Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.

Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.

Abstract: A fan structure including a fan housing and a fan body is provided. The fan housing includes a base and a cover assembled on the base. The cover includes a main portion, a periphery portion, a plurality of connecting portions and a plurality of flow guiding portions. The connecting portions are connected to the main portion and the periphery portion. The cover has a plurality of air inlet openings among the main portion, the periphery portion and connecting portions, wherein each of the flow guiding portions protrudes from the main portion and is adjacent to an inner side of the corresponding air inlet opening. The fan body is rotatably disposed in the fan housing. An electronic assembly is also provided.

Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.

Abstract: A heat dissipation fan including a hub and a plurality of heat dissipation blades is provided. The heat dissipation blades are arranged around the periphery of the hub. Each of the heat dissipation blades includes a curved surface body and a flow guiding portion. The curved surface body has a pressure bearing surface and a negative pressing surface opposite to the pressure bearing surface. The flow guiding portion is connected to the curved surface body. The flow guiding portion has a concave surface and a convex surface opposite to the concave surface, wherein the concave surface is recessed in the pressure bearing surface and the convex surface protrudes outward from the negative pressing surface.

Abstract: A heat dissipation fan including a hub and a plurality of metal fan blades disposed all around the hub. Each of the metal fan blades has a first end and a second end opposite to each other, wherein the first end is connected to the hub, and the metal fan blade has a flap wing at the second end. An angle is included between the flap wing and a surface of the metal fan blade.

Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1mm to be qualified to achieve a safety certification.

Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.

Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.

Abstract: A fan structure including a fan housing and a fan body is provided. The fan housing includes a base and a cover assembled on the base. The cover includes a main portion, a periphery portion, a plurality of connecting portions and a plurality of flow guiding portions. The connecting portions are connected to the main portion and the periphery portion. The cover has a plurality of air inlet openings among the main portion, the periphery portion and connecting portions, wherein each of the flow guiding portions protrudes from the main portion and is adjacent to an inner side of the corresponding air inlet opening. The fan body is rotatably disposed in the fan housing. An electronic assembly is also provided.

Abstract: An electronic device includes a flexible display panel and a shape memory component. The flexible display panel is driven by the shape memory component, herein when a temperature of the shape memory component is lower than a default temperature range, the shape memory component forms as a first shape, so that the flexible display panel is capable of being located at a first position. When the temperature of the shape memory component is higher than the default temperature range, the shape memory component forms as a second shape, so that the flexible display panel is driven to be moved to a second position.

Abstract: A heat dissipation system of an electronic device including a body, at least one heat source, and a heat dissipation module is provided. The body has a stack tunnel, and the heat source is disposed in the body. The heat dissipation module includes an evaporator and a pipe connecting to the evaporator to form a loop, and a working fluid is filled in the loop. The evaporator is in thermal contact with the heat source to absorb heat generated from the heat source, and the heat is transferred to the loop through phase transition of the working fluid in the loop, such that the loop heats the air in the stack tunnel in a two-dimensional manner.

Abstract: A heat dissipation fan including a hub and a plurality of metal fan blades disposed all around the hub. Each of the metal fan blades has a first end and a second end opposite to each other, wherein the first end is connected to the hub, and the metal fan blade has a flap wing at the second end. An angle is included between the flap wing and a surface of the metal fan blade.

Abstract: An electronic device includes a flexible display panel and a shape memory component. The flexible display panel is driven by the shape memory component, herein when a temperature of the shape memory component is lower than a default temperature range, the shape memory component forms as a first shape, so that the flexible display panel is capable of being located at a first position. When the temperature of the shape memory component is higher than the default temperature range, the shape memory component forms as a second shape, so that the flexible display panel is driven to be moved to a second position.

Abstract: A heat dissipation fan including a hub and a plurality of heat dissipation blades is provided. The heat dissipation blades are arranged around the periphery of the hub. Each of the heat dissipation blades includes a curved surface body and a flow guiding portion. The curved surface body has a pressure bearing surface and a negative pressing surface opposite to the pressure bearing surface. The flow guiding portion is connected to the curved surface body. The flow guiding portion has a concave surface and a convex surface opposite to the concave surface, wherein the concave surface is recessed in the pressure bearing surface and the convex surface protrudes outward from the negative pressing surface.

Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.

Abstract: A keyboard module and an electronic device using the keyboard module are provided. The keyboard module includes a housing, a plurality of keys, a micro pump chamber and an actuator. The housing has multiple openings with the keys disposed in the housing. Each key includes a switch membrane, a key cover, an elastic element and a scissor unit. The switch membrane has a key switch, the key cover is above the switch membrane, and the elastic element disposed between the switch membrane and the key cover triggers the key switch when being pressed and deformed. The scissor unit is disposed between the key cover and the switch membrane to support the key cover. The micro pump chamber disposed below the key cover includes a first chamber, a second chamber communicating with the first chamber, a check valve disposed between the first chamber and the second chamber, and an actuator driving the keys to be withdrawn into or protrude out of the openings.

Abstract: A head mounted display includes a lens unit, at least one lens temperature sensor, an environment temperature sensor, an environment humidity sensor, a temperature controller, a housing, and a display unit. The lens unit includes a carrier having a touching surface and a back surface opposite to each other and two lenses disposed on the carrier. An enclosed space is formed between a user and the touching surface. The at least one lens temperature sensor is adjacent to the lenses, and the sensors are all disposed on the touching surface. The temperature controller is disposed on the back surface and increases or decreases a temperature of the enclosed space and lens temperatures of the lenses according to sensing actions of the at least one lens temperature sensor, the environment temperature sensor, and the environment humidity sensor, so as to adjust the environment temperature and humidity of the enclosed space.

Abstract: A keyboard module and an electronic device using the keyboard module are provided. The keyboard module includes a housing, a plurality of keys, a micro pump chamber and an actuator. The housing has multiple openings with the keys disposed in the housing. Each key includes a switch membrane, a key cover, an elastic element and a scissor unit. The switch membrane has a key switch, the key cover is above the switch membrane, and the elastic element disposed between the switch membrane and the key cover triggers the key switch when being pressed and deformed. The scissor unit is disposed between the key cover and the switch membrane to support the key cover. The micro pump chamber disposed below the key cover includes a first chamber, a second chamber communicating with the first chamber, a check valve disposed between the first chamber and the second chamber, and an actuator driving the keys to be withdrawn into or protrude out of the openings.