the glass substrate.

Abstract: A method for strengthening glass and a glass using the same are provided. The method for strengthening glass includes the following steps. Firstly, a glass substrate, which has a first surface and a second surface opposite to the first surface, is provided. Next, a barrier film is formed on at least one of the first surface and the second surface. Then, the glass substrate with the barrier film is immersed in a strengthening solution. The strengthening solution includes first ions, and the barrier film can limit the first ions in the quantity entering the glass substrate.