Abstract: An autonomous cleaning device and a noise reduction air duct device are provided for autonomous cleaning device. The autonomous cleaning device includes a body and a motor arranged on the body, and the noise reduction air duct device is mounted on the body. The noise reduction air duct device includes an upper housing, a lower housing and a support noise reduction structure made of elastic material. The lower housing and the upper housing enclose to form an air duct, an air inlet is arranged at a position of the air duct corresponding to the motor, and an air outlet is arranged on a side of the air duct away from the air inlet; the support noise reduction structure has a first end fixed on the lower housing, and a second end abutting against a lower surface of the upper housing.

Abstract: A touch circuit includes: a touch IC; a first pull-up sub-circuit; a second pull-up sub-circuit; a first switching sub-circuit configured to transmit a signal from a data signal input terminal to a data signal port under control of a signal from a first signal input terminal; and a second switching sub-circuit configured to transmit a signal from a clock signal input terminal to a clock signal port under control of the signal from the first signal input terminal. The signal from the data signal input terminal is transmitted to the first switching sub-circuit earlier than the signal from the first signal input terminal, and the signal from the clock signal input terminal is transmitted to the second switching sub-circuit earlier than the signal from the first signal input terminal.

Abstract: An optical-fiber-acceleration-sensor probe is provided, which includes a probe shell having a threaded hole at a bottom thereof and an optical-fiber entry and exit hole on a side thereof; a double-end stud in the probe shell, an end of the double-end stud being connected to the threaded hole; a high damping elastomer sleeved on the double-end stud; a mass block sleeved on the double-end stud and located on the high damping elastomer; an optical fiber interferometer located in the mass block and including a sensing arm and a reference arm, where the sensing arm is wound around the high damping elastomer, and the reference arm is wound around the mass block; high damping vibration absorbers on the mass block; and a nut located at another end of the double-end stud, and on the high damping vibration absorbers, where a washer is between the nut and the high damping vibration absorbers.

Abstract: A touch circuit includes: a touch IC; a first pull-up sub-circuit; a second pull-up sub-circuit; a first switching sub-circuit configured to transmit a signal from a data signal input terminal to a data signal port under control of a signal from a first signal input terminal; and a second switching sub-circuit configured to transmit a signal from a clock signal input terminal to a clock signal port under control of the signal from the first signal input terminal. The signal from the data signal input terminal is transmitted to the first switching sub-circuit earlier than the signal from the first signal input terminal, and the signal from the clock signal input terminal is transmitted to the second switching sub-circuit earlier than the signal from the first signal input terminal.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate, a semiconductor device, an interconnect structure, a capacitor, and a plurality of pads. The semiconductor device is disposed at the substrate. The interconnect structure is disposed on the substrate and electrically connected to the semiconductor device. The capacitor is disposed on the interconnect structure and electrically connected to the interconnect structure. The capacitor includes a first electrode, a second electrode covering a top surface and a sidewall of the first electrode, and an insulating layer disposed between the first electrode and the second electrode. The plurality of pads are disposed on the interconnect structure and electrically connected to the interconnect structure, wherein at least one of the plurality of pads is electrically connected to the capacitor.

Abstract: A touch circuit includes a touch IC and a logic sub-circuit. The touch IC includes a touch signal port. The logic sub-circuit is connected to the touch signal port, and is configured to transmit a touch enabling signal to the touch signal port. The logic sub-circuit includes an AND gate. The AND gate includes a first input terminal, a second input terminal and an output terminal electrically connected to the touch signal port. The AND gate is configured to output the touch enabling signal through the output terminal electrically connected to the touch signal port in response to receiving one of a backlight turn-on signal and a screen turn-on signal through the first input terminal, and a touch generation signal through the second input terminal.

Abstract: The present disclosure provides a method for driving a display panel, a display module and a display device. The display panel includes a touch electrode. The method includes: in a touch stage, providing a touch signal to the touch electrode. The touch stage includes: a first touch sub-stage and a second touch sub-stage spaced from each other; the touch signal includes: an uplink signal and a touch driving signal, and an active level of the uplink signal is higher than an active level of the touch driving signal. In the first touch sub-stage, the uplink signal is provided to the touch electrode; and in the second touch sub-stage, the touch driving signal is provided to the touch electrode.

Abstract: The present disclosure provides a method for driving a display panel, a display module and a display device. The display panel includes a touch electrode. The method includes: in a touch stage, providing a touch signal to the touch electrode. The touch stage includes: a first touch sub-stage and a second touch sub-stage spaced from each other; the touch signal includes: an uplink signal and a touch driving signal, and an active level of the uplink signal is higher than an active level of the touch driving signal. In the first touch sub-stage, the uplink signal is provided to the touch electrode; and in the second touch sub-stage, the touch driving signal is provided to the touch electrode.

Abstract: An optical-fiber-acceleration-sensor probe is provided, which includes a probe shell having a threaded hole at a bottom thereof and an optical-fiber entry and exit hole on a side thereof; a double-end stud in the probe shell, an end of the double-end stud being connected to the threaded hole; a high damping elastomer sleeved on the double-end stud; a mass block sleeved on the double-end stud and located on the high damping elastomer; an optical fiber interferometer located in the mass block and including a sensing arm and a reference arm, where the sensing arm is wound around the high damping elastomer, and the reference arm is wound around the mass block; high damping vibration absorbers on the mass block; and a nut located at another end of the double-end stud, and on the high damping vibration absorbers, where a washer is between the nut and the high damping vibration absorbers.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate, a semiconductor device, an interconnect structure, a capacitor, and a plurality of pads. The semiconductor device is disposed at the substrate. The interconnect structure is disposed on the substrate and electrically connected to the semiconductor device. The capacitor is disposed on the interconnect structure and electrically connected to the interconnect structure. The capacitor includes a first electrode, a second electrode covering a top surface and a sidewall of the first electrode, and an insulating layer disposed between the first electrode and the second electrode. The plurality of pads are disposed on the interconnect structure and electrically connected to the interconnect structure, wherein at least one of the plurality of pads is electrically connected to the capacitor.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate, a semiconductor device, an interconnect structure, a capacitor, and a plurality of pads. The semiconductor device is disposed at the substrate. The interconnect structure is disposed on the substrate and electrically connected to the semiconductor device. The capacitor is disposed on the interconnect structure and electrically connected to the interconnect structure. The capacitor includes a first electrode, a second electrode covering a top surface and a sidewall of the first electrode, and an insulating layer disposed between the first electrode and the second electrode. The plurality of pads are disposed on the interconnect structure and electrically connected to the interconnect structure, wherein at least one of the plurality of pads is electrically connected to the capacitor.

Abstract: A touch circuit includes a touch IC and a logic sub-circuit. The touch IC includes a touch signal port. The logic sub-circuit is connected to the touch signal port, and is configured to transmit a touch enabling signal to the touch signal port. The logic sub-circuit includes an AND gate. The AND gate includes a first input terminal, a second input terminal and an output terminal electrically connected to the touch signal port. The AND gate is configured to output the touch enabling signal through the output terminal electrically connected to the touch signal port in response to receiving one of a backlight turn-on signal and a screen turn-on signal through the first input terminal, and a touch generation signal through the second input terminal.

Abstract: A touch display panel and a liquid crystal display device are disclosed. The touch display panel comprises: a substrate (1); a Chip-On-Film (COF) (2), one end of the COF (2) being bound on the substrate and the other end of the COF (2) having a first binding pin (21); and a flexible circuit board (3), one end of the flexible circuit board (3) being bound on the substrate (1) and the other end of the flexible circuit board (3) having a second binding pin (31), wherein a width L2 of the second binding pin (31) is greater than a width L1 of the first binding pin (21).

Abstract: A circuit substrate, a display device and a driving method are provided. The circuit substrate includes a base substrate, a gate driving circuit, and at least one signal trace group which are on the base substrate. The signal trace group includes two signal traces, and the two signal traces are electrically connected with the gate driving circuit and are configured to provide clock signals with inverted phases to the gate driving circuit; the two signal traces are respectively in different layers and are insulated from each other; and orthographic projections of the two signal traces on the base substrate at least partially overlap with each other.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate, a semiconductor device, an interconnect structure, a capacitor, and a plurality of pads. The semiconductor device is disposed at the substrate. The interconnect structure is disposed on the substrate and electrically connected to the semiconductor device. The capacitor is disposed on the interconnect structure and electrically connected to the interconnect structure. The capacitor includes a first electrode, a second electrode covering a top surface and a sidewall of the first electrode, and an insulating layer disposed between the first electrode and the second electrode. The plurality of pads are disposed on the interconnect structure and electrically connected to the interconnect structure, wherein at least one of the plurality of pads is electrically connected to the capacitor.

Abstract: A touch circuit includes a first pull-up sub-circuit, a first switching sub-circuit, a second pull-up sub-circuit, a second switching sub-circuit and a touch IC. The touch IC includes a data signal port and a clock signal port. The first pull-up sub-circuit is electrically connected to a first signal input terminal and the data signal port. The first switching sub-circuit is electrically connected to the data signal port, the first signal input terminal and a data signal input terminal. The second pull-up sub-circuit is electrically connected to the first signal input terminal and the clock signal port. The second switching sub-circuit is electrically connected to the clock signal port, the first signal input terminal and a clock signal input terminal.

Abstract: A touch circuit includes a first pull-up sub-circuit, a first switching sub-circuit, a second pull-up sub-circuit, a second switching sub-circuit and a touch IC. The touch IC includes a data signal port and a clock signal port. The first pull-up sub-circuit is electrically connected to a first signal input terminal and the data signal port. The first switching sub-circuit is electrically connected to the data signal port, the first signal input terminal and a data signal input terminal. The second pull-up sub-circuit is electrically connected to the first signal input terminal and the clock signal port. The second switching sub-circuit is electrically connected to the clock signal port, the first signal input terminal and a clock signal input terminal.

Abstract: A method and a device for driving a display panel, and a liquid crystal display device are provided. The method includes: controlling polarities of output voltages of data driving circuits corresponding to at least two adjacent pixels in a row of a pixel array of the display panel to be same. The adjacent pixels comprise a pixel in a bright state and a pixel in a dark state, and an absolute value of the output voltage of the data driving circuit corresponding to the pixel in the bright state is greater than an absolute value of the output voltage of the data driving circuit corresponding to the pixel in the dark state.

Abstract: A display panel includes a first substrate, a second substrate, and a liquid crystal layer. The first substrate includes a first common electrode layer and a pixel electrode layer. The first common electrode layer is configured to receive a first common voltage signal to form a first electric field with the pixel electrode layer. The second substrate is disposed opposite to the first substrate, and includes a second common electrode layer. The second common electrode layer is configured to receive a second common voltage signal to form a second electric field with the pixel electrode layer. The liquid crystal layer is disposed between the first substrate and the second substrate.

Abstract: A touch display panel and a liquid crystal display device are disclosed. The touch display panel comprises: a substrate (1); a Chip-On-Film (COF) (2), one end of the COF (2) being bound on the substrate and the other end of the COF (2) having a first binding pin (21); and a flexible circuit board (3), one end of the flexible circuit board (3) being bound on the substrate (1) and the other end of the flexible circuit board (3) having a second binding pin (31), wherein a width L2 of the second binding pin (31) is greater than a width L1 of the first binding pin (21).