Patents by Inventor Cheng-Yu Wang

Cheng-Yu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8760862
    Abstract: A portable electronic device, which including a casing, a circuit board, a fan and a heat dissipating device, is disclosed. The circuit board is disposed in the casing and includes at least one electronic component thereon. The fan is disposed in the casing. The heat dissipating device is disposed in the casing and near the side of an air outlet of the fan. Gaps formed between the outer surfaces of the heat dissipating device and the inner surfaces of the casing as air flow channels. The portable electronic device isolates heat conducted to the casing of the portable electronic device via the gaps.
    Type: Grant
    Filed: January 5, 2012
    Date of Patent: June 24, 2014
    Assignee: Asustek Computer Inc.
    Inventor: Cheng-Yu Wang
  • Publication number: 20140171699
    Abstract: Provided are processes for making saturated hydrocarbons from renewable feed sources. In an embodiment, a process for producing a lube basestock and/or a diesel fuel from a feedstock of biological origin includes: contacting the feedstock in a single reactor in the presence of hydrogen with catalyst components including a first catalyst and a second catalyst, wherein the first catalyst comprises an acidic material, a basic material, or a combination of both, and wherein the second catalyst is a hydrogenation catalyst including a hydrothermally stable binder.
    Type: Application
    Filed: December 4, 2013
    Publication date: June 19, 2014
    Applicant: ExxonMobil Research and Engineering Company
    Inventors: Kun Wang, Virginia M. Roberts, Paul D. Oldenburg, Suzzy Chen Hsi Ho, Michel Daage, Frank Cheng-Yu Wang
  • Publication number: 20140168893
    Abstract: A heat dissipation apparatus with an antenna is provided. The heat dissipation apparatus includes a housing, a heat-insulation structure, a fan and an antenna. The heat-insulation structure is disposed on the housing and the heat-insulation structure has a plurality of heat dissipation holes. The fan is disposed in the housing and an air exhaust channel is formed between the fan and the heat-insulation structure. The antenna is disposed in the air exhaust channel.
    Type: Application
    Filed: March 7, 2013
    Publication date: June 19, 2014
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chia-Ching NIU, Cheng-Yu WANG
  • Patent number: 8746946
    Abstract: A backlight module including a light guide plate and a light source is provided. The light guide plate has a light incident surface, a light reflection surface, a first side surface and a second side surface. The light incident surface is connected to the second side surface. The reflection surface is connected between the first side surface and the light incident surface. The first and the second side surfaces are two planes with their extending planes intersected. The light incident surface is a chamfering plane connected between the first and the second side surfaces. The light reflection surface is a cambered surface connected between the first side surface and the light incident surface. The light source is disposed next to the light incident surface, so as to transmit light into the light guide plate through the light incident surface.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: June 10, 2014
    Assignee: Au Optronics Corporation
    Inventors: Ci-Guang Peng, Cheng-Yu Wang, Chung-Yang Hung, Te-Hen Lo, Cheng-Min Tsai, Ming-Sheng Lai, Ren-Wei Huang, Shu-Ting Jhuang
  • Publication number: 20140146472
    Abstract: An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.
    Type: Application
    Filed: November 5, 2013
    Publication date: May 29, 2014
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chia-Ching NIU, Ing-Jer CHIOU, Cheng-Yu WANG
  • Publication number: 20140129133
    Abstract: A mobile device and navigation device communication system utilizing near field communication to easily capture and transfer address data and simplify programming of the navigation device is disclosed. When a mobile device receives a text message a mobile navigation communication application determines if there is an address included in the text message and if found extracts the address and encodes the address. The user then places the mobile device in close proximity to the navigation device and the data exchange is performed via near field communication. After the data exchange is complete the navigation device decodes the data into the address and searches its database to find an address match. The navigation device then displays the address for the user to confirm. After confirmation the navigation device displays the route or driving directs from the user's current location to the destination address.
    Type: Application
    Filed: November 6, 2012
    Publication date: May 8, 2014
    Inventor: Cheng-Yu WANG
  • Publication number: 20140120856
    Abstract: A RF front-end circuit and a low noise amplifier thereof configured for a receiver are provided. The circuit includes a low noise amplifier and a quadrature passive mixer. The low noise amplifier provides two RF output differential signals to the quadrature passive mixer. The RF signals are down-converted to the differential in-phase baseband signals and the differential quadrature-phase baseband signals. The structure of the RF front-end circuit can avoid the signal and noise interfering between in-phase channel and quadrature-phase channel without using a 25% duty cycle local oscillation generator circuit.
    Type: Application
    Filed: July 15, 2013
    Publication date: May 1, 2014
    Applicant: Shenzhen South Silicon Valley Microelectronics Co., Ltd
    Inventors: Hua-Yu Liao, Cheng-Yu Wang, Ying-Tang Chang
  • Publication number: 20140109403
    Abstract: A complex circuit board including a printed circuit board assembly (PCBA) and a flexible printed circuit (FPC) for providing driving signals for light sources is disclosed. The PCBA includes a supporting portion and a connecting portion. The light sources are disposed above the supporting portion. The connection portion contacts electrically with a contacting portion of the FPC. The contacting portion of the FPC has a fixing hole. The connecting portion of the PCBA has a fixing portion. Moreover, the FPC has two or more than two first bend portions on the contacting portion. The fixing portion of the PCBA is inserted into the fixing hole of the FPC to complete the complex circuit board without extra attachment units. Therefore, the assembly procedure is simplified to increase throughput and the cost is reduced.
    Type: Application
    Filed: December 30, 2013
    Publication date: April 24, 2014
    Applicant: AU Optronics Corporation
    Inventors: Ching-Feng Chen, Cheng-Min Tsai, Cheng-Yu Wang
  • Publication number: 20140043763
    Abstract: A portable electronic system includes a portable device and a mobile device. The portable device includes a base, a bearing seat, and a connecting element. The base includes a fan and at least one first opening. The bearing seat includes at least one second opening. The connecting element connects the base and the bearing seat and includes a passage. The mobile device is detachably disposed at the bearing seat and includes at least one third opening. The base and the mobile device have corresponding passage and openings to bring heat airflow from inside of the mobile device to outside of the mobile device.
    Type: Application
    Filed: February 26, 2013
    Publication date: February 13, 2014
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chia-Ching NIU, Cheng-Yu WANG
  • Patent number: 8641260
    Abstract: A complex circuit board including a printed circuit board assembly (PCBA) and a flexible printed circuit (FPC) for providing driving signals for light sources is disclosed. The PCBA includes a supporting portion and a connecting portion. The light sources are disposed above the supporting portion. The connection portion contacts electrically with a contacting portion of the FPC. The contacting portion of the FPC has a fixing hole. The connecting portion of the PCBA has a fixing portion. Moreover, the FPC has two or more than two first bend portions on the contacting portion. The fixing portion of the PCBA is inserted into the fixing hole of the FPC to complete the complex circuit board without extra attachment units. Therefore, the assembly procedure is simplified to increase throughput and the cost is reduced.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: February 4, 2014
    Assignee: AU Optronics Corporation
    Inventors: Ching-Feng Chen, Cheng-Min Tsai, Cheng-Yu Wang
  • Publication number: 20140029302
    Abstract: A backlight module includes a light guide plate with at least one light incident surface, and a light source structure arranged at a side of the light guide plate. The light source structure includes a reflection cover and at least one light emitting module. At least one positioning pin is arranged on the reflection cover. The at least one light emitting module is installed on the reflection cover and corresponding to the at least one light incident surface. The at least one light emitting module is fixed on the positioning pin in a rotatable manner, such that the at least one light emitting module can rotate around the positioning pin as an axis when the reflection cover is combined with the light guide plate, so as to allow the at least one light emitting module facing the at least one light incident surface.
    Type: Application
    Filed: December 3, 2012
    Publication date: January 30, 2014
    Applicant: AU OPTRONICS CORP.
    Inventors: Cheng-Yu Wang, Cheng-Min Tsai
  • Publication number: 20140025224
    Abstract: An electronic device with a plurality of touch sensing modules and a heat dissipating control method thereof are provided. The heat dissipating control method includes following steps: detecting whether an object approaches the electronic device or the electronic device is touched to generate a sensing result; recognizing an executable scenario solution according to the sensing result, and cooling the electronic device according to the executable scenario solution.
    Type: Application
    Filed: June 20, 2013
    Publication date: January 23, 2014
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang
  • Patent number: 8570765
    Abstract: A circuit board includes a main body, an electronic component, a fixing portion and at least one via hole. The electronic component and the fixing portion are disposed on the main body. The at least one via hole is formed on the main body and adjacent to the fixing portion.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: October 29, 2013
    Assignee: ASUSTeK Computer Inc.
    Inventors: Cheng-Yu Wang, Chang-Hsu Yen
  • Publication number: 20130259666
    Abstract: A slim fan includes a casing, a fan module and a ring cover. The casing includes an upper casing which has an opening, and a lower casing. The fan module includes a plurality of fans annularly disposed in the opening, and each of the fans has a first side and a second side opposite to each other. The ring cover is connected to the first side of the fans and exposed out of the opening. The height of the fans is equal to that between the upper casing and the lower casing.
    Type: Application
    Filed: March 8, 2013
    Publication date: October 3, 2013
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang, Ming-Hsiu Wu
  • Publication number: 20130215564
    Abstract: An electronic device includes an accommodating space, a fan, a cover, and a stereoscopic dust extraction mesh. The fan is disposed in the accommodating space. The fan includes a first fixing portion. The cover detachably covers the accommodating space, and the cover includes a second fixing portion in accommodating space. The stereoscopic dust extraction mesh includes a body, a third fixing portion, and a fourth fixing portion, and the third fixing portion and the fourth fixing portion are located at periphery of the body. The third fixing portion of the stereoscopic dust extraction mesh cooperates with the first fixing portion of the fan, and the fourth fixing portion of the stereoscopic dust extraction mesh cooperates with the second fixing portion of the cover to detachably fix the stereoscopic dust extraction mesh between the cover and the fan.
    Type: Application
    Filed: December 14, 2012
    Publication date: August 22, 2013
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang
  • Patent number: 8486183
    Abstract: An acid gas absorbent comprising an alkylamino alkyloxy (alcohol) monoalkyl ether and a process for the selective removal Of H2S from gaseous mixtures containing H2S and CO2 using an absorbent solution comprising an alkylamino alkyloxy alcohol monoalkyl ether.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: July 16, 2013
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Michael Siskin, Edmund John Mozeleski, Robert Basil Fedich, Frank Cheng-Yu Wang
  • Publication number: 20130163279
    Abstract: A backlight module including a light guide plate and a light source is provided. The light guide plate has a light incident surface, a light reflection surface, a first side surface and a second side surface. The light incident surface is connected to the second side surface. The reflection surface is connected between the first side surface and the light incident surface. The first and the second side surfaces are two planes with their extending planes intersected. The light incident surface is a chamfering plane connected between the first and the second side surfaces. The light reflection surface is a cambered surface connected between the first side surface and the light incident surface. The light source is disposed next to the light incident surface, so as to transmit light into the light guide plate through the light incident surface.
    Type: Application
    Filed: May 14, 2012
    Publication date: June 27, 2013
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Ci-Guang Peng, Cheng-Yu Wang, Chung-Yang Hung, Te-Hen Lo, Cheng-Min Tsai, Ming-Sheng Lai, Ren-Wei Huang, Shu-Ting Jhuang
  • Publication number: 20130039011
    Abstract: A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a folded portion. The heat-dissipating module is connected to the circuit board by the connecting portions, and a first surface of the contacting portion contacts the electronic element. The folded portion is connected to the contacting portion. The heat-dissipating module is suitable for a thin and light electronic device and has firm structure.
    Type: Application
    Filed: July 31, 2012
    Publication date: February 14, 2013
    Inventor: Cheng-Yu WANG
  • Patent number: 8337596
    Abstract: Hydrocarbyl substituted and unsubstituted polyethylene imines and polyacrylamide salts are absorption compositions and are useful in processes for the treatment of acid gas mixtures.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: December 25, 2012
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Frank Cheng-Yu Wang, Michael Siskin
  • Patent number: D682715
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: May 21, 2013
    Assignee: Home Yard Global Co., Ltd.
    Inventor: Cheng-Yu Wang