Abstract: A heatsink and a heatsink-positioning system. The heatsink-positioning system includes a heatsink and a positioning device. The heatsink includes a circular top, a ring-shaped sidewall and a plurality of foot portions. The ring-shaped sidewall connects to the circular top and extends away from the circular top. The ring-shaped sidewall has at least one first positioning portion used for fixing the heatsink. The foot portions connect to the ring-shaped sidewall and extend away from the ring-shaped sidewall. Each foot portion has an opening. The positioning device has at least one second positioning portion corresponding to the first positioning portion and is used for fixing the first positioning portion. By utilizing the heatsink-positioning system, the problem of displacement of the heatsink can be improved.

Abstract: A heat slug is provided for a package structure, including a main body and a plurality of protrusions. The main body has a surface in which at least one ditch is defined. Each protrusion is connected to and extends from the main body and has a surface in which a plurality of dimples is defined.

Abstract: A heat slug is provided for a package structure, including a main body and a plurality of protrusions. The main body has a surface in which at least one ditch is defined. Each protrusion is connected to and extends from the main body and has a surface in which a plurality of dimples is defined.

Abstract: The present invention relates to a heatsink and a heatsink-positioning system. The heatsink-positioning system comprises a heatsink and a positioning device. The heatsink comprises a circular top, a ring-shaped sidewall and a plurality of foot portions. The ring-shaped sidewall connects to the circular top and extends away from the circular top. The ring-shaped sidewall has at least one first positioning portion used for fixing the heatsink. The foot portions connect to the ring-shaped sidewall and extend away from the ring-shaped sidewall. Each foot portion has an opening. The positioning device has at least one second positioning portion corresponding to the first positioning portion and is used for fixing the first positioning portion. By utilizing the heatsink-positioning system of the invention, the problem of displacement of the heatsink can be improved.

Abstract: A multi-chip package combining wire-bonding and flip-chip configuration includes a plurality of chips, a substrate and a molding compound. Chip(s) with wire-bonding type and a flip-chip type electrical device are mounted on an upper surface of the substrate. A plurality of contact pads of the substrate are formed on the upper surface of the substrate that are not covered by the molding compound, so the flip-chip type electrical device can be electrically connected to these contact pads. The molding compound has recession(s) from a molding tool and seals the chip(s) with wire-bonding type without damaging the contact pads during molding process.

Abstract: The present invention relates to a BGA package having a substrate with an exhaust hole. The BGA package comprises the substrate, a chip and a molding compound. The substrate comprises a plurality of plated through holes electrically connecting an upper surface and a lower surface of the substrate. At least one of the plated through holes located at a predetermined location of the substrate is selected to be formed as an exhaust hole. The exhaust hole passes through the upper surface and the lower surface. When the molding compound is formed to seal the chip, the air inside a mold cavity can be exhausted through the exhaust hole in the selected plated through hole.

Abstract: An impedance matching circuit for providing a lossless target signal transmission and rejecting image signals of heterodyne and super-heterodyne transceiver. The impedance matching circuit includes a grounded metal membrane, a first microstrip line connected with an input circuit, a second microstrip line connected with an output circuit, and a third microstrip line connected with either the first microstrip line or the second microstrip line. The first microstrip line is not connected with the second microstrip line, and the length of the third microstrip line is equal to a quarter wavelength of an image signal. When the target signal and the image signal transmit to the impedance matching circuit, the image signal will bypass to a grounded metal membrane, and the target signal will transmit to the output circuit without signal decay through electromagnetic coupling of the first microstrip line and the second microstrip line.

Abstract: A multi-chip package combining wire-bonding and flip-chip configuration includes a plurality of chips, a substrate and a molding compound. Chip(s) with wire-bonding type and a flip-chip type electrical device are mounted on an upper surface of the substrate. A plurality of contact pads of the substrate are formed on the upper surface of the substrate that are not covered by the molding compound, so the flip-chip type electrical device can be electrically connected to these contact pads. The molding compound has recession(s) from a molding tool and seals the chip(s) with wire-bonding type without damaging the contact pads during molding process.

Abstract: An impedance matching circuit for providing a lossless target signal transmission and rejecting image signals of heterodyne and super-heterodyne transceiver. The impedance matching circuit includes a grounded metal membrane, a first microstrip line connected with an input circuit, a second microstrip line connected with an output circuit, and a third microstrip line connected with either the first microstrip line or the second microstrip line. The first microstrip line is not connected with the second microstrip line, and the length of the third microstrip line is equal to a quarter wavelength of an image signal. When the target signal and the image signal transmit to the impedance matching circuit, the image signal will bypass to a grounded metal membrane, and the target signal will transmit to the output circuit without signal decay through electromagnetic coupling of the first microstrip line and the second microstrip line.