Patents by Inventor Cheng-Bin Liu

Cheng-Bin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20150325762
    Abstract: A package structure and a manufacturing method thereof are disclosed. The package structure includes: a substrate; at least one light emitting diode disposed on the substrate by eutectic bonding; and at least one Zener diode disposed on the substrate by at least one silver glue. The method of manufacturing the package structure includes: providing a substrate; performing a eutectic bonding process to dispose at least one light emitting diode on the substrate; and performing a silver glue bonding process at room temperature to dispose at least one Zener diode on the substrate.
    Type: Application
    Filed: April 23, 2015
    Publication date: November 12, 2015
    Inventors: Shou-Wen Hsu, Yu-Feng Lin, Cheng-Bin Liu, Tai-Cheng Tsai, Chin-Hua Hung