Patents by Inventor Cheng-Zhang Huang

Cheng-Zhang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUCTOR DIES
    Publication number: 20240120317
    Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.
    Type: Application
    Filed: July 13, 2023
    Publication date: April 11, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Cheng-Hsiung Yang, Chien Te Chen, Cong Zhang, Ching-Chuan Hsieh, Yu-Ying Tan, Juan Zhou, Ai-wen Wang, Yih-Fran Lee, Yu-Wen Huang
  • Electronic Device
    Publication number: 20100134964
    Abstract: An electronic device having a main housing defining a cavity, a display screen supported by the main housing, and a motherboard positioned within the cavity behind the display screen. The electronic device has a keyboard assembly, camera assembly, and/or desktop stand assembly.
    Type: Application
    Filed: May 21, 2009
    Publication date: June 3, 2010
    Inventors: Renato L. Smith, Attila J. Bendeguz, Shen-Wei Hsieh, Cheng-Chang Ku, Cheng-Zhang Huang