Patents by Inventor Chengcheng Hou
Chengcheng Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120635Abstract: Active antenna units and/or base station antennas are provided that include a reflector body with heat dissipation structures that can be directly exposed to environmental conditions during use. The heat dissipation structures have frequency selective surfaces and can be formed of sheet metal or provided as separate extruded or die cast members that can be coupled to the reflector body.Type: ApplicationFiled: October 5, 2023Publication date: April 11, 2024Inventors: Chengcheng Tang, Joy Huang, Bo Wu, Samantha Merta, Haifeng Li, XiaoHua Hou
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Patent number: 11221713Abstract: The present disclosure relates to an ultrasonic touch device and a method. The ultrasonic touch device is disposed at a periphery of a display area of an electronic equipment. The ultrasonic touch device includes an ultrasonic ranging module. The ultrasonic ranging module includes a plurality of ultrasonic ranging units detected. The ultrasonic touch device includes a first position determining unit configured to determine a distance between a touch object and the ultrasonic ranging module, and determine a position of the touch object in a first coordinate direction of the display area according to the distance. The ultrasonic touch device includes a second position determining unit configured to determine a position of the touch object in a second coordinate direction of the display area according to a position of an ultrasonic ranging unit that receives the reflected ultrasonic waves in the ultrasonic ranging module.Type: GrantFiled: February 7, 2018Date of Patent: January 11, 2022Assignees: BOE Technology Group Co., Ltd., Hefei BOE Optoelectronics Technology Co., Ltd.Inventors: Yansheng Hu, Jin Sha, Zhaobo Jiang, Chengcheng Hou, Guanglei Yang
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Publication number: 20210117022Abstract: The present disclosure relates to an ultrasonic touch device and a method. The ultrasonic touch device is disposed at a periphery of a display area of an electronic equipment. The ultrasonic touch device includes an ultrasonic ranging module. The ultrasonic ranging module includes a plurality of ultrasonic ranging units detected. The ultrasonic touch device includes a first position determining unit configured to determine a distance between a touch object and the ultrasonic ranging module, and determine a position of the touch object in a first coordinate direction of the display area according to the distance. The ultrasonic touch device includes a second position determining unit configured to determine a position of the touch object in a second coordinate direction of the display area according to a position of an ultrasonic ranging unit that receives the reflected ultrasonic waves in the ultrasonic ranging module.Type: ApplicationFiled: February 7, 2018Publication date: April 22, 2021Inventors: Yansheng Hu, Jin Sha, Zhaobo Jiang, Chengcheng Hou, Guanglei Yang
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Patent number: 10571512Abstract: A test device for a printed circuit board assembly is disclosed. The test device includes a test platform for securing a printed circuit board assembly to be tested and a positioning platform located above the test platform and for securing a plurality of test probes. The plurality of test probes are secured at the bottom of the positioning platform and the secured positions in the positioning platform thereof are adjustable to align the test points on the printed circuit board assembly to be tested.Type: GrantFiled: October 19, 2016Date of Patent: February 25, 2020Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Yueyuan Zhang, Shancai Zhang, Yifei Zhan, Chengcheng Hou, Kun Li, Guanglei Yang, Zhaobo Jiang, Dayu Zhang
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Patent number: 10399319Abstract: A device for attachment of double-sided adhesive and a method for attachment of the double-sided adhesive are provided. The device includes a driver, a platform and a robot arm provided above the platform. The robot arm is connected with the driver and configured to, under the driving of the driver, place the double-sided adhesive onto a preset position of the platform, strip off the first protective film of the double-sided adhesive at the preset position, press the printed circuit board assembly (PCBA) at the preset position against the double-sided adhesive without the first protective film, and unload the PCBA attached with the double-sided adhesive from the preset position. A positioning structure is provided at the preset position and configured to secure the adhesive layer and the second protective film when the robot arm strips off the first protective film, and release the securing of the adhesive layer and the second protective film when the double-sided adhesive is attached to the PCBA.Type: GrantFiled: January 28, 2016Date of Patent: September 3, 2019Assignees: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectronics Technology Co., Ltd.Inventors: Shancai Zhang, Chengcheng Hou, Yueyuan Zhang, Hengbin Li, Ming Hu
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Patent number: 10209272Abstract: A testing device is disclosed. The testing device includes: a testing platform; an electromagnetic relay platform arranged opposite to the testing platform; and a plurality of probe assemblies disposed between the electromagnetic relay platform and the testing platform. Each of the probe assemblies includes an electromagnetic base and a probe mounted in a side of the electromagnetic base away from the electromagnetic relay platform. Each of the electromagnetic bases is attracted together with the electromagnetic relay platform under an electromagnetic attraction force when the electromagnetic relay platform is energized. The above testing device may be used for testing a variety of circuit boards, and has a relatively wide application.Type: GrantFiled: August 10, 2016Date of Patent: February 19, 2019Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Kun Li, Chengcheng Hou, Shancai Zhang, Yueyuan Zhang
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Publication number: 20180106855Abstract: A test device for a printed circuit board assembly is disclosed. The test device includes a test platform for securing a printed circuit board assembly to be tested and a positioning platform located above the test platform and for securing a plurality of test probes. The plurality of test probes are secured at the bottom of the positioning platform and the secured positions in the positioning platform thereof are adjustable to align the test points on the printed circuit board assembly to be tested.Type: ApplicationFiled: October 19, 2016Publication date: April 19, 2018Inventors: Yueyuan ZHANG, Shancai ZHANG, Yifei ZHAN, Chengcheng HOU, Kun LI, Guanglei YANG, Zhaobo JIANG, Dayu ZHANG
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Publication number: 20170259548Abstract: A device for attachment of double-sided adhesive and a method for attachment of the double-sided adhesive are provided. The device includes a driver, a platform and a robot arm provided above the platform. The robot arm is connected with the driver and configured to, under the driving of the driver, place the double-sided adhesive onto a preset position of the platform, strip off the first protective film of the double-sided adhesive at the preset position, press the printed circuit board assembly (PCBA) at the preset position against the double-sided adhesive without the first protective film, and unload the PCBA attached with the double-sided adhesive from the preset position. A positioning structure is provided at the preset position and configured to secure the adhesive layer and the second protective film when the robot arm strips off the first protective film, and release the securing of the adhesive layer and the second protective film when the double-sided adhesive is attached to the PCBA.Type: ApplicationFiled: January 28, 2016Publication date: September 14, 2017Applicants: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectronics Technology Co. Ltd.Inventors: Shancai Zhang, Chengcheng Hou, Yueyuan Zhang, Hengbin Li, Ming Hu
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Publication number: 20170192035Abstract: A testing device is disclosed. The testing device includes: a testing platform; an electromagnetic relay platform arranged opposite to the testing platform; and a plurality of probe assemblies disposed between the electromagnetic relay platform and the testing platform. Each of the probe assemblies includes an electromagnetic base and a probe mounted in a side of the electromagnetic base away from the electromagnetic relay platform. Each of the electromagnetic bases is attracted together with the electromagnetic relay platform under an electromagnetic attraction force when the electromagnetic relay platform is energized. The above testing device may be used for testing a variety of circuit boards, and has a relatively wide application.Type: ApplicationFiled: August 10, 2016Publication date: July 6, 2017Inventors: Kun Li, Chengcheng Hou, Shancai Zhang, Yueyuan Zhang