Abstract: The present disclosure discloses a heating apparatus for a semiconductor device. The heating apparatus includes a carrier including a first abutting part, a heat collecting plate at least including a working surface, and a heat radiation source disposed on a side of the heat collecting plate opposite to the working surface and separated from the heat collecting plate by a predetermined distance. The heat collecting plate is disposed on the carrier, and the first abutting part abuts against an edge of the heat collecting plate on the side opposite to the working surface. The heat radiation source is and configured to emit heat radiation during working and to heat the heat collecting plate in a non-contact manner. The heat collecting plate receives the heat radiation and the emitted heat and heats a heated object disposed on the working surface in a contact manner.

Abstract: A method for preparing a coplanar waveguide structure includes acquiring a structure to be etched, the structure to be etched including an aluminum film provided on a substrate structure and a photoresist structure provided at an upper end of the aluminum film, wherein the photoresist structure is configured to cover partial areas of the aluminum film; performing a first etching operation on the aluminum film provided on the substrate structure by using an acidic solution to obtain a first etched structure; rinsing the first etched structure to obtain an intermediate structure; performing a second etching operation on the intermediate structure by using an alkaline solution to obtain a second etched structure; and rinsing the second etched structure to obtain a target structure for generating a coplanar waveguide structure, the target structure including the aluminum film and the photoresist structure, wherein the photoresist structure covers all areas of the aluminum film.

Abstract: Spherical boron nitride nanoparticles having an average particle diameter of less than 50 nm is obtained by a method of synthesizing spherical boron nitride nanoparticles including the following steps; heating a mixture of boric acid ester and nitrogen gas in ammonia gas and argon gas to form reaction product; crystallizing reaction product to form precursor of spherical boron nitride nanoparticles; and, heating the precursor in inert gas.

Abstract: A boron nitride fiber paper having a very small fiber diameter and exhibiting excellent heat resistance, mechanical properties and heat conductivity. The fiber paper is composed of a fiber assembly which contains boron nitride fibers having a fiber diameter of not more than 1 ?m in an amount of not less than 40 wt %.

Abstract: A boron nitride nanosheet containing three-layered hexagonal boron nitride, which is in a form of multi-layered hexagonal boron nitride with some its layers peeled, can be produced by dispersing pristine hexagonal boron nitride powder in an organic solvent and by subjecting the fluid dispersion to ultrasonication.

Abstract: Spherical boron nitride nanoparticles having an average particle diameter is less than 50 nm is obtained by a method of synthesizing spherical boron nitride nanoparticles including the following steps; heating a mixture of boric acid ester and nitrogen gas in ammonia gas and argon gas to form reaction product; crystallizing reaction product to form precursor of spherical boron nitride nanoparticles; and, heating the precursor in inert gas.

Abstract: A boron nitride fiber paper having a very small fiber diameter and exhibiting excellent heat resistance, mechanical properties and heat conductivity. The fiber paper is composed of a fiber assembly which contains boron nitride fibers having a fiber diameter of not more than 1 ?m in an amount of not less than 40 wt %.

Abstract: The object of this invention is to provide a polyamide resin composition excellent in insulating properties, mechanical properties and dimensional stability. This invention is a resin composition containing 100 parts by weight of a polyamide resin and 0.01 to 50 parts by weight of boron nitride nanotubes. The invention also includes a formed article from the resin composition and processes for the production of the resin composition and the formed article.