Abstract: A semiconductor structure includes an interconnect structure, a passivation structure, a first capacitor, and a contact feature. The interconnect structure is disposed over a semiconductor substrate. The passivation structure is disposed over the interconnect structure. The first capacitor is disposed within the passivation structure. The contact feature is disposed over the passivation structure, wherein the first capacitor is proximal to a corner of the contact feature. A method of manufacturing the semiconductor structure is also provided.

Abstract: A method includes following steps. First transistors are formed over a substrate. An interconnect structure is formed over the plurality of first transistors. A dielectric layer is formed over the interconnect structure. 2D semiconductor seeds are formed over the dielectric layer. The 2D semiconductor seeds are annealed. An epitaxy process is performed to laterally grow a plurality of 2D semiconductor films respectively from the plurality of 2D semiconductor seeds. Second transistors are formed on the plurality of 2D semiconductor films.

Abstract: The present disclosure relates to an integrated chip including a substrate and a pixel. The pixel includes a photodetector. The photodetector is in the substrate. The integrated chip further includes a first inner trench isolation structure and an outer trench isolation structure that extend into the substrate. The first inner trench isolation structure laterally surrounds the photodetector in a first closed loop. The outer trench isolation structure laterally surrounds the first inner trench isolation structure along a boundary of the pixel in a second closed loop and is laterally separated from the first inner trench isolation structure. Further, the integrated chip includes a scattering structure that is defined, at least in part, by the first inner trench isolation structure and that is configured to increase an angle at which radiation impinges on the outer trench isolation structure.

Abstract: The present disclosure provides a biochemical test chip, including an insulating substrate, an electrode unit, a first insulating septum, a reactive layer and a second insulating septum. The electrode unit is located on the insulating substrate. The electrode unit includes a working electrode and a counter electrode. A current density of the counter electrode is greater than a current density of the working electrode. The first insulating septum is located on the electrode unit. The first insulating septum has an opening, which at least partially exposes the electrode unit. The reactive layer is located in the opening and is electrically connected to the electrode unit. The second insulating septum is located on the first insulating septum.

Abstract: The present disclosure provides a biochemical test chip, including an electrode unit and a protective layer. The protective layer is electrically connected to the electrode unit. The protective layer is configured to oxidize the electrode unit after the electrode unit receives an electron or reduce the electrode unit after the electrode unit loses an electron. There is a potential difference (Ecell0) between the protecting layer and the electrode unit.

Abstract: The present disclosure provides a biochemical test chip, including an insulating substrate, an electrode unit, a first insulating septum, a reactive layer and a second insulating septum. The electrode unit is located on the insulating substrate. The electrode unit includes a working electrode and a counter electrode. A current density of the counter electrode is greater than a current density of the working electrode. The first insulating septum is located on the electrode unit. The first insulating septum has an opening, which at least partially exposes the electrode unit. The reactive layer is located in the opening and is electrically connected to the electrode unit. The second insulating septum is located on the first insulating septum.

Abstract: A dewaxing device includes a dewaxing system which includes a rinsing device and a storage device connected with the rinsing device via a circulation pipe, and a recycling system which includes a containing trough connected with the storage device and a recycling trough connected between the containing trough and the storage device. The recycling system further includes a rotating device, a condensing unit and a heating unit which cooperate to treat mixed solution with wax into pure chemical solvent in the containing trough. The rotating device is rotatably mounted above the containing trough with the bottom half thereof being dived into the mixed solution. The condensing unit and the heating unit are disposed at two opposite sides of the top half of the rotating device. The rotating device is rotated towards the condensing unit.

Abstract: A method of manufacturing a hydrogen storage device includes the steps: (1) mix metal powder, backbone binder and wetting agent to make a canister shell feedstock; (2) mix metal powder, salts, backbone binder and wetting agent to make a porous structure feedstock; (3) feed the canister shell feedstock in an injection molding machine to form a green part of canister shell; (4) feed the porous structure feedstock in the green part of canister shell to form a green part of porous structure integral with the green part of canister shell by injection molding; (5) dissolve the salts out of the green part of porous structure to form pores; (6) remove the wetting agent from the green parts of canister shell and porous structure; (7) remove the backbone binder from the green parts of canister shell and porous structure to form the hydrogen storage device.

Abstract: A dewaxing device includes a dewaxing system which includes a rinsing device and a storage device connected with the rinsing device via a circulation pipe, and a recycling system which includes a containing trough connected with the storage device and a recycling trough connected between the containing trough and the storage device. The recycling system further includes a rotating device, a condensing unit and a heating unit which cooperate to treat mixed solution with wax into pure chemical solvent in the containing trough. The rotating device is rotatably mounted above the containing trough with the bottom half thereof being dived into the mixed solution. The condensing unit and the heating unit are disposed at two opposite sides of the top half of the rotating device. The rotating device is rotated towards the condensing unit.

Abstract: A dewaxing device and a method of recycling chemical solvent used by the dewaxing device are shown. The dewaxing device includes a dewaxing system and a recycling system. The dewaxing system includes a rinsing device and a storage device connected with the rinsing device via a circulation pipe. The recycling system includes a cooling equipment connected with the storage device for cooling mixed solution with wax from the storage device to precipitate wax out of the mixed solution, a filter equipment connected with the cooling equipment for filtering out the precipitated wax, and a recycling trough connected between the filter equipment and the storage device for containing the filtered solution passing through the filter equipment and further conveying the filtered solution back into the storage device to be reused.

Abstract: A dewaxing device and a method of dewaxing using the dewaxing device are shown. The dewaxing device includes a dewaxing system including a rinsing device and a storage device, and a recycling system connected with the storage device. The storage device includes a first solvent trough and a second solvent trough of which each is connected with the rinsing device and is equipped with a heating equipment. When the first solvent trough is connected with the rinsing device, the second solvent trough is disconnected with the rinsing device; when the second solvent trough is connected with the rinsing device, the first solvent trough is disconnected with the rinsing device. So, the dewaxing device can provide two dewaxing processes and effectively reduce recycling frequency because the recycling process is done after soluble wax quantity of bromopropane solvent reaches the maximum value 16%. The production cost is accordingly reduced.

Abstract: A method of manufacturing a hydrogen storage device includes the steps: (1) mix metal powder, backbone binder and wetting agent to make a canister shell feedstock; (2) mix metal powder, salts, backbone binder and wetting agent to make a porous structure feedstock; (3) feed the canister shell feedstock in an injection molding machine to form a green part of canister shell; (4) feed the porous structure feedstock in the green part of canister shell to form a. green part of porous structure integral with the green part of canister shell by injection molding; (5) dissolve the salts out of the green part of porous structure to form pores; (6) remove the wetting agent from the green parts of canister shell and porous structure; (7) remove the backbone binder from the green parts of canister shell and porous structure to form the hydrogen storage device.

Abstract: A debinder trap for treating binder gas thermal-cracked in sintering process of metal injection molding includes a barrel body defining an inflow hole, a drain hole, an inlet and an outlet, baffles disposed in the barrel body to define a guide channel of which entrance and exit are communicated with the inlet and the outlet, and a temperature controller containing liquid material therein and connected with the barrel body via an inflow pipe and a drain pipe connecting in the inflow hole and the drain hole. An accommodating channel passes through the inside of the barrel body and extends from the inflow hole to the drain hole. The temperature controller conveys the liquid material in the accommodating channel to regulate internal environment of the barrel body into low-temperature to condense the binder gas through the guide channel into solid, and high-temperature to make the solid binder molten to sink.

Abstract: A debinder trap for treating binder gas thermal-cracked in sintering process of metal injection molding includes a hollow barrel body having a barrel cover, a barrel wall and a barrel bottom, and a plurality of baffles disposed in the barrel body to define a guide channel. An inlet and an outlet are apart opened in the barrel cover. The entrance of the guide channel is communicated with the inlet of the barrel body and the exit of the guide channel is communicated with the outlet of the barrel body. The barrel body contains oil material therein. In use, the binder gas enters the barrel body through the inlet and flows along the guide channel for being adsorbed by the oil material and rapidly condensed into solid binder, and the solid binder is dissolved and precipitated in the oil material to make the oil material continue to adsorb the binder gas.

Abstract: The present invention discloses a metal injection molding method, which is adapted to a mold having multiple mold cavities, and includes a feedstock preparation step, a molded articles ejection step, a classification and management step, a wax-based material removal step, a sintering step, and a compacting step. The classification and management step is to classify molded articles according to differences of the molded articles. The sintering step is to sinter the molded articles with sintering parameters. In this manner, tolerance caused by injection molding process is reduced because of the classification and management step and the sintering step, whereby further improving productive rate and quality of products produced from the mold with multiple mold cavities.

Abstract: A sintering chamber structure adapted to store multiple articles to be sintered in a sintering furnace, includes a first wall, a second wall, two side walls interconnecting the first and second walls, at least two supporting walls, and holding boards for holding the multiple articles. The two side walls and the first and second walls together define a storage space communicating outside. The two supporting walls correspondingly form a plurality of guiding grooves, wherein the first and second walls correspondingly form a pair of positioning slots communicating with the storage space, the at least two supporting walls are detachably inserted in the pairs of positioning slots, respectively, and the holding boards are inserted in corresponding guiding grooves. In this manner, the at least two supporting walls can adjust the inner space according to the sizes of the articles, whereby achieving the best yield of sintering.

Abstract: The present invention discloses a switchable frequency response microwave filter, which uses voltage-controlled varactors to attain the separation or combination of the odd mode and even mode of signals in a dual-mode ring resonator to realize a bandpass or bandstop function and then controls the frequency response of the output filtered signals. Further, the present invention integrates different circuit architectures having bandpass and bandstop functions into a single circuit to reduce the complexity of the circuit.

Abstract: A method for making Mg(magnesium)-based intermetallic compound uses a thermal process during a melting process to produce largely the Mg-based intermetallic compound. The vapor pressure of Mg is high, thereby Mg is prone to be vaporized from a melt and a wrought solid alloy in the melting process of high temperature, for purifying the wrought Mg-based intermetallic compound. The method may simplify the process and devices for making the Mg-based intermetallic compound, and produce efficiently a larger of high purity Mg-based intermetallic compound.

Abstract: The present invention discloses a switchable frequency response microwave filter, which uses voltage-controlled varactors to attain the separation or combination of the odd mode and even mode of signals in a dual-mode ring resonator to realize a bandpass or bandstop function and then controls the frequency response of the output filtered signals. Further, the present invention integrates different circuit architectures having bandpass and bandstop functions into a single circuit to reduce the complexity of the circuit.

Abstract: A method for making Mg(magnesium)-based intermetallic compound uses a thermal process during a melting process to produce largely the Mg-based intermetallic compound. The vapor pressure of Mg is high, thereby Mg is prone to be vaporized from a melt and a wrought solid alloy in the melting process of high temperature, for purifying the wrought Mg-based intermetallic compound. The method may simplify the process and devices for making the Mg-based intermetallic compound, and produce efficiently a larger of high purity Mg-based intermetallic compound.