Patents by Inventor Chenggang Tang

Chenggang Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7920389
    Abstract: An RF blind-mate connection device disclosed herein includes a duplexer, a power amplification circuit board, a transceiver, an RF signal connector, and a power connector. The duplexer and the transceiver are located at one end of the RF blind-mate connection device, and the transceiver is fixed on the duplexer; the power amplification circuit board is located at the other end of the RF blind-mate connection device, and the location of the power amplification circuit board corresponds to that of the duplexer; the RF signal connector is fixed on the duplexer and the power amplification circuit board; the power connector is fixed on the transceiver and the power amplification circuit board; and the RF signal connector and the power connector transmit both the power signal and the RF signal in a blind-mate way. A board hardware device is disclosed herein to transmit RF signals and power signals inside the RF module through the connector.
    Type: Grant
    Filed: December 3, 2009
    Date of Patent: April 5, 2011
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Chenggang Tang, Hao Li, Haitao Li, Xiaohui Shen
  • Publication number: 20100073896
    Abstract: An RF blind-mate connection device disclosed herein includes a duplexer, a power amplification circuit board, a transceiver, an RF signal connector, and a power connector. The duplexer and the transceiver are located at one end of the RF blind-mate connection device, and the transceiver is fixed on the duplexer; the power amplification circuit board is located at the other end of the RF blind-mate connection device, and the location of the power amplification circuit board corresponds to that of the duplexer; the RF signal connector is fixed on the duplexer and the power amplification circuit board; the power connector is fixed on the transceiver and the power amplification circuit board; and the RF signal connector and the power connector transmit both the power signal and the RF signal in a blind-mate way. A board hardware device is disclosed herein to transmit RF signals and power signals inside the RF module through the connector.
    Type: Application
    Filed: December 3, 2009
    Publication date: March 25, 2010
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chenggang TANG, Hao LI, Haitao LI, Xiaohui SHEN