Patents by Inventor Cheng-Yu Chiang
Cheng-Yu Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145327Abstract: A semiconductor device includes a substrate, an interconnect structure, and conductive vias. The substrate has a first side, a second side and a sidewall connecting the first side and the second side, wherein the sidewall includes a first planar sidewall of a first portion of the substrate, a second planar sidewall of a second portion of the substrate and a curved sidewall of a third portion of the substrate, where the first planar sidewall is connected to the second planar sidewall through the curved sidewall. The interconnect structure is located on the first side of the substrate, where a sidewall of the interconnect structure is offset from the second planar sidewall. The conductive vias are located on the interconnect structure, where the interconnect structure is located between the conductive vias and the substrate.Type: ApplicationFiled: December 27, 2023Publication date: May 2, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chang-Jung Hsueh, Cheng-Nan Lin, Wan-Yu Chiang, Wei-Hung Lin, Ching-Wen Hsiao, Ming-Da Cheng
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Publication number: 20240113143Abstract: Various embodiments of the present disclosure are directed towards an imaging device including a first image sensor element and a second image sensor element respectively comprising a pixel unit disposed within a semiconductor substrate. The first image sensor element is adjacent to the second image sensor element. A first micro-lens overlies the first image sensor element and is laterally shifted from a center of the pixel unit of the first image sensor element by a first lens shift amount. A second micro-lens overlies the second image sensor element and is laterally shifted from a center of the pixel unit of the second image sensor element by a second lens shift amount different from the first lens shift amount.Type: ApplicationFiled: January 6, 2023Publication date: April 4, 2024Inventors: Cheng Yu Huang, Wen-Hau Wu, Chun-Hao Chuang, Keng-Yu Chou, Wei-Chieh Chiang, Chih-Kung Chang
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Publication number: 20240088182Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Chien Yu, Ting-Cheng Chang, Wen-Hau Wu, Chih-Kung Chang
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Publication number: 20240076422Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.Type: ApplicationFiled: September 1, 2023Publication date: March 7, 2024Inventors: Jing-Cherng TSAI, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Jing-Yu LEE, Jun-Ye HONG, Zih-Yu SHIH, Cheng-Hung CHIANG, Gang-Wei SHEN, Yu-Chuan SUNG, Chung-Hua WENG, Hsing-Ya CHEN
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Patent number: 11923386Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a first photodetector disposed in a first pixel region of a semiconductor substrate and a second photodetector disposed in a second pixel region of the semiconductor substrate. The second photodetector is laterally separated from the first photodetector. A first diffuser is disposed along a back-side of the semiconductor substrate and over the first photodetector. A second diffuser is disposed along the back-side of the semiconductor substrate and over the second photodetector. A first midline of the first pixel region and a second midline of the second pixel region are both disposed laterally between the first diffuser and the second diffuser.Type: GrantFiled: April 24, 2023Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Keng-Yu Chou, Chun-Hao Chuang, Kazuaki Hashimoto, Wei-Chieh Chiang, Cheng Yu Huang, Wen-Hau Wu, Chih-Kung Chang
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Publication number: 20220406085Abstract: A driving apparatus and an operation method thereof are provided. The driving apparatus includes a first driving circuit and a second driving circuit. The first driving circuit suspends performing at least one of a display driving operation and a touch sensing operation during a skip period under a driving mode, and the first driving circuit performs the at least one of the display driving operation and the touch sensing operation outside the skip period under the driving mode. The second driving circuit is coupled to the first driving circuit. The second driving circuit performs a fingerprint sensing operation during the skip period.Type: ApplicationFiled: August 19, 2022Publication date: December 22, 2022Applicant: Novatek Microelectronics Corp.Inventors: Wei-Lun Shih, Tsen-Wei Chang, Cho-Hsuan Jhang, Chih-Peng Hsia, Cheng-Yu Chiang
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Patent number: 11423685Abstract: A driving apparatus and an operation method thereof are provided. The driving apparatus includes a first driving circuit and a second driving circuit. The first driving circuit performs a first driving mode on a panel. The first driving circuit performs the first driving mode during a first frame period among a plurality of frame periods and skips the first driving mode during a first skip period between the first frame period and a second frame period among the frame periods. The first driving circuit outputs timing control signal including a timing that the first driving mode is skipped. The second driving circuit is coupled to the first driving circuit to receive the timing control signal. The second driving circuit performs a fingerprint sensing operation different from the first driving mode on the panel according to the timing control signal during the first skip period.Type: GrantFiled: April 9, 2020Date of Patent: August 23, 2022Assignee: Novatek Microelectronics Corp.Inventors: Wei-Lun Shih, Tsen-Wei Chang, Cho-Hsuan Jhang, Chih-Peng Hsia, Cheng-Yu Chiang
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Publication number: 20200327301Abstract: A driving apparatus and an operation method thereof are provided. The driving apparatus includes a first driving circuit and a second driving circuit. The first driving circuit performs a first driving mode on a panel. The first driving circuit performs the first driving mode during a first frame period among a plurality of frame periods and skips the first driving mode during a first skip period between the first frame period and a second frame period among the frame periods. The first driving circuit outputs timing control signal including a timing that the first driving mode is skipped. The second driving circuit is coupled to the first driving circuit to receive the timing control signal. The second driving circuit performs a fingerprint sensing operation different from the first driving mode on the panel according to the timing control signal during the first skip period.Type: ApplicationFiled: April 9, 2020Publication date: October 15, 2020Applicant: Novatek Microelectronics Corp.Inventors: Wei-Lun Shih, Tsen-Wei Chang, Cho-Hsuan Jhang, Chih-Peng Hsia, Cheng-Yu Chiang
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Patent number: 10199731Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.Type: GrantFiled: March 10, 2017Date of Patent: February 5, 2019Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Hsien Chiu, Heng-Cheng Chu, Cheng-Yu Chiang
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Patent number: 9887102Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.Type: GrantFiled: February 26, 2016Date of Patent: February 6, 2018Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
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Publication number: 20170187117Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.Type: ApplicationFiled: March 10, 2017Publication date: June 29, 2017Inventors: Chih-Hsien Chiu, Heng-Cheng Chu, Cheng-Yu Chiang
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Patent number: 9627748Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.Type: GrantFiled: January 9, 2014Date of Patent: April 18, 2017Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Hsien Chiu, Heng-Cheng Chu, Cheng-Yu Chiang
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Publication number: 20160181126Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.Type: ApplicationFiled: February 26, 2016Publication date: June 23, 2016Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
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Patent number: 9305885Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.Type: GrantFiled: August 6, 2013Date of Patent: April 5, 2016Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
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Publication number: 20150162661Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.Type: ApplicationFiled: January 9, 2014Publication date: June 11, 2015Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTDInventors: Chih-Hsien Chiu, Heng-Cheng Chu, Cheng-Yu Chiang
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Publication number: 20150123251Abstract: A semiconductor package is disclosed, which includes: a packaging structure having at least a semiconductor element; and at least three shielding layers sequentially stacked on the packaging structure so as to cover the semiconductor element, wherein a middle layer of the shielding layers is lower in electrical conductivity than adjacent shielding layers on both sides of the middle layer, thereby reducing electromagnetic interferences so as to increase the shielding effectiveness.Type: ApplicationFiled: December 19, 2013Publication date: May 7, 2015Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTDInventors: Chih-Hsien Chiu, Chia-Yang Chen, Tsung-Hsien Tsai, Heng-Cheng Chu, Cheng-Yu Chiang
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Patent number: 8981540Abstract: A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an upper side of the carrier and electrically connected to the carrier; and an encapsulant formed on the upper side of the carrier for encapsulating the semiconductor element. Therein, the dielectric material is exposed from the encapsulant. As such, when the carrier is disposed on a circuit board, the dielectric material is sandwiched between the lower side of the carrier and the circuit board to form a decoupling capacitor, thereby improving the power integrity.Type: GrantFiled: June 20, 2013Date of Patent: March 17, 2015Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Cheng-Yu Chiang, Wen-Jung Chiang, Hsing-Hung Lee
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Publication number: 20140231972Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.Type: ApplicationFiled: August 6, 2013Publication date: August 21, 2014Applicant: Siliconware Precision Industries Co., Ltd.Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
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Publication number: 20140225241Abstract: A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an upper side of the carrier and electrically connected to the carrier; and an encapsulant formed on the upper side of the carrier for encapsulating the semiconductor element. Therein, the dielectric material is exposed from the encapsulant. As such, when the carrier is disposed on a circuit board, the dielectric material is sandwiched between the lower side of the carrier and the circuit board to form a decoupling capacitor, thereby improving the power integrity.Type: ApplicationFiled: June 20, 2013Publication date: August 14, 2014Inventors: Cheng-Yu Chiang, Wen-Jung Chiang, Hsing-Hung Lee