Patents by Inventor Chengfa YANG

Chengfa YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912291
    Abstract: Embodiments of the present disclosure relate to an autonomous vehicle and a system for the autonomous vehicle. The system may include: a power supply including a first power output and a second power output; a master computing unit arranged to be powered by the first power output, configured to control operations of the autonomous vehicle in response to detecting the second power output, and configured to provide a third power output by adjusting the first power output; and a slave computing unit arranged to be powered by the second power output, and configured to control the operations of the autonomous vehicle in response to detecting a failure of the master computing unit.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: February 27, 2024
    Assignee: APOLLO INTELLIGENT DRIVING TECHNOLOGY (BEIJING) CO., LTD.
    Inventors: Lijun Ju, Chengfa Wang, Junping Wang, Fan Yang
  • Patent number: 11746406
    Abstract: A mask, and a preparation method and an operation method thereof are disclosed. The mask includes: a support and a mask strip mounted on the support, the mask strip including at least two connecting portions connected with the support, and a pattern portion located between the connecting portions, the pattern portion including a first outer surface, and the connecting portion including a second outer surface; wherein the second outer surface and the first outer surface are non-coplanar with each other.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: September 5, 2023
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
    Inventors: Chengfa Yang, Zhiming Lin
  • Patent number: 11250185
    Abstract: A method for calculating equivalent mechanical parameters of a film layer etching region is provided, by which more accurate equivalent mechanical parameters, which will be used in a process of manufacturing a display substrate of a terminal, may be obtained, thereby obtaining a display substrate with less defects. The method includes: selecting at least a part of the film layer etching region as an analysis region; establishing a planar model corresponding to the analysis region; performing grid division on the planar model at a first density; analyzing, by means of a finite element method, first simulation stresses of the planar model in simulated boundary conditions according to the actual mechanical parameters of a film layer material and the grid division of the first density; and calculating equivalent mechanical parameters.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: February 15, 2022
    Assignees: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Chunchieh Huang, Qi Wang, Jian Zhang, Shouhua Lv, Chengfa Yang, Meng Zhou
  • Publication number: 20210172047
    Abstract: A mask, and a preparation method and an operation method thereof are disclosed. The mask includes: a support and a mask strip mounted on the support, the mask strip including at least two connecting portions connected with the support, and a pattern portion located between the connecting portions, the pattern portion including a first outer surface, and the connecting portion including a second outer surface; wherein the second outer surface and the first outer surface are non-coplanar with each other.
    Type: Application
    Filed: December 18, 2017
    Publication date: June 10, 2021
    Inventors: Chengfa YANG, Zhiming LIN
  • Publication number: 20190370423
    Abstract: A method for calculating equivalent mechanical parameters of a film layer etching region is provided, by which more accurate equivalent mechanical parameters, which will be used in a process of manufacturing a display substrate of a terminal, may be obtained, thereby obtaining a display substrate with less defects. The method includes: selecting at least a part of the film layer etching region as an analysis region; establishing a planar model corresponding to the analysis region; performing grid division on the planar model at a first density; analyzing, by means of a finite element method, first simulation stresses of the planar model in simulated boundary conditions according to the actual mechanical parameters of a film layer material and the grid division of the first density; and calculating equivalent mechanical parameters.
    Type: Application
    Filed: September 25, 2018
    Publication date: December 5, 2019
    Inventors: Chunchieh HUANG, Qi WANG, Jian ZHANG, Shouhua LV, Chengfa YANG, Meng ZHOU