Patents by Inventor Chengbin Qui

Chengbin Qui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS devices having support structures with substantially vertical sidewalls and methods for fabricating the same
    Patent number: 8298847
    Abstract: Embodiments of MEMS devices include support structures having substantially vertical sidewalls. Certain support structures are formed through deposition of self-planarizing materials or via a plating process. Other support structures are formed via a spacer etch. Other MEMS devices include support structures at least partially underlying a movable layer, where the portions of the support structures underlying the movable layer include a convex sidewall. In further embodiments, a portion of the support structure extends through an aperture in the movable layer and over at least a portion of the movable layer.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: October 30, 2012
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Lior Kogut, Chun-Ming Wang, Chengbin Qui, Stephen Zee, Fan Zhong