Patents by Inventor Cheng-Chen Huang
Cheng-Chen Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240151948Abstract: A photographing optical lens assembly includes, in order from an object side to an image side along an optical axis, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. The third lens element has an object-side surface being convex in a paraxial region thereof.Type: ApplicationFiled: January 17, 2024Publication date: May 9, 2024Inventors: Cheng-Chen LIN, Hsin-Hsuan HUANG, Shu-Yun YANG
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Publication number: 20240152193Abstract: The invention provides a power supply including at least one power output port, at least one status alert component, and at least one output port status monitoring module. The status alert component generates at least one visual prompt based on an alert signal. The output port status monitoring module includes at least one temperature sensor adjacent to the power output port, a microcontroller connected to the temperature sensor and sensing an output current from the power output port, and a reset signal generator connected to the microcontroller. The microcontroller comprises at least one port status alert condition that takes a temperature and the output current of the power output port as decision factors. The microcontroller outputs the alert signal to the status alert component when the port status alert condition is met and maintains the status until a reset signal provided by the reset signal generator is received.Type: ApplicationFiled: November 4, 2022Publication date: May 9, 2024Inventors: Wei-Chen WU, Wen-Hau HU, Hung-Wei YANG, Cheng-Yung LO, Yu-Hao SU, Jian-Zhi HUANG
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Patent number: 11960332Abstract: An electronic device including a hinge module, a first body, a second body, and a flexible display assembled to the first body and the second body is provided. Each of the first body and the second body is pivoted and slidably connected to the hinge module, and a cover of the hinge module is exposed out of the first body and the second body. The first body and the second body are rotated relatively via the hinge module to bend or flatten the flexible display, when the flexible display is bending from a flat state, a bending portion of the flexible display leans against the cover and pushes the cover away from the first body and the second body.Type: GrantFiled: November 30, 2022Date of Patent: April 16, 2024Assignee: Acer IncorporatedInventors: Yi-Ta Huang, Cheng-Nan Ling, Wu-Chen Lee, Wen-Chieh Tai, Kun-You Chuang
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Publication number: 20240120313Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.Type: ApplicationFiled: December 18, 2023Publication date: April 11, 2024Inventors: Sheng-Yao YANG, Ling-Wei LI, Yu-Jui WU, Cheng-Lin HUANG, Chien-Chen LI, Lieh-Chuan CHEN, Che-Jung CHU, Kuo-Chio LIU
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Publication number: 20240098721Abstract: Methods, apparatuses, and computer readable media for communicating elements between multi-link devices are disclosed. Apparatuses of a first access points (AP) of an AP multi-link device (MLD) are disclosed, where the apparatuses comprise processing circuitry configured to encode a first portion of a first beacon frame or first response frame, and in response to a second AP of the AP MLD transmitting, on a second frequency band, a second beacon frame or a second probe response frame comprising a channel switch announcement element or an enhanced channel switch announcement frame, encoding a second portion of the first beacon frame or the first probe response frame, the second portion comprising the channel switch announcement element or the enhanced channel switch announcement frame. The processing circuitry is further configured to configure the first AP of the AP MLD to transmit, on a first frequency band, the first beacon frame.Type: ApplicationFiled: November 20, 2023Publication date: March 21, 2024Inventors: Laurent Cariou, Daniel F. Bravo, Cheng Chen, Chittabrata Ghosh, Po-Kai Huang, Ido Ouzieli
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Patent number: 11929041Abstract: A display apparatus includes a backlight module with backlight zones, a panel over the backlight module, and a circuit configured to generate compensated pixel data for the panel based on image data and an arrangement of the zones of the backlight module, in which the image data has image areas respectively corresponding to the backlight zones. For a first image area being a low-luminance image area and a luminance intensity of a first zone of the zones corresponding to the first image area being less than a luminance intensity of a second zone corresponding to a second image area neighboring the first image area, the circuit performs first pixel compensation for high-luminance pixels in the second image area and second pixel compensation on low-luminance pixels in the second image area, in which the second pixel compensation is greater than the first pixel compensation.Type: GrantFiled: November 29, 2022Date of Patent: March 12, 2024Assignee: HIMAX TECHNOLOGIES LIMITEDInventors: Chao Chen Huang, Tsai Hsing Chen, Cheng Che Tsai, Ching-Wen Wang
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Publication number: 20240079230Abstract: A plasma-assisted annealing system includes a high temperature furnace, a plasma-induced dissociator and a connecting duct. The plasma-induced dissociator is provided to dissociate a working gas and exhaust the dissociated working gas from its working gas outlet. Both ends of the connecting duct are connected to the working gas outlet of the plasma-induced dissociator and a gas inlet of the high temperature furnace, respectively. The working gas dissociated in the plasma-induced dissociator is introduced into the high temperature furnace via the connecting duct.Type: ApplicationFiled: December 12, 2022Publication date: March 7, 2024Inventors: Wei-Chen Tien, Cheng-Yuan Hung, Chang-Sin Ye, Chun-Kai Huang, Yii-Der Wu
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Patent number: 11924995Abstract: A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.Type: GrantFiled: April 23, 2021Date of Patent: March 5, 2024Inventors: Chi-Chuan Wang, Cheng-Chen Cheng, Chuan-Chan Huang, Jen-Chieh Huang
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Publication number: 20240069660Abstract: An electronic device and a forming method thereof are provided. The electronic device includes a substrate, a metal layer, a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer. The metal layer is disposed on the substrate and includes a sensing line and a drain electrode. The first insulating layer is disposed on the metal layer. The first conductive layer is disposed on the first insulating layer and includes a touch electrode. The second insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the second insulating layer and includes a conductive pattern. The conductive pattern is electrically connected to the sensing line and the touch electrode.Type: ApplicationFiled: July 18, 2023Publication date: February 29, 2024Inventors: Kuei-Chen CHIU, Yu-Ti HUANG, Cheng-Tso CHEN, Li-Wei SUNG
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Patent number: 11914106Abstract: A photographing optical lens assembly includes, in order from an object side to an image side along an optical axis, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. The third lens element has an object-side surface being convex in a paraxial region thereof.Type: GrantFiled: September 3, 2020Date of Patent: February 27, 2024Assignee: LARGAN PRECISION CO., LTD.Inventors: Cheng-Chen Lin, Hsin-Hsuan Huang, Shu-Yun Yang
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Patent number: 11915957Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.Type: GrantFiled: January 7, 2022Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hung Huang, Cheng-Lung Wu, Yi-Fam Shiu, Yu-Chen Chen, Yang-Ann Chu, Jiun-Rong Pai
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Publication number: 20230237240Abstract: An optimizing method, device and non-transient computer readable medium for an integrated circuit layout are provided. The method includes: identifying power rails and corresponding power supply domains in an integrated circuit design file; performing design rule check for circuit units in the integrated circuit design file to calculate a plurality of usable regions; determining electromigration violation points corresponding to the power rails and related current information; defining, according to the electromigration violation points and the current information, paths to be corrected on the power rails corresponding to the electromigration violation points; replacing types of vias on the power rails that do not overlap with the paths to be corrected; and correcting a number of the vias on the power rails that overlap with the paths to be corrected to reduce a number of the electromigration violation points.Type: ApplicationFiled: August 3, 2022Publication date: July 27, 2023Inventors: CHENG-CHEN HUANG, CHUN-CHUAN KUO
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Publication number: 20220278033Abstract: A package substrate and a chip package structure using the same are provided. The package substrate includes a laminated board including first to third wiring layers, a pad array, a plurality of ground conductive structures, and a plurality of power conductive structures. At least one of the ground (or power) conductive structures includes two first ground (or power) conductive posts and a second ground (or power) conductive post. The two first ground (or power) conductive posts and the second ground (or power) conductive post are arranged along a first direction, and the second ground (or power) conductive post is located between two orthographic projections of the two first ground (or power) conductive posts. Each of the ground conductive structures in a first column and each of the power conductive structures in a second column are offset from each other in a second direction.Type: ApplicationFiled: February 24, 2022Publication date: September 1, 2022Inventors: HAN-CHIEH HSIEH, CHAO-MIN LAI, CHENG-CHEN HUANG, NAN-CHIN CHUANG
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Patent number: 11416665Abstract: A power rail design method is disclosed that includes the steps outlined below. A plurality of power rails and a plurality of power domains corresponding thereto in an integrated circuit design file are identified. A design rule check for a plurality of circuit units in the integrated circuit design file is performed to retrieve a plurality of non-violating circuit regions that correspond to the power rails in each of the power domains. The power rails corresponding to at least part of the plurality of non-violating circuit regions in the integrated circuit design file are widened to occupy at least part of the non-violating circuit regions for the plurality of power rails.Type: GrantFiled: October 22, 2020Date of Patent: August 16, 2022Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Cheng-Chen Huang, Yun-Ru Wu, Hsin-Chang Lin, Shu-Yi Kao, Chih-Chan Chen, Chia-Jung Hsu, Li-Yi Lin
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Publication number: 20210124864Abstract: A power rail design method is disclosed that includes the steps outlined below. A plurality of power rails and a plurality of power domains corresponding thereto in an integrated circuit design file are identified. A design rule check for a plurality of circuit units in the integrated circuit design file is performed to retrieve a plurality of non-violating circuit regions that correspond to the power rails in each of the power domains. The power rails corresponding to at least part of the plurality of non-violating circuit regions in the integrated circuit design file are widened to occupy at least part of the non-violating circuit regions for the plurality of power rails.Type: ApplicationFiled: October 22, 2020Publication date: April 29, 2021Inventors: Cheng-Chen HUANG, Yun-Ru WU, Hsin-Chang LIN, Shu-Yi KAO, Chih-Chan CHEN, Chia-Jung HSU, Li-Yi LIN
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Patent number: 10550095Abstract: The present invention provides a compound of Formula I, II or III or a salt or prodrug or derivative thereof that is useful for skin-whitening by inhibiting melanin formation and removing existing melanin and the inhibition of melanoma growth and/or the removal of existing melanoma cells.Type: GrantFiled: April 7, 2017Date of Patent: February 4, 2020Assignee: WISYS TECHNOLOGY FOUNDATION, INC.Inventors: Cheng-Chen Huang, Aaron P. Monte
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Patent number: 10112881Abstract: The present invention provides a compound of Formula I, wherein R1 is not H when R2 is H and R2 is not H when R1 is H, further wherein R1 is CnH(2n+1)O, wherein n is 1-10, R2 is OH or CnH(2n+1)O, wherein n is 1-10, A, B and R1, R2, R5, R6, and R7 are separately and independently selected from a group consisting of H, alkyl, hydroxyl, halo, nitro and aryl groups, R11 is an alkyl or an aryl group and L is an optional linker or linking group, with x=0 or 1, i.e., if x=0, no linking group is present, or a salt or prodrug or derivative thereof that is a skin-lightening agent useful for the inhibition of melanin synthesis and/or the removal of existing melanin to function as a skin-lightening agent.Type: GrantFiled: July 21, 2015Date of Patent: October 30, 2018Assignee: WISYS TECHNOLOGY FOUNDATION, INC.Inventors: Cheng-Chen Huang, Aaron P. Monte
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Publication number: 20170342047Abstract: The present invention provides a compound of Formula I, II or III or a salt or prodrug or derivative thereof that is useful for skin-whitening by inhibiting melanin formation and removing existing melanin and the inhibition of melanoma growth and/or the removal of existing melanoma cells.Type: ApplicationFiled: April 7, 2017Publication date: November 30, 2017Inventors: Cheng-Chen Huang, Aaron P. Monte
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Publication number: 20170197897Abstract: The present invention provides a compound of Formula I, II or III or a salt or prodrug derivative thereof that is a skin-lightening agent useful for the inhibition of melanin synthesis and/or the removal of existing melanin to function as a skin-lightening agent.Type: ApplicationFiled: July 21, 2015Publication date: July 13, 2017Inventors: Cheng-Chen Huang, Aaron P. Monte