Abstract: A driving apparatus and an operation method thereof are provided. The driving apparatus includes a first driving circuit and a second driving circuit. The first driving circuit suspends performing at least one of a display driving operation and a touch sensing operation during a skip period under a driving mode, and the first driving circuit performs the at least one of the display driving operation and the touch sensing operation outside the skip period under the driving mode. The second driving circuit is coupled to the first driving circuit. The second driving circuit performs a fingerprint sensing operation during the skip period.

Abstract: A driving apparatus and an operation method thereof are provided. The driving apparatus includes a first driving circuit and a second driving circuit. The first driving circuit suspends performing at least one of a display driving operation and a touch sensing operation during a skip period under a driving mode, and the first driving circuit performs the at least one of the display driving operation and the touch sensing operation outside the skip period under the driving mode. The second driving circuit is coupled to the first driving circuit. The second driving circuit performs a fingerprint sensing operation during the skip period.

Abstract: A driving apparatus and an operation method thereof are provided. The driving apparatus includes a first driving circuit and a second driving circuit. The first driving circuit performs a first driving mode on a panel. The first driving circuit performs the first driving mode during a first frame period among a plurality of frame periods and skips the first driving mode during a first skip period between the first frame period and a second frame period among the frame periods. The first driving circuit outputs timing control signal including a timing that the first driving mode is skipped. The second driving circuit is coupled to the first driving circuit to receive the timing control signal. The second driving circuit performs a fingerprint sensing operation different from the first driving mode on the panel according to the timing control signal during the first skip period.

Abstract: A driving apparatus and an operation method thereof are provided. The driving apparatus includes a first driving circuit and a second driving circuit. The first driving circuit performs a first driving mode on a panel. The first driving circuit performs the first driving mode during a first frame period among a plurality of frame periods and skips the first driving mode during a first skip period between the first frame period and a second frame period among the frame periods. The first driving circuit outputs timing control signal including a timing that the first driving mode is skipped. The second driving circuit is coupled to the first driving circuit to receive the timing control signal. The second driving circuit performs a fingerprint sensing operation different from the first driving mode on the panel according to the timing control signal during the first skip period.

Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.

Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.

Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.

Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.

Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.

Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.

Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.

Abstract: A semiconductor package is disclosed, which includes: a packaging structure having at least a semiconductor element; and at least three shielding layers sequentially stacked on the packaging structure so as to cover the semiconductor element, wherein a middle layer of the shielding layers is lower in electrical conductivity than adjacent shielding layers on both sides of the middle layer, thereby reducing electromagnetic interferences so as to increase the shielding effectiveness.

Abstract: A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an upper side of the carrier and electrically connected to the carrier; and an encapsulant formed on the upper side of the carrier for encapsulating the semiconductor element. Therein, the dielectric material is exposed from the encapsulant. As such, when the carrier is disposed on a circuit board, the dielectric material is sandwiched between the lower side of the carrier and the circuit board to form a decoupling capacitor, thereby improving the power integrity.

Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.

Abstract: A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an upper side of the carrier and electrically connected to the carrier; and an encapsulant formed on the upper side of the carrier for encapsulating the semiconductor element. Therein, the dielectric material is exposed from the encapsulant. As such, when the carrier is disposed on a circuit board, the dielectric material is sandwiched between the lower side of the carrier and the circuit board to form a decoupling capacitor, thereby improving the power integrity.