Patents by Inventor Cheng-Yuan Yu

Cheng-Yuan Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100015959
    Abstract: A computer-based call graph processing system and method dials a phone number of a receiver, and display an option selection to select a call graph on a display of a mobile phone. The system and method further call a radio link protocol to build an IS-95 channel to send a selected call graph to the receiver via the IS-95 channel, and alert the receiver using a default alert mode and display the call graph on a display of the receiver.
    Type: Application
    Filed: June 30, 2009
    Publication date: January 21, 2010
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventor: CHENG-YUAN YU
  • Publication number: 20080075315
    Abstract: A bluetooth earphone has an earphone jacket, an earphone module, a bluetooth module, a receiver, a speaker and a rolling assembly. The earphone jacket has multiple receiving holes, a through hole and an opening defined in a sidewall. The earphone module provided in the earphone jacket and respectively connects to the bluetooth module, the receiver and the speaker. The speaker connects to the earphone module via a wire and the wire extends out of the opening. The rolling assembly is provided in the earphone jacket and corresponds to the through hole and the opening whereby the wire can be rolled around the rolling assembly to avoid tangling.
    Type: Application
    Filed: September 12, 2006
    Publication date: March 27, 2008
    Inventor: Cheng-Yuan Yu
  • Patent number: 5371328
    Abstract: An easily reworkable circuit module is provided that allows unusable electronic components that have been encapsulated to be removed from a printed circuit board. A chip or MCM attached to a carrier using direct chip attach methods (DCA), such as C4 or SBC techniques that leave a space between the chip/MCM and carrier, due to the height of the solder balls, connection pads and the like. The present invention places a non-stick release coating on all surfaces intermediate of the chip and carrier. That is, the release coating of the present invention is placed by spraying, or the like between the chip and carrier to form a thin liquid film which inhibits the adhesion of a subsequently applied and cured rigid polymer encapsulant. Thus, when a chip or MCM tests as "bad", rework is a relatively simple matter. The solder connections between the chip and carrier of the module are reflowed and the chip is lifted off.
    Type: Grant
    Filed: August 20, 1993
    Date of Patent: December 6, 1994
    Assignee: International Business Machines Corporation
    Inventors: Barbara L. Gutierrez, Cheng-Yuan Yu