Patents by Inventor Cheng Yong

Cheng Yong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060154469
    Abstract: A method provides an interconnect structure having enhanced structural support when underlying functional metal layers are insulated with a low modulus dielectric. A first metal layer having a plurality of openings overlies the substrate. A first electrically insulating layer overlies the first metal layer. A second metal layer overlies the first electrically insulating layer, the second metal layer having a plurality of openings. An interconnect pad that defines an interconnect pad area overlies the second metal layer. At least a certain amount of the openings in the two metal layers are aligned to improve structural strength of the interconnect structure. The amount of alignment may differ depending upon the application and materials used. A bond wire connection or conductive bump may be used with the interconnect structure.
    Type: Application
    Filed: January 11, 2005
    Publication date: July 13, 2006
    Inventors: Kevin Hess, Susan Downey, James Miller, Cheng Yong
  • Publication number: 20050045023
    Abstract: An animated flute includes an animated air bag at one end of a pipe. The air bag has an air passage connected to the pipe and an air outlet. When air is blown into the air bag through the air passage, the air bag is inflated and the animated figure can be seen clearly.
    Type: Application
    Filed: August 25, 2003
    Publication date: March 3, 2005
    Inventor: Cheng-Yong Chen