Patents by Inventor Chengder Huang

Chengder Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6400005
    Abstract: A new method is provided for the creation of a pre-molded chip carrier. The invention teaches putting magnetic inserts into the upper mold. The magnetic inserts attract the lead fingers that are inserted into the upper mold during the process of filling the cavity with a compound pressing the lead fingers tightly against the surface of the magnet. The possibility of mold compound spilling over the lead fingers and forming resin depositions on the surface of the lead fingers is thereby voided.
    Type: Grant
    Filed: September 5, 2000
    Date of Patent: June 4, 2002
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Daniel Chang, Chengder Huang, Pei-Haw Tsao
  • Patent number: 6146924
    Abstract: A new method is provided for the creation of a pre-molded chip carrier. The invention teaches putting magnetic inserts into the upper mold. The magnetic inserts attract the lead fingers that are inserted into the upper mold during the process of filling the cavity with a compound pressing the lead fingers tightly against the surface of the magnet. The possibility of mold compound spilling over the lead fingers and forming resin depositions on the surface of the lead fingers is thereby voided.
    Type: Grant
    Filed: August 6, 1999
    Date of Patent: November 14, 2000
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Daniel Chang, Chengder Huang, Pei-Haw Tsao