Patents by Inventor Cheng Zhe Huang
Cheng Zhe Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9623635Abstract: Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.Type: GrantFiled: March 7, 2011Date of Patent: April 18, 2017Assignee: LG HAUSYS, LTD.Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
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Patent number: 9517612Abstract: Disclosed is a flooring material using an environment-friendly PLA resin. According to the present invention, the flooring material using the PLA resin comprises: a base layer; a print layer which is formed on top of the base layer, and has a print pattern on an upper side thereof; and a transparent layer which is formed on top of the print layer, wherein one or more of the base layer, the print layer, and the transparent layer include polylactic acid (PLA) resin.Type: GrantFiled: March 15, 2011Date of Patent: December 13, 2016Assignee: LG HAUSYS, LTD.Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
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Patent number: 9512265Abstract: The present invention relates to a foam sheet using cross-linked polylactic acid and method of manufacturing the same, and more particularly a foam sheet using cross-linked polylactic acid and method of manufacturing the same with not only excellent waterproofing and workability but also relatively high foaming ratio and a uniform closed foam cell structure, by producing cross-linked polylactic acid resin in a fixed condition using composites comprising polylactic acid, cross linking agents, and/or co-crosslinking agents, and then forming a sheet shape in a fixed condition using composites comprising the cross-linked polylactic acid and foaming agents, and then foaming at relatively high temperature conditions.Type: GrantFiled: December 6, 2012Date of Patent: December 6, 2016Assignee: LG HAUSYS, LTD.Inventors: Chang Won Kang, Cheng Zhe Huang, Ji Hyang Son
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Patent number: 9475913Abstract: Disclosed is a foam sheet using polylactic acid, which provides the advantages of energy reduction and greenhouse gas reduction, and does not emit toxic substances such as toxic gas or endocrine-disrupting chemicals. The foam sheet, according to the present invention, comprises at least one resin layer comprising a biodegradable resin composition including the polylactic acid having an extended chain, a plasticizer, and a foaming agent, and thus provides the advantages of superior processing properties, superior water resistance after processing, energy reduction and greenhouse gas reduction, and of not emitting toxic substances such as toxic gas or endocrine-disrupting chemicals.Type: GrantFiled: December 27, 2012Date of Patent: October 25, 2016Assignee: LG HAUSYS, LTD.Inventors: Cheng Zhe Huang, Chang Won Kang, Ji Hyang Son
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Patent number: 9422729Abstract: Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.Type: GrantFiled: June 13, 2011Date of Patent: August 23, 2016Assignee: LG HAUSYS, LTD.Inventors: Hyun-Jong Kwon, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee, Cheng-Zhe Huang
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Patent number: 9309628Abstract: The present invention relates to wallpaper and a method for manufacturing the same. The wallpaper may be manufactured at low energy and low costs regardless of an increase in oil price and does not produce greenhouse gases and hazardous substances in the course of manufacture, use or disposal, or during fire. In addition, the wallpaper can decompose readily in the natural environment, even when buried.Type: GrantFiled: October 27, 2009Date of Patent: April 12, 2016Assignee: LG HAUSYS, LTD.Inventors: Cheng Zhe Huang, Si Young Lee, Phan Seok Kim
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Publication number: 20160068682Abstract: Disclosed herein is a board for building or industry comprising biodegradable resin and wooden flour, which is capable of implementing an excellent physical property and protecting the human body and the environment, and a method of manufacturing the same. A method of manufacturing a board may comprise fabricating wooden flour by pulverizing a raw log or wood chips that are raw materials, inputting biodegradable resin to the wooden flour and fabricating compounds by mulling the biodegradable resin and the wooden flour at high temperature, forming the fabricated compounds in a sheet form through mold forming, and cooling the formed board. Accordingly, there are advantages in that an excellent physical property can be implemented, the human body and the environment can be protected because there is no possibility of environmental pollution when the board is buried due to the biodegradable resin, and a cost related to the disposal of wastes can be reduced.Type: ApplicationFiled: June 20, 2014Publication date: March 10, 2016Applicant: LG HAUSYS, LTD.Inventors: Seok Bong LEE, Chang Won KANG, Cheng Zhe HUANG, Min LEE
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Publication number: 20150329689Abstract: Disclosed is a foam sheet using polylactic acid, which provides the advantages of energy reduction and greenhouse gas reduction, and does not emit toxic substances such as toxic gas or endocrine-disrupting chemicals. The foam sheet, according to the present invention, comprises at least one resin layer comprising a biodegradable resin composition including the polylactic acid having an extended chain, a plasticizer, and a foaming agent, and thus provides the advantages of superior processing properties, superior water resistance after processing, energy reduction and greenhouse gas reduction, and of not emitting toxic substances such as toxic gas or endocrine-disrupting chemicals.Type: ApplicationFiled: December 27, 2012Publication date: November 19, 2015Inventors: Cheng Zhe HUANG, Chang Won KANG, Ji Hyang SON
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Publication number: 20150080503Abstract: Disclosed are an environmentally-friendly board, which provides the advantages of energy reduction and greenhouse gas reduction and does not emit toxic substances such as toxic gas or endocrine-disrupting chemicals, and a method for preparing same. The environmentally-friendly board, according to the present invention, comprises a biodegradable resin composition including a polylactic acid resin, a crosslinking agent, and wood fiber, and thus provides the advantages of not emitting toxic substances such as toxic gas or endocrine-disrupting chemicals, securing water resistance of a product by PLA crosslinking, and not sticking to a processing tool when heat is applied during processing.Type: ApplicationFiled: December 27, 2012Publication date: March 19, 2015Inventors: Cheng Zhe Huang, Chang Won Kang, Ji Hyang Son
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Publication number: 20150073070Abstract: The present invention relates to a board using crosslinked polylactic acid and a method for preparing same, and more specifically, to a board using the crosslinked polylactic acid having superior processing properties during the preparation process and water resistance properties after processing by using a composition comprising the crosslinked polylactic acid and wood powder, and to a method for preparing the board.Type: ApplicationFiled: December 28, 2012Publication date: March 12, 2015Inventors: Cheng Zhe Huang, Chang Won Kang, Ji Hyang Son
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Publication number: 20150051320Abstract: The present invention relates to a board using crosslinked polylactic acid and a method for preparing same, and more specifically, to a board using the crosslinked polylactic acid which has superior processing properties during the preparation process and superior water-resistant properties after processing, by using a composition comprising the crosslinked polylactic acid and wood fiber, and to a method for preparing the same.Type: ApplicationFiled: December 14, 2012Publication date: February 19, 2015Applicant: LG Hausys, Ltd.Inventors: Cheng Zhe Huang, Chang Won Kang, Ji Hyang Son
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Publication number: 20140295169Abstract: The present invention relates to a foam sheet using cross-linked polylactic acid and method of manufacturing the same, and more particularly a foam sheet using cross-linked polylactic acid and method of manufacturing the same with not only excellent waterproofing and workability but also relatively high foaming ratio and a uniform closed foam cell structure, by producing cross-linked polylactic acid resin in a fixed condition using composites comprising polylactic acid, cross linking agents, and/or co-crosslinking agents, and then forming a sheet shape in a fixed condition using composites comprising the cross-linked polylactic acid and foaming agents, and then foaming at relatively high temperature conditions.Type: ApplicationFiled: December 6, 2012Publication date: October 2, 2014Applicant: LG Hausys, Ltd.Inventors: Chang Won Kang, Cheng Zhe Huang, Ji Hyang Son
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Publication number: 20130302577Abstract: Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.Type: ApplicationFiled: June 13, 2011Publication date: November 14, 2013Applicant: LG Hausys, Ltd.Inventors: Hyun-Jong Kwon, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee, Cheng-Zhe Huang
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Publication number: 20130004751Abstract: Disclosed is a flooring material using an environment-friendly PLA resin. According to the present invention, the flooring material using the PLA resin comprises: a base layer; a print layer which is formed on top of the base layer, and has a print pattern on an upper side thereof; and a transparent layer which is formed on top of the print layer, wherein one or more of the base layer, the print layer, and the transparent layer include polylactic acid (PLA) resin.Type: ApplicationFiled: March 15, 2011Publication date: January 3, 2013Applicant: LG HAUSYS, LTD.Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
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Publication number: 20130004703Abstract: The present invention relates to a board complex having a polylactic acid (PLA) cover. The board complex includes: a cover member having at least one layer containing a PLA resin; and a board formed beneath the cover member, wherein the material for the board is selected from medium-density fiberboard (MDF), plywood, asbestos-free cellulose fiber reinforced cement board, magnesium board, glued laminated timber, high density fiberboard (HDF), particle board, ceramic tile, porcelain tile, ceramic board, and click-fastened board.Type: ApplicationFiled: March 30, 2011Publication date: January 3, 2013Applicant: LG HAUSYS, LTD.Inventors: Hyun-Jong Kwon, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee, Cheng Zhe Huang
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Publication number: 20120231256Abstract: Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.Type: ApplicationFiled: March 7, 2011Publication date: September 13, 2012Applicant: LG HAUSYS, LTD.Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
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Publication number: 20110217523Abstract: The present invention relates to wallpaper and a method for manufacturing the same. The wallpaper may be manufactured at low energy and low costs regardless of an increase in oil price and does not produce greenhouse gases and hazardous substances in the course of manufacture, use or disposal, or during fire. In addition, the wallpaper can decompose readily in the natural environment, even when buried.Type: ApplicationFiled: October 27, 2009Publication date: September 8, 2011Applicant: LG HAUSYS, LTD.Inventors: Cheng Zhe Huang, Si Young Lee, Phan Seok Kim