Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S 11 parameter of the connector is less than ?20 dB.

Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than ?20 dB.

Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.

Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.

Abstract: A semiconductor package structure includes a base, at least one semiconductor element, a first dielectric layer, a second dielectric layer and a circuit layer. The semiconductor element is disposed on the base and has an upper surface. The first dielectric layer covers at least a portion of a peripheral surface of the semiconductor element and has a top surface. The top surface is non-coplanar with the upper surface of the semiconductor element. The second dielectric layer covers the semiconductor element and the first dielectric layer. The circuit layer extends through the second dielectric layer to electrically connect the semiconductor element.

Abstract: A semiconductor package structure includes a base material, at least one semiconductor chip, an encapsulant, a depression structure, a redistribution layer and at least one conductive via. The semiconductor chip is disposed on the base material. The encapsulant is disposed on the base material and covers the at least one semiconductor chip. The encapsulant has an outer side surface. The depression structure is disposed adjacent to and exposed from of the outer side surface the encapsulant. The redistribution layer is disposed on the encapsulant. The conductive via is disposed in the encapsulant and electrically connects the semiconductor chip and the redistribution layer.

Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than ?20 dB.

Abstract: A semiconductor package structure includes a base, at least one semiconductor element, a first dielectric layer, a second dielectric layer and a circuit layer. The semiconductor element is disposed on the base and has an upper surface. The first dielectric layer covers at least a portion of a peripheral surface of the semiconductor element and has a top surface. The top surface is non-coplanar with the upper surface of the semiconductor element. The second dielectric layer covers the semiconductor element and the first dielectric layer. The circuit layer extends through the second dielectric layer to electrically connect the semiconductor element.

Abstract: A semiconductor package structure includes a base material, at least one semiconductor chip, an encapsulant, a depression structure, a redistribution layer and at least one conductive via. The semiconductor chip is disposed on the base material. The encapsulant is disposed on the base material and covers the at least one semiconductor chip. The encapsulant has an outer side surface. The depression structure is disposed adjacent to and exposed from of the outer side surface the encapsulant. The redistribution layer is disposed on the encapsulant. The conductive via is disposed in the encapsulant and electrically connects the semiconductor chip and the redistribution layer.

Abstract: An image capture and output method comprises steps of providing an image capture device, continuously capturing a plurality of line images from an initial position and recording a position information corresponded to each line image, calculating the difference between the position information of the first line image and the initial position and the differences between the position information of each of the rest line images and a former one of the line image to obtain a fill information, filling each line image into an image buffer according to the fill information, and outputting the image buffer as a product image. Therefore, the deformation issue is effectively solved, the storage memory is saved, and the manufacturing cost is lowered.

Abstract: An image capture and output method comprises steps of providing an image capture device, continuously capturing a plurality of line images from an initial position and recording a position information corresponded to each line image, calculating the difference between the position information of the first line image and the initial position and the differences between the position information of each of the rest line images and a former one of the line image to obtain a fill information, filling each line image into an image buffer according to the fill information, and outputting the image buffer as a product image. Therefore, the deformation issue is effectively solved, the storage memory is saved, and the manufacturing cost is lowered.

Abstract: A smart helmet system includes a helmet and a mobile communication device. The smart helmet includes a helmet body, a detection module and a wireless transmission module. The detection module is applied to detect at least one motion parameter of the helmet. The wireless transmission module is to transmit the motion parameter. The mobile communication device stores an operation regulation to define at least one predetermined operation function of the mobile communication device corresponding to at least one set motion track. The mobile communication device is to receive the motion parameter to accordingly determine a detected motion track and further to activate the predetermined operation function when the detected motion track is complied with the set motion track, so as to operate the mobile communication device according to the predetermined operation function.

Abstract: An improved structure for an amplifier comprises: a single member, which at least has a frame, an edge and a membrane; and a positioning shrapnel, which is assembled by an inner frame, an outer frame and a plurality of flexible braces, the outer frame is firmly disposed at the frame of the single member, the plurality of flexible braces is disposed between the inner frame and the outer frame, the inner frame is firmly disposed on the membrane of the single member, wherein the peripheral of the frame has a fillister that can be embedded in by the outer frame, each connection of any of the flexible braces and the inner frame is a curve portion that is to keep the connection of the inner frame and the outer frame while a height difference is existed between the inner frame and the outer frame.

Abstract: An improved structure for an amplifier comprises: a single member, which at least has a frame, an edge and a membrane; and a positioning shrapnel, which is assembled by an inner frame, an outer frame and a plurality of flexible braces, the outer frame is firmly disposed at the frame of the single member, the plurality of flexible braces is disposed between the inner frame and the outer frame, the inner frame is firmly disposed on the membrane of the single member, wherein the peripheral of the frame has a fillister that can be embedded in by the outer frame, each connection of any of the flexible braces and the inner frame is a curve portion that is to keep the connection of the inner frame and the outer frame while a height difference is existed between the inner frame and the outer frame.

Abstract: A scanning speed adjusting method is used in a scanning system including a scanning module and a controller. Firstly, a document is scanned by the scanning module, thereby generating an image data. Then, the image data is received by the controller, and transmitted to an output device. An input speed of receiving the image data from the scanning module and an output speed of transmitting the image data to the output device are detected by the controller. If the input speed and the output speed are different, a scanning speed of the scanning module is adaptively adjusted according to a difference between the input speed and the output speed.

Abstract: A method of poster printing control, applicable to a multi-functional printer, comprising at least one printing module and a scanning module, includes using a scanning module to scan an original paper to obtain a digital copy of known size; setting a size of a paper to be printed; dividing the digital copy into a plurality of sub-images; up-scaling the sub-images to the size of the paper to be printed; using the printing module to print out the sub-images on the paper to be printed. Thereby, the poster printing is completed by means of the multi-functional printer.

Abstract: An apparatus, method and digital-to-analog converter (DAC) for reducing harmonic error power is provided, suitable for current-mode self-calibration DAC. Unit currents are calibrated one by one based on a reference value and the error distribution of the unit currents appears identical characteristic. According to the calibrated current error distribution, a shift shifts the input digital signal so that the error distribution of the unit current selected by the digital signal is monotonicity and not related to self-calibration current period. A coarse decoder decodes the digital signal as compensation decoding. The harmonic power related to the self-calibration current period is greatly reduced, which improves the signal to noise ratio.

Abstract: A method for enhancing adhesion ability between copper and silicon nitride is disclosed. The present method comprises following steps: first, provide a substrate and then form a copper layer on the substrate; second, form a copper phosphide layer on the copper layer; and finally, form a silicon nitride layer on the copper phosphide layer. Herein, the copper phosphide layer is formed by a plasma enhanced chemical vapor deposition process. Therefore, any copper oxide layer that covers copper layer is replaced by the silicon phosphide layer and then adhesion between copper and silicon nitride is improved. Moreover, the silicon phosphide comprises two advantages: low resistance than copper oxide and efficiently prevent copper diffuses into surrounding dielectric layer.